公开(公告)号：US20140252578A1

公开(公告)日：2014-09-11

申请号：US13789722

申请日：2013-03-08

Applicant: DELPHI TECHNOLOGIES, INC.

Inventor： CARL W. BERLIN ,  GARY L. EESLEY

IPC: H01L23/495

CPC classification number: H01L23/49575 ,  H01L23/3735 ,  H01L23/49513 ,  H01L23/49531 ,  H01L23/49537 ,  H01L23/49861 ,  H01L23/562 ,  H01L24/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/2732 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/75981 ,  H01L2224/83203 ,  H01L2224/83439 ,  H01L2224/8384 ,  H01L2924/1203 ,  H01L2924/12036 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/3511 ,  Y10T29/4913 ,  Y10T29/49149 ,  Y10T29/49169 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An assembly for packaging one or more electronic devices in die form. The assembly includes substrates on opposite sides of the assembly, with lead frames between the electronic devices and the substrates. The substrates, lead frames, and electronic devices are sintered together using silver-based sintering paste between each layer. The material and thicknesses of the substrates and lead frames are selected so stress experienced by the electronic devices caused by changes in temperature of the assembly are balanced from the center of the assembly, thereby eliminating the need for balancing stresses at a substrate level by applying substantially matching metal layers to both sides of the substrates.

Abstract translation: 一种用于以模具形式包装一个或多个电子设备的组件。 组件包括在组件的相对侧上的基板，电子设备和基板之间具有引线框架。 基板，引线框架和电子器件在各层之间使用银基烧结膏烧结在一起。 选择基板和引线框架的材料和厚度，使得由组件的温度变化引起的电子设备经受的应力从组件的中心平衡，从而消除了通过大体上施加基板水平的平衡应力的需要 将金属层与衬底的两侧相匹配。

公开(公告)号：US20140305481A1

公开(公告)日：2014-10-16

申请号：US13925199

申请日：2013-06-24

Applicant: DELPHI TECHNOLOGIES, INC.

Inventor： SCOTT D. BRANDENBURG ,  KHALID M. ELTOM ,  GARY L. EESLEY ,  BRUCE A. MYERS ,  BRUCE MOOR

IPC: H01L35/30

CPC classification number: H01L35/30 ,  F01N5/025 ,  F01N2240/02 ,  Y02T10/16

Abstract: An assembly for coupling thermally a thermoelectric generator (TEG) to an exhaust manifold of an internal combustion engine. The assembly includes a first heat exchanger configured to guide exhaust gas of an internal combustion engine past an opening defined by the first heat exchanger, and a heat sink configured to couple thermally the TEG to the exhaust gas and fluidicly seal the opening. The assembly is configured so the heat sink is directly exposed to the exhaust gas so that heat is efficiently transferred from the exhaust gas to the TEG.

Abstract translation: 一种用于将热电发生器（TEG）热耦合到内燃机的排气歧管的组件。 组件包括：第一热交换器，其被配置为引导内燃机的废气经过由第一热交换器限定的开口;以及散热器，该散热器被配置为将TEG热耦合到废气并且流体地密封该开口。 组件被配置为使得散热器直接暴露于废气，使得热量有效地从排气转移到TEG。

公开(公告)号：US20140305480A1

公开(公告)日：2014-10-16

申请号：US13861787

申请日：2013-04-12

Applicant: DELPHI TECHNOLOGIES, INC.

Inventor： SCOTT D. BRANDENBURG ,  KHALID M. ELTOM ,  BRUCE A. MYERS ,  GARY L. EESLEY ,  BRUCE MOOR

IPC: H01L35/30

CPC classification number: H01L35/30 ,  H01L35/32

Abstract: An assembly for coupling thermally a thermoelectric generator (TEG) to an exhaust manifold of an internal combustion engine. The exhaust manifold forms a first heat exchanger configured to couple thermally heat from exhaust gas to an outer surface of the first heat exchanger. The outer surface is preferably formed of stainless steel. A first dielectric layer is formed by firing a thick-film dielectric material onto the stainless steel of the first heat exchanger. A first conductor layer is formed by firing a conductive thick-film onto the first dielectric layer. A first paste layer of silver (Ag) based sintering paste is interposed between the first conductor layer and a first contact of the TEG. The first contact is sintered to the first conductor layer when the assembly is suitably arranged and suitably heated.

Abstract translation: 一种用于将热电发生器（TEG）热耦合到内燃机的排气歧管的组件。 排气歧管形成第一热交换器，其构造成将来自废气的热热耦合到第一热交换器的外表面。 外表面优选由不锈钢形成。 通过将厚膜电介质材料烧制到第一热交换器的不锈钢上而形成第一电介质层。 通过在第一电介质层上烧结导电厚膜来形成第一导体层。 银（Ag）基烧结膏的第一糊剂层插入在第一导体层和TEG的第一接触之间。 当组件被适当地布置并适当地加热时，第一接触件被烧结到第一导体层。