公开(公告)号：US20160113107A1

公开(公告)日：2016-04-21

申请号：US14819446

申请日：2015-08-06

Applicant: DELTA ELECTRONICS, INC.

Inventor： Tao WANG ,  Zhen-Qing ZHAO ,  Kai LU ,  Zheng-Fen WAN ,  Hai-Bin XU

IPC: H05K1/02

CPC classification number: H01L24/00 ,  H01L2224/32225 ,  H01L2224/33 ,  H05K3/3431 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2201/2036 ,  Y02P70/613

Abstract: The disclosure discloses a power module. The power module includes a substrate, a power chip, a bonding material, and at least one spacer. The substrate includes a circuit-patterned layer. The power chip bonded to the circuit-patterned layer by the bonding material. The spacer is located between the circuit-patterned layer and the power chip, so as to keep the power chip away from the circuit-patterned layer in a distance.

Abstract translation: 本公开公开了一种电源模块。 功率模块包括基板，功率芯片，接合材料和至少一个间隔件。 衬底包括电路图案层。 功率芯片通过接合材料结合到电路图案层。 间隔物位于电路图案层和功率芯片之间，以便将功率芯片远离电路图案层远离。