公开(公告)号：US20160352247A1

公开(公告)日：2016-12-01

申请号：US15168235

申请日：2016-05-30

Applicant: DELTA ELECTRONICS, INC.

Inventor： Zeng LI ,  Jun-Cheng LU ,  Tao WANG ,  Zheng-Fen WAN ,  Zhen-Qing ZHAO

IPC: H02M7/00 ,  H01L25/18 ,  H01L21/56 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498 ,  H01L25/07

CPC classification number: H02M7/003 ,  H01L21/4846 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/2732 ,  H01L2224/291 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/48091 ,  H01L2224/48157 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83815 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2224/2743 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/32245 ,  H01L2224/48247

Abstract: A power module packaging structure includes a first conducting layer, a first insulating layer, a second conducting layer, a first power device, and a first controlling device. The first insulating layer is disposed above the first conducting layer. The second conducting layer is disposed above the first insulating layer. The first power device is disposed on the first conducting layer. The first controlling device is disposed on the second conducting layer and used for controlling the first power device. The first conducting layer, the second conducting layer, the first power device, and the first controlling device form a loop. A direction of a current which flows through the first conducting layer in the loop is opposite to a direction of a current which flows through the second conducting layer in the loop.

Abstract translation: 功率模块封装结构包括第一导电层，第一绝缘层，第二导电层，第一功率器件和第一控制器件。 第一绝缘层设置在第一导电层的上方。 第二导电层设置在第一绝缘层的上方。 第一功率器件设置在第一导电层上。 第一控制装置设置在第二导电层上，用于控制第一电力装置。 第一导电层，第二导电层，第一功率器件和第一控制器件形成环路。 在环路中流过第一导电层的电流的方向与流过环路中的第二导电层的电流方向相反。

公开(公告)号：US20160113107A1

公开(公告)日：2016-04-21

申请号：US14819446

申请日：2015-08-06

Applicant: DELTA ELECTRONICS, INC.

Inventor： Tao WANG ,  Zhen-Qing ZHAO ,  Kai LU ,  Zheng-Fen WAN ,  Hai-Bin XU

IPC: H05K1/02

CPC classification number: H01L24/00 ,  H01L2224/32225 ,  H01L2224/33 ,  H05K3/3431 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2201/2036 ,  Y02P70/613

Abstract: The disclosure discloses a power module. The power module includes a substrate, a power chip, a bonding material, and at least one spacer. The substrate includes a circuit-patterned layer. The power chip bonded to the circuit-patterned layer by the bonding material. The spacer is located between the circuit-patterned layer and the power chip, so as to keep the power chip away from the circuit-patterned layer in a distance.

Abstract translation: 本公开公开了一种电源模块。 功率模块包括基板，功率芯片，接合材料和至少一个间隔件。 衬底包括电路图案层。 功率芯片通过接合材料结合到电路图案层。 间隔物位于电路图案层和功率芯片之间，以便将功率芯片远离电路图案层远离。