POWER CONVERTER APPARATUS
    1.
    发明申请
    POWER CONVERTER APPARATUS 有权
    电源转换器

    公开(公告)号:US20130300381A1

    公开(公告)日:2013-11-14

    申请号:US13665089

    申请日:2012-10-31

    Abstract: A power converter apparatus for driving an electronic load is disclosed. The power converter apparatus includes a rectifier module, an active switch unit, a driving module, an input voltage detection module, an output voltage detection module, a current detection module and a digital processor module. The active switch unit is shunt connected to the electronic load. The input voltage detection module is used for sampling out an input sampled voltage waveform. The output voltage detection module is used for sampling out an output sampled voltage waveform. The current detection module is used for sampling o out a practical input current waveform. The digital processor module generates a current reference command according to the input sampled voltage waveform and the output sampled voltage waveform. The digital processor module dynamically switches the active switch unit according to the current reference command and the practical input current waveform.

    Abstract translation: 公开了一种用于驱动电子负载的电力转换装置。 电力转换装置包括整流模块,有源开关单元,驱动模块,输入电压检测模块,输出电压检测模块,电流检测模块和数字处理器模块。 有源开关单元分流连接到电子负载。 输入电压检测模块用于采样输入采样电压波形。 输出电压检测模块用于采样输出采样电压波形。 电流检测模块用于对实际的输入电流波形进行采样。 数字处理器模块根据输入的采样电压波形和输出采样电压波形产生电流参考指令。 数字处理器模块根据当前参考命令和实际输入电流波形动态切换有源开关单元。

    INJECTION MOLDING CONTROL METHOD
    3.
    发明申请

    公开(公告)号:US20200086543A1

    公开(公告)日:2020-03-19

    申请号:US16691630

    申请日:2019-11-22

    Abstract: The present invention discloses an injection molding control method. The injection molding control method comprises the following steps: establishing a work command according to a plurality of production process parameters; receiving a position information directly from an injection molding machine; and controlling a servo pump to drive the injection molding machine according to the position information and the work command.

    INTEGRATED POWER MODULE PACKAGING STRUCTURE
    4.
    发明申请
    INTEGRATED POWER MODULE PACKAGING STRUCTURE 有权
    集成电源模块包装结构

    公开(公告)号:US20140198454A1

    公开(公告)日:2014-07-17

    申请号:US13854356

    申请日:2013-04-01

    Abstract: An integrated power module packaging structure includes a plastic housing having a cavity; a plurality of step-shaped pins embedded in the plastic housing, a first printed circuit board disposed in the cavity, and a second printed circuit board disposed above the first printed circuit board in the cavity. Each of the step-shaped pins includes a first L-shaped bending portion and a second L-shaped bending portion connected to each other. The first printed circuit board is disposed with at least a power device and is electrically connected to at least a part of the first L-shaped bending portions. Two opposite surfaces of the second printed circuit board are respectively disposed with at least an electronic device, and the second printed circuit board is electrically connected to at least a part of the second L-shaped bending portions.

    Abstract translation: 集成的功率模块封装结构包括具有空腔的塑料外壳; 嵌入在塑料外壳中的多个阶梯形销,设置在空腔中的第一印刷电路板和设置在空腔中的第一印刷电路板上方的第二印刷电路板。 每个阶梯形销包括彼此连接的第一L形弯曲部分和第二L形弯曲部分。 第一印刷电路板设置有至少一个功率器件,并且电连接到第一L形弯曲部分的至少一部分。 第二印刷电路板的两个相对表面分别设置有至少一个电子器件,并且第二印刷电路板电连接到第二L形弯曲部分的至少一部分。

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