公开(公告)号：US20140198454A1

公开(公告)日：2014-07-17

申请号：US13854356

申请日：2013-04-01

Applicant: DELTA ELECTRONICS, INC.

Inventor： Te-Wei YUAN ,  Hsueh-Kuo LIAO ,  Yi-Kai CHOU ,  Ming-Yuan TSAI ,  Wei-Hao CHI

IPC: H05K7/20

CPC classification number: H05K7/209 ,  H01L23/049 ,  H01L25/162 ,  H01L25/165 ,  H01L2924/0002 ,  H01L2924/19107 ,  H05K1/145 ,  H01L2924/00

Abstract: An integrated power module packaging structure includes a plastic housing having a cavity; a plurality of step-shaped pins embedded in the plastic housing, a first printed circuit board disposed in the cavity, and a second printed circuit board disposed above the first printed circuit board in the cavity. Each of the step-shaped pins includes a first L-shaped bending portion and a second L-shaped bending portion connected to each other. The first printed circuit board is disposed with at least a power device and is electrically connected to at least a part of the first L-shaped bending portions. Two opposite surfaces of the second printed circuit board are respectively disposed with at least an electronic device, and the second printed circuit board is electrically connected to at least a part of the second L-shaped bending portions.

Abstract translation: 集成的功率模块封装结构包括具有空腔的塑料外壳; 嵌入在塑料外壳中的多个阶梯形销，设置在空腔中的第一印刷电路板和设置在空腔中的第一印刷电路板上方的第二印刷电路板。 每个阶梯形销包括彼此连接的第一L形弯曲部分和第二L形弯曲部分。 第一印刷电路板设置有至少一个功率器件，并且电连接到第一L形弯曲部分的至少一部分。 第二印刷电路板的两个相对表面分别设置有至少一个电子器件，并且第二印刷电路板电连接到第二L形弯曲部分的至少一部分。

公开(公告)号：US20250022770A1

公开(公告)日：2025-01-16

申请号：US18660926

申请日：2024-05-10

Applicant: Delta Electronics, Inc.

Inventor： Fu-Yuan SHIH ,  Jung-Li CHEN ,  Wei-Hao CHI ,  Wei-Yi LEE

IPC: H01L23/373 ,  H01L23/00 ,  H01L23/15 ,  H01L23/367 ,  H01L23/498

Abstract: A power module structure is provided. The power module structure includes a substrate, a copper layer, a metal layer, and a chip. The copper layer is disposed on the substrate. The metal layer is disposed on the copper layer. The area of the metal layer is smaller than that of the copper layer. The chip is disposed on the metal layer. The area of the chip is smaller than that of the metal layer.

公开(公告)号：US20170374755A1

公开(公告)日：2017-12-28

申请号：US15232169

申请日：2016-08-09

Applicant: DELTA ELECTRONICS, INC.

Inventor： Wei-Hao CHI ,  Hsueh-Kuo LIAO

IPC: H05K5/02 ,  H01L25/11 ,  H01L25/07 ,  H05K1/02 ,  H05K7/14 ,  H05K5/00

CPC classification number: H05K5/0247 ,  H01L23/053 ,  H01L25/072 ,  H01L25/115 ,  H01L2224/0603 ,  H01L2224/48227 ,  H01L2224/49111 ,  H01L2224/49113 ,  H05K1/0268 ,  H05K5/0013 ,  H05K5/0069 ,  H05K7/1401

Abstract: A power module having a packaging structure includes a substrate having a first conductive area, a second conductive area, a third conductive area, a first fixing area and a second fixing area. The first, the second and the third conductive areas are electrically connected to a first terminal, a second terminal and a third terminal, and the first and the second fixing areas are electrically connected to a first switch set and a second switch set, so that they are in a parallel arrangement. The first terminal is a current input end, the second terminal is an intermediate end, and the third terminal is a current output end. When a current flows from the current input end to the intermediate end, or from the intermediate end to the current output end, the current flows straightly in order to reduce a crossover area and lower the stray inductance.