公开(公告)号：US20220177376A1

公开(公告)日：2022-06-09

申请号：US17441772

申请日：2020-03-26

Applicant: Denka Company Limited

Inventor： Shoji IWAKIRI ,  Makoto TAKEDA ,  Shinichi TAKADA

IPC: C04B35/584 ,  H01L23/373 ,  H01L21/48

Abstract: Provided is a method for producing a silicon nitride sintered body including: a step of molding and firing a raw material powder containing silicon nitride, in which an α-conversion rate of the silicon nitride contained in the raw material powder is less than or equal to 30 mass %. A thermal conductivity (at 20° C.) of the silicon nitride sintered body exceeds 100 W/m·K and a fracture toughness (KIC) is greater than or equal to 7.4 MPa·m1/2.

公开(公告)号：US20220177375A1

公开(公告)日：2022-06-09

申请号：US17441763

申请日：2020-03-26

Applicant: Denka Company Limited

Inventor： Saori INOUE ,  Shoji IWAKIRI ,  Yoshitaka MINAKATA ,  Ryo YOSHIMATSU ,  Ryuji KOGA ,  Tomoya YAMAGUCHI

IPC: C04B35/583 ,  C04B41/83

Abstract: One aspect of the present invention is a composite including: a porous boron nitride sintered body; and a resin filled in pores of the boron nitride sintered body, wherein the boron nitride sintered body has an average pore diameter of 3.5 μm or less.

公开(公告)号：US20210176860A1

公开(公告)日：2021-06-10

申请号：US16616902

申请日：2018-05-29

Applicant: DENKA COMPANY LIMITED

Inventor： Yuta TSUGAWA ,  Kouji NISHIMURA ,  Yusaku HARADA ,  Ryota AONO ,  Shoji IWAKIRI

IPC: H05K1/03 ,  B23K35/30 ,  C22C5/08 ,  C04B37/02

Abstract: A ceramic circuit substrate having high bonding performance and excellent thermal cycling resistance properties, wherein a ceramic substrate and a copper plate are bonded by a braze material containing Ag and Cu, at least one active metal component selected from Ti and Zr, and at least one element selected from among In, Zn, Cd, and Sn, wherein a braze material layer, after bonding, has a continuity ratio of 80% or higher and a Vickers hardness of 60 to 85 Hv.

公开(公告)号：US20220250994A1

公开(公告)日：2022-08-11

申请号：US17441746

申请日：2020-03-26

Applicant: Denka Company Limited

Inventor： Saori INOUE ,  Shoji IWAKIRI ,  Yoshitaka MINAKATA ,  Ryo YOSHIMATSU ,  Ryuji KOGA ,  Tomoya YAMAGUCHI

IPC: C04B41/48 ,  C04B35/583 ,  C04B38/00

Abstract: One aspect of the present invention is a method for producing a composite, including a step of placing a porous boron nitride sintered body immersed in a resin composition under a pressurized condition and then placing the boron nitride sintered body immersed in the resin composition under a pressure condition lower than the pressurized condition, wherein the step is repeated a plurality of times.