公开(公告)号：US20220250994A1

公开(公告)日：2022-08-11

申请号：US17441746

申请日：2020-03-26

Applicant: Denka Company Limited

Inventor： Saori INOUE ,  Shoji IWAKIRI ,  Yoshitaka MINAKATA ,  Ryo YOSHIMATSU ,  Ryuji KOGA ,  Tomoya YAMAGUCHI

IPC: C04B41/48 ,  C04B35/583 ,  C04B38/00

Abstract: One aspect of the present invention is a method for producing a composite, including a step of placing a porous boron nitride sintered body immersed in a resin composition under a pressurized condition and then placing the boron nitride sintered body immersed in the resin composition under a pressure condition lower than the pressurized condition, wherein the step is repeated a plurality of times.

公开(公告)号：US20220177375A1

公开(公告)日：2022-06-09

申请号：US17441763

申请日：2020-03-26

Applicant: Denka Company Limited

Inventor： Saori INOUE ,  Shoji IWAKIRI ,  Yoshitaka MINAKATA ,  Ryo YOSHIMATSU ,  Ryuji KOGA ,  Tomoya YAMAGUCHI

IPC: C04B35/583 ,  C04B41/83

Abstract: One aspect of the present invention is a composite including: a porous boron nitride sintered body; and a resin filled in pores of the boron nitride sintered body, wherein the boron nitride sintered body has an average pore diameter of 3.5 μm or less.

公开(公告)号：US20200031723A1

公开(公告)日：2020-01-30

申请号：US16498648

申请日：2018-03-28

Applicant: DENKA COMPANY LIMITED

Inventor： Saori INOUE ,  Toshitaka YAMAGATA ,  Yoshitaka MINAKATA ,  Ryo YOSHIMATSU ,  Ryuji KOGA

IPC: C04B35/583 ,  C04B41/83 ,  H01L23/373 ,  H01L23/34

Abstract: A thermal conductive member includes: first and second surface layers including an insulating material A, and an intermediate layer including an insulating material B. The insulating material A includes a first boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.6 to 1.4, and a first heat curable resin composition impregnating in the first boron nitride sintered body. The insulating material B includes a second boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.01 to 0.05, and a second heat curable resin composition impregnating in the second boron nitride sintered body.

公开(公告)号：US20230271888A1

公开(公告)日：2023-08-31

申请号：US17998687

申请日：2021-05-13

Applicant: Denka Company Limited

Inventor： Nobuya SUZUKI ,  Saori INOUE ,  Yasuhisa UESHIMA ,  Ryo YOSHIMATSU ,  Ryuji KOGA

IPC: C04B41/48 ,  C04B41/45 ,  C04B41/00 ,  C04B41/83 ,  C04B35/583 ,  B29C39/10

CPC classification number: C04B41/4884 ,  B29C39/10 ,  C04B35/583 ,  C04B41/0063 ,  C04B41/83 ,  C04B41/4521 ,  C04B41/4525 ,  H01L33/641

Abstract: One aspect of the present disclosure provides a production method for a composite, the method including: a cooling step of performing cooling under a pressurized condition in a state where a heated molten material of a thermosetting composition is brought into contact with a resin-impregnated body, in which the above-described resin-impregnated body includes a nitride sintered body having a porous structure and a semi-cured product of the thermosetting composition impregnated into the above-described nitride sintered body.

公开(公告)号：US20230227370A1

公开(公告)日：2023-07-20

申请号：US17998690

申请日：2021-05-13

Applicant: Denka Company Limited

Inventor： Nobuya SUZUKI ,  Saori INOUE ,  Yasuhisa UESHIMA ,  Ryo YOSHIMATSU ,  Ryuji KOGA

IPC: C04B37/02 ,  C04B35/583 ,  C04B41/83 ,  C04B41/48 ,  B32B3/26 ,  B32B9/00 ,  B32B9/04

CPC classification number: C04B37/021 ,  C04B35/583 ,  C04B41/83 ,  C04B41/4884 ,  B32B3/26 ,  B32B9/005 ,  B32B9/041 ,  C04B2237/361 ,  C04B2237/407 ,  C04B2237/52 ,  H01L33/641

Abstract: One aspect of the present disclosure provides a composite body including: a nitride sintered body having a porous structure; and a semi-cured product of a thermosetting composition impregnated into the above-described nitride sintered body, in which dielectric breakdown voltage is 4.5 kV or higher.

公开(公告)号：US20210017448A1

公开(公告)日：2021-01-21

申请号：US17040423

申请日：2019-03-14

Applicant: DENKA COMPANY LIMITED ,  NATIONAL INSTITUTE FOR MATERIALS SCIENCE

Inventor： Hiroaki TOYOSHIMA ,  Ryo YOSHIMATSU ,  Taiyo YAMAURA ,  Masato AKABANE ,  Naoto HIROSAKI

IPC: C09K11/77 ,  C01F11/02 ,  C09K11/08 ,  H01L33/50

Abstract: A phosphor in which an element represented by Rδ is solid-solutionized in a phosphor host crystal represented by Mα(L, A)βXγ, wherein M is at least one type of element selected from Mg, Ca, Sr, Ba and Zn, L is at least one type of element selected from Li, Na and K, A is at least one type of element selected from Al, Ga, B, In, Sc, Y, La and Si, X is at least one type of element selected from O, N, F and Cl (where all of X being N is excluded), R is at least one type of element selected from Mn, Cr, Ti, Ce, Pr, Nd, Sm, Eu, Tb, Dy, Ho and Yb, α, β, γ and δ satisfy α+β+γ+δ=9, 0.00