公开(公告)号：US20190276715A1

公开(公告)日：2019-09-12

申请号：US16319115

申请日：2017-07-19

Applicant: DENKA COMPANY LIMITED

Inventor： Makiko SASAKI ,  Takako HOSHINO ,  Gosuke NAKAJIMA

IPC: C09J133/06 ,  B32B7/12 ,  B32B15/088 ,  B32B27/20 ,  C09J4/06 ,  C08J5/12

Abstract: Provided is an adhesive composition having high adhesiveness to polyamides. An adhesive composition for bonding adherends comprising a polyamide, comprising the following components (1) to (4): (meth)acrylates (1), excluding the component (2), comprising the following ingredients (1-1), (1-2), and (1-3): a (meth)acrylate (1-1), excluding an ingredient (1-3), having an aromatic group; a (meth)acrylate (1-2) having a hydroxy group; and a (meth)acrylate (1-3) represented by general formula (A); an acidic phosphate compound (2); a polymerization initiator (3); and a reducing agent (4) comprising a transition metal salt.

公开(公告)号：US20210261700A1

公开(公告)日：2021-08-26

申请号：US17252234

申请日：2019-06-14

Applicant: DENKA COMPANY LIMITED

Inventor： Takako HOSHINO ,  Yoshitsugu GOTO

IPC: C08F20/26 ,  C09J133/14 ,  C08F20/18 ,  C08K5/55 ,  C08K5/521

Abstract: An object of the present invention is to provide a two-part composition containing a first agent and a second agent: the first agent comprising (1) (meth)acrylate and (2) organoboron compound, and having an oxygen content of 5 ppm or less, and the second agent comprising (3) phosphate ester.