公开(公告)号：US20190276715A1

公开(公告)日：2019-09-12

申请号：US16319115

申请日：2017-07-19

Applicant: DENKA COMPANY LIMITED

Inventor： Makiko SASAKI ,  Takako HOSHINO ,  Gosuke NAKAJIMA

IPC: C09J133/06 ,  B32B7/12 ,  B32B15/088 ,  B32B27/20 ,  C09J4/06 ,  C08J5/12

Abstract: Provided is an adhesive composition having high adhesiveness to polyamides. An adhesive composition for bonding adherends comprising a polyamide, comprising the following components (1) to (4): (meth)acrylates (1), excluding the component (2), comprising the following ingredients (1-1), (1-2), and (1-3): a (meth)acrylate (1-1), excluding an ingredient (1-3), having an aromatic group; a (meth)acrylate (1-2) having a hydroxy group; and a (meth)acrylate (1-3) represented by general formula (A); an acidic phosphate compound (2); a polymerization initiator (3); and a reducing agent (4) comprising a transition metal salt.

公开(公告)号：US20230265317A1

公开(公告)日：2023-08-24

申请号：US18040064

申请日：2021-08-18

Applicant: Denka Company Limited

Inventor： Gosuke NAKAJIMA ,  Keisuke NABA ,  Takanori ATSUSAKA ,  Hisatsugu TOKUNAGA

IPC: C09J7/35 ,  H01L21/683 ,  C09J133/10

CPC classification number: C09J7/35 ,  C09J133/10 ,  H01L21/6836 ,  C09J2203/326

Abstract: This cover tape has at least a base layer and a heat seal layer, wherein the heat seal layer contains a polystyrene-based resin (A) and an ethylene-(meth)acrylic acid-based copolymer (B), and contents of the component (A) and the component (B) are more than 80 parts by mass and 95 parts by mass or less and 5 parts by mass or more and less than 20 parts by mass with respect to a total of 100 parts by mass of the component (A) and the component (B).

公开(公告)号：US20170152407A1

公开(公告)日：2017-06-01

申请号：US15310315

申请日：2015-05-11

Applicant: Denka Company Limited

Inventor： Gosuke NAKAJIMA ,  Masanobu KUTSUMI

IPC: C09J7/02 ,  H01L23/00 ,  H01L21/66 ,  H01L21/78 ,  C09J4/06 ,  C09J11/08

CPC classification number: C09J4/06 ,  C08F265/06 ,  C08G18/673 ,  C08G18/73 ,  C08G18/755 ,  C08G18/8029 ,  C09J4/00 ,  C09J7/243 ,  C09J11/08 ,  C09J133/04 ,  C09J175/04 ,  C09J175/16 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2423/006 ,  C09J2433/00 ,  C09J2451/00 ,  C09J2483/00 ,  G01R31/2877 ,  H01L21/6836 ,  H01L21/78 ,  H01L22/12 ,  H01L22/32 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/68381 ,  H01L2224/29294 ,  H01L2224/29299 ,  H01L2224/32245 ,  H01L2224/8322 ,  C08F2222/1033 ,  H01L2924/00014

Abstract: A heat resistant adhesive sheet is provided that does not easily develop deformation of an adhesive sheet due to heating. Such an adhesive sheet made by laminating an adhesive layer to a substrate is provided, characterized in that the substrate is heat shrinkable and the adhesive layer contains a (meth)acrylate copolymer, a photopolymerizable compound, a polyfunctional isocyanate curing agent, and a photopolymerization initiator and does not substantially contain a tackifying resin. This adhesive sheet is not deformed even when heated. Since the adhesive does not substantially contain a tackifying resin, softening of the adhesive layer does not occur even when the sheet is heated.

公开(公告)号：US20230271761A1

公开(公告)日：2023-08-31

申请号：US18040173

申请日：2021-08-18

Applicant: Denka Company Limited

Inventor： Keisuke NABA ,  Gosuke NAKAJIMA ,  Takanori ATSUSAKA ,  Hisatsugu TOKUNAGA

IPC: B65D75/28

CPC classification number: B65D75/28

Abstract: This cover tape has at least a base layer and a heat seal layer, wherein the heat seal layer contains a copolymer (A) of a styrene-based hydrocarbon and a conjugated diene-based hydrocarbon, the component (A) contains a block copolymer (A-1) of 10% by mass or more and less than 50% by mass of a styrene-based hydrocarbon and more than 50% by mass and 90% by mass or less of a conjugated diene-based hydrocarbon, and a block copolymer (A-2) of 50% by mass or more and 95% by mass or less of a styrene-based hydrocarbon and 5% by mass or more and 50% by mass or less of a conjugated diene-based hydrocarbon, a content of the component (A-1) is 35 to 60% by mass based on a total amount of the heat seal layer, and a mass ratio of the component (A-2) to the component (A-1) is 0.30 to 1.0.

公开(公告)号：US20190284437A1

公开(公告)日：2019-09-19

申请号：US16335607

申请日：2017-10-04

Applicant: DENKA COMPANY LIMITED

Inventor： Shinya SERIZAWA ,  Makiko SASAKI ,  Gosuke NAKAJIMA

IPC: C09J4/06 ,  C08L9/02 ,  C08L33/10 ,  C08F220/18

Abstract: An object of the present invention is to provide a composition comprising components of (1) to (3): (1) a polymerizable monomer comprising components of (1-1) to (1-3): (1-1) a tricyclic monofunctional (meth)acrylate in which the tricyclic ring is alicyclic, (1-2) a tricyclic bifunctional (meth)acrylate in which the tricyclic ring is alicyclic, and (1-3) a bifunctional (meth)acrylate having a bisphenol structure; (2) a polymerization initiator; and (3) a reducing, and wherein (1) the polymerizable monomer comprises 40 to 75% by mass of (1-1) the tricyclic monofunctional (meth)acrylate, 10 to 40% by mass of (1-2) the tricyclic bifunctional (meth)acrylate, and 15 to 40% by mass of the (1-3) the bifunctional (meth)acrylate having the bisphenol structure.

公开(公告)号：US20170200629A1

公开(公告)日：2017-07-13

申请号：US15326195

申请日：2015-07-06

Applicant: Denka Company Limited

Inventor： Tomoya TSUKUI ,  Gosuke NAKAJIMA

IPC: H01L21/683 ,  H01L21/78 ,  C09J133/10 ,  C09J5/06 ,  C09J4/06 ,  C09J7/02

CPC classification number: H01L21/6836 ,  C08F220/18 ,  C08F299/065 ,  C08G18/6254 ,  C08G18/673 ,  C08G18/755 ,  C08G18/792 ,  C08G18/8025 ,  C08G18/8029 ,  C08G18/8175 ,  C09J4/06 ,  C09J5/06 ,  C09J7/35 ,  C09J7/385 ,  C09J133/06 ,  C09J133/10 ,  C09J175/04 ,  C09J175/16 ,  C09J187/00 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/00 ,  C09J2475/00 ,  H01L21/78 ,  H01L2221/68336 ,  C08F220/14 ,  C08F2220/1858 ,  C08F220/06 ,  C08F220/20 ,  C08F2220/1808 ,  C08F2220/1825 ,  C08F2220/281

Abstract: An adhesive sheet is provided that is capable of inhibiting scraping up of an adhesive in the dicing step, does not cause chip detachment during dicing processing, facilitates picking up, and does not readily develop adhesive transfer. According to the present invention, an adhesive sheet is provided that comprises a substrate film and an adhesive layer laminated on the film, wherein the adhesive layer contains 100 parts by mass of a (meth)acrylate copolymer, from 5 to 250 parts by mass of a photopolymerizable compound, from 20 to 160 parts by mass of a softener, from 0.1 to 30 parts by mass of a curing agent, and from 0.1 to 20 parts by mass of a photopolymerization initiator, and the photopolymerizable compound has a weight average molecular weight from 40,000 to 220,000.

公开(公告)号：US20230272192A1

公开(公告)日：2023-08-31

申请号：US18006898

申请日：2021-08-18

Applicant: Denka Company Limited

Inventor： Kota SAWAGUCHI ,  Keisuke NABA ,  Gosuke NAKAJIMA

IPC: C08L9/06 ,  B32B27/30 ,  B32B27/32

CPC classification number: C08L9/06 ,  B32B27/302 ,  B32B27/32 ,  B32B27/308 ,  C08L2205/025 ,  C08L2205/035 ,  B32B27/36

Abstract: This cover tape has at least a base layer and a heat seal layer, wherein the heat seal layer has a loss tangent tan δ of less than 1 in a temperature range of 150° C. or less in a dynamic viscoelastic measurement at a measurement frequency of 1 Hz.

公开(公告)号：US20160130481A1

公开(公告)日：2016-05-12

申请号：US14895546

申请日：2014-06-10

Applicant: DENKA COMPANY LIMITED

Inventor： Gosuke NAKAJIMA ,  Tomoya TSUKUI

IPC: C09J133/08 ,  C09J183/10 ,  C09J133/14

CPC classification number: C09J133/08 ,  C08F2/48 ,  C08G18/6229 ,  C08G18/673 ,  C08G18/73 ,  C08G18/792 ,  C08G18/8022 ,  C08L75/14 ,  C08L83/00 ,  C09J4/06 ,  C09J7/35 ,  C09J133/06 ,  C09J133/14 ,  C09J175/04 ,  C09J175/16 ,  C09J183/10 ,  C09J2203/326 ,  C09J2433/00 ,  H01L21/6836 ,  H01L2221/68327 ,  C08F2220/1808 ,  C08F2220/281 ,  C08F2220/1858 ,  C08F220/20

Abstract: A heat-resistant adhesive sheet for semiconductor testing, used in a performance test while semiconductor chips are heated includes: a base material; and an adhesive layer provided on the base material, the base material having a thermal shrinkage of lower than 1% when being heated at 150 degrees Celsius for 30 minutes and a linear expansion coefficient of equal to or lower than 5.0×10−5 at 60 to 150 degrees Celsius, and the adhesive layer containing a (meth)acrylic acid ester copolymer, a photopolymerizable compound, a polyfunctional isocyanate curing agent, and photoinitiator. The adhesive layer contains 5 to 200 parts by mass of the photopolymerizable compound, 0.5 to 20 parts by mass of the polyfunctional isocyanate curing agent, and 0.1 to 20 parts by mass of the photoinitiator, with respect to 100 parts by mass of the(meth)acrylic acid ester copolymer. The adhesive layer is free of tackifying resin.

Abstract translation: 用于半导体芯片加热时的性能测试中的用于半导体测试的耐热粘合片包括：基材; 以及设置在基材上的粘合剂层，当在150℃下加热30分钟时，该基材的热收缩率低于1％，线膨胀系数等于或低于5.0×10-5的线膨胀系数在60 和含有（甲基）丙烯酸酯共聚物的粘合剂层，光聚合性化合物，多官能异氰酸酯固化剂和光引发剂。 粘合剂层含有5〜200质量份的光聚合性化合物，0.5〜20质量份的多官能异氰酸酯固化剂和0.1〜20质量份的光引发剂，相对于100质量份的（甲基 ）丙烯酸酯共聚物。 粘合剂层不含增粘树脂。