公开(公告)号：US20190276715A1

公开(公告)日：2019-09-12

申请号：US16319115

申请日：2017-07-19

Applicant: DENKA COMPANY LIMITED

Inventor： Makiko SASAKI ,  Takako HOSHINO ,  Gosuke NAKAJIMA

IPC: C09J133/06 ,  B32B7/12 ,  B32B15/088 ,  B32B27/20 ,  C09J4/06 ,  C08J5/12

Abstract: Provided is an adhesive composition having high adhesiveness to polyamides. An adhesive composition for bonding adherends comprising a polyamide, comprising the following components (1) to (4): (meth)acrylates (1), excluding the component (2), comprising the following ingredients (1-1), (1-2), and (1-3): a (meth)acrylate (1-1), excluding an ingredient (1-3), having an aromatic group; a (meth)acrylate (1-2) having a hydroxy group; and a (meth)acrylate (1-3) represented by general formula (A); an acidic phosphate compound (2); a polymerization initiator (3); and a reducing agent (4) comprising a transition metal salt.

公开(公告)号：US20190284437A1

公开(公告)日：2019-09-19

申请号：US16335607

申请日：2017-10-04

Applicant: DENKA COMPANY LIMITED

Inventor： Shinya SERIZAWA ,  Makiko SASAKI ,  Gosuke NAKAJIMA

IPC: C09J4/06 ,  C08L9/02 ,  C08L33/10 ,  C08F220/18

Abstract: An object of the present invention is to provide a composition comprising components of (1) to (3): (1) a polymerizable monomer comprising components of (1-1) to (1-3): (1-1) a tricyclic monofunctional (meth)acrylate in which the tricyclic ring is alicyclic, (1-2) a tricyclic bifunctional (meth)acrylate in which the tricyclic ring is alicyclic, and (1-3) a bifunctional (meth)acrylate having a bisphenol structure; (2) a polymerization initiator; and (3) a reducing, and wherein (1) the polymerizable monomer comprises 40 to 75% by mass of (1-1) the tricyclic monofunctional (meth)acrylate, 10 to 40% by mass of (1-2) the tricyclic bifunctional (meth)acrylate, and 15 to 40% by mass of the (1-3) the bifunctional (meth)acrylate having the bisphenol structure.