公开(公告)号：US20230312356A1

公开(公告)日：2023-10-05

申请号：US18022569

申请日：2021-08-17

Applicant: DENKA COMPANY LIMITED

Inventor： Yasuaki HATAYAMA ,  Takashi FUKUDA ,  Atsuya SUGIMOTO

IPC: C01B33/18

CPC classification number: C01B33/18 ,  C01P2004/64 ,  C01P2006/12

Abstract: An amorphous silica powder that is suitable for obtaining a solid sealant that exhibits superior fluidity and filling properties, and a resin composition obtained by using the amorphous silica powder as a filler. An amorphous silica powder is prepared so as to have a modal diameter within the range of 1 to 10 μm in the particle diameter frequency distribution and have a frequency of particles having particle diameters of 0.50 to 1.83 μm of less than 3.0% in the particle diameter frequency distribution.

公开(公告)号：US20230312868A1

公开(公告)日：2023-10-05

申请号：US18022648

申请日：2021-08-17

Applicant: DENKA COMPANY LIMITED

Inventor： Yasuaki HATAYAMA ,  Takashi FUKUDA ,  Atsuya SUGIMOTO

IPC: C08K3/36 ,  C01B33/18 ,  C09K3/10

CPC classification number: C08K3/36 ,  C01B33/18 ,  C09K3/1025 ,  C08K2201/003 ,  C08K2201/006 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2004/51 ,  C01P2002/02 ,  C01P2006/12 ,  C01P2006/80 ,  C09K2200/0647 ,  C09K2200/0247

Abstract: An amorphous silica powder that is suitable for obtaining a liquid sealant that exhibits superior filling properties and preservation properties, and a resin composition obtained by using the amorphous silica powder as a filler. More specifically, an amorphous silica powder is prepared so as to have a modal diameter within the range of 1 to 10 μm and a frequency of particles having particle diameters of less than 0.50 μm of 1.0% or more in the particle diameter frequency distribution and have a specific surface area of 1 to 12 m2/g.

公开(公告)号：US20240254313A1

公开(公告)日：2024-08-01

申请号：US18560463

申请日：2022-05-06

Applicant: DENKA COMPANY LIMITED

Inventor： Teruhiro AIKYO ,  Takaaki MINAMIKAWA ,  Yasuaki HATAYAMA ,  Naoto HAYASHI

IPC: C08K3/36 ,  C01B33/12 ,  H01L23/29

CPC classification number: C08K3/36 ,  C01B33/12 ,  H01L23/295 ,  C01P2006/12 ,  C08K2201/005 ,  C08K2201/006

Abstract: Provided are a silica powder with a particle size of 2.0 μm or less which does not readily aggregate, has favorable handling, and readily disperses when mixed with a resin; and a resin composition and a semiconductor sealing material comprising the silica powder.
The silica powder has a volume-based cumulative size (D50) of 2.0 μm or less and a maximum particle size (Dmax) of 5.0 μm or less as measured by a grind gauge with the following method.
(Measurement Method)
The degree of dispersion of the silica powder in the epoxy resin is evaluated in a resin composition obtained by adding 67 parts by mass of the silica powder to 100 parts by mass of a bisphenol F-type liquid epoxy resin with a distribution map method using a grind gauge and the maximum particle size (Dmax) is measured in accordance with JIS K 5600-2-5. Further, the same evaluation is performed five times and the average value thereof is employed.

公开(公告)号：US20240166552A1

公开(公告)日：2024-05-23

申请号：US18284784

申请日：2022-03-23

Applicant: DENKA COMPANY LIMITED

Inventor： Yasuaki HATAYAMA ,  Takashi FUKUDA

IPC: C03C12/00 ,  C03B19/10 ,  C03C3/06 ,  H01L23/29

CPC classification number: C03C12/00 ,  C03B19/1005 ,  C03B19/1095 ,  C03C3/06 ,  C03C2201/02 ,  C03C2201/80 ,  C03C2203/10 ,  H01L23/29

Abstract: A spherical inorganic oxide powder wherein a volume-based cumulative 50% diameter D50 is 4-55 μm; and in a cross-section of a cured body containing an epoxy resin and the spherical inorganic oxide powder at a mass ratio of 2:1, when a total of 5000 particles with a maximum diameter of 51 μm or larger are observed in a field of view at 100× magnification using a scanning electron microscope, a total number of air bubbles having a maximum diameter of 1 μm or larger and smaller than 10 μm is 40 or fewer and a total number of air bubbles having a maximum diameter of 10 μm or larger is 30 or fewer.