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公开(公告)号:US08601871B2
公开(公告)日:2013-12-10
申请号:US13711911
申请日:2012-12-12
Applicant: DENSO CORPORATION , Toyota Jidosha Kabushiki Kaisha
Inventor: Tameharu Ohta , Tetsuo Fujii , Masanobu Azukawa , Takeshi Ito , Itaru Ishii
IPC: G01D11/24
CPC classification number: G01C19/56 , B81B7/0058 , B81B2201/0235 , B81B2201/0285 , G01D18/00 , G01P15/08 , H01L2224/48247 , H05K13/00 , Y10T29/49002 , Y10T29/49117 , Y10T29/49826
Abstract: A physical quantity sensor includes a sensor portion, a casing, and a vibration isolator. The casing includes a supporting portion with a supporting surface that is located to face an end surface of the sensor portion. The vibration isolator is located between the end surface of the sensor portion and the supporting surface of the casing to join the sensor portion to the casing. The vibration isolator reduces a relative vibration between the sensor portion and the casing.
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公开(公告)号:US11667247B2
公开(公告)日:2023-06-06
申请号:US16922030
申请日:2020-07-07
Applicant: DENSO CORPORATION
Inventor: Tatsuya Kamiya , Itaru Ishii , Tomoki Tanemura , Takashi Aoki , Tetsuya Katoh
IPC: B60R11/00 , G01S15/931 , G01S7/524 , G01S7/521
CPC classification number: B60R11/00 , G01S7/521 , G01S15/931 , B60R2011/004 , G01S2015/938
Abstract: An ultrasonic sensor includes: an ultrasonic element provided to transmit or receive an ultrasonic wave propagating along a directional axis; and an element housing case that includes a case diaphragm having a thickness direction along the directional axis. A resonant space is defined between the case diaphragm and the ultrasonic element for the propagating wave, by housing the ultrasonic element while separating the ultrasonic element from the case diaphragm. A horn shape is defined in the element housing case in which a width of the resonant space in a direction orthogonal to the directional axis is reduced as the resonant space extends in an axial direction parallel to the directional axis.
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公开(公告)号:US11181627B2
公开(公告)日:2021-11-23
申请号:US16261808
申请日:2019-01-30
Applicant: DENSO CORPORATION
Inventor: Itaru Ishii , Tomoki Tanemura , Tatsuya Kamiya
IPC: G01S7/521 , G01S15/931
Abstract: An ultrasonic sensor includes an ultrasonic element and an element accommodation case. A side wall portion of the element accommodation case has a tubular shape surrounding a directional central axis. A bottom wall portion and a top wall portion of the element accommodation case cover ends of the side wall portion in a direction along the directional central axis. The top wall portion has a diaphragm portion. The bottom wall portion supports the ultrasonic element. For example, the ultrasonic element is opposed to the diaphragm portion across a gap defining an interval corresponding to an integral multiple of half of a wavelength of ultrasonic vibration. Alternatively, the diaphragm portion is formed of a material having an acoustic impedance of 50×105 Pa·s/m or more and 5000×105 Pa·s/m or less, and has a thickness of 1 mm or less.
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公开(公告)号:US09366534B2
公开(公告)日:2016-06-14
申请号:US14068057
申请日:2013-10-31
Applicant: DENSO CORPORATION , TOYOTA JIDOSHA KABUSHIKI KAISHA
Inventor: Tameharu Ohta , Tetsuo Fujii , Masanobu Azukawa , Takeshi Ito , Itaru Ishii
CPC classification number: G01C19/56 , B81B7/0058 , B81B2201/0235 , B81B2201/0285 , G01D18/00 , G01P15/08 , H01L2224/48247 , H05K13/00 , Y10T29/49002 , Y10T29/49117 , Y10T29/49826
Abstract: A physical quantity sensor includes a sensor portion, a casing, and a vibration isolator. The casing includes a supporting portion with a supporting surface that is located to face an end surface of the sensor portion. The vibration isolator is located between the end surface of the sensor portion and the supporting surface of the casing to join the sensor portion to the casing. The vibration isolator reduces a relative vibration between the sensor portion and the casing.
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公开(公告)号:US11445304B2
公开(公告)日:2022-09-13
申请号:US16837258
申请日:2020-04-01
Applicant: DENSO CORPORATION
Inventor: Tatsuya Kamiya , Itaru Ishii , Tomoki Tanemura , Takashi Aoki , Tetsuya Katoh
Abstract: An ultrasonic sensor includes: an element storage case including a case-side diaphragm having a thickness direction along a directional axis; and an ultrasonic element accommodated in the element storage case and spaced apart from the case-side diaphragm. The ultrasonic element includes an element-side diaphragm having the thickness direction along the directional axis and provided by a thin part of a semiconductor substrate. The semiconductor substrate is arranged to provide a closed space between the case-side diaphragm and the element-side diaphragm. The semiconductor substrate is fixed and supported by the element-storage case.
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