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    MECHANICAL SHOCK RESISTANT MEMS ACCELEROMETER ARRANGEMENT, ASSOCIATED METHOD, APPARATUS AND SYSTEM
    3.
    发明公开
    MECHANICAL SHOCK RESISTANT MEMS ACCELEROMETER ARRANGEMENT, ASSOCIATED METHOD, APPARATUS AND SYSTEM 审中-公开

    公开(公告)号：US20240255543A1

    公开(公告)日：2024-08-01

    申请号：US18622682

    申请日：2024-03-29

    Applicant: Merlin Technology, Inc.

    Inventor： Albert W. Chau ,  John E. Mercer ,  Scott Phillips

    IPC: G01P15/18 ,  G01P3/00 ,  G01P15/00 ,  G01P15/08

    CPC classification number: G01P15/18 ,  G01P3/00 ,  G01P15/00 ,  G01P15/0888 ,  B81B2201/0235

    Abstract: An accelerometer arrangement and method are described for determining accelerations of an inground tool. First and second triaxial accelerometers are supported such that a normal sensing axis of the first triaxial accelerometer is at least generally orthogonal to the normal sensing axis of the second triaxial accelerometer for determining the accelerations along the three orthogonal axes based on a combination of sensing axis outputs from one or both of the triaxial accelerometers. A weaker sensing axis of one triaxial accelerometer can be supported at least approximately normal to a weaker sensing axis of another triaxial accelerometer such that the weaker axes are not used. The triaxial accelerometers can be supported such that one axis of one accelerometer can be redundant with respect to another axis of another accelerometer. One triaxial accelerometer can be mounted on a tilted plane with respect to another triaxial accelerometer.

    MEMS SENSOR AND METHOD OF MANUFACTURING MEMS SENSOR
    5.
    发明公开
    MEMS SENSOR AND METHOD OF MANUFACTURING MEMS SENSOR 审中-公开

    公开(公告)号：US20240208804A1

    公开(公告)日：2024-06-27

    申请号：US18538105

    申请日：2023-12-13

    Applicant: ROHM CO., LTD.

    Inventor： Martin Wilfried HELLER ,  Toma FUJITA

    IPC: B81B7/00 ,  B81C1/00

    CPC classification number: B81B7/0041 ,  B81C1/00293 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C2203/0118

    Abstract: A MEMS sensor includes: a first substrate; and a second substrate bonded to the first substrate, wherein at least one space, in which at least one sensor element is arranged, is formed inside at least one bonding portion where the first substrate and the second substrate are bonded, wherein at least one communication path communicating the space with outside of the bonding portion is formed in the first substrate, wherein the communication path includes an inner opening opened toward inside of the bonding portion, an outer opening opened toward outside of the bonding portion, and a tubular portion connecting the inner opening and the outer opening, and wherein the outer opening is closed by a sealing layer sealing the outer opening.

    METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE CAP
    6.
    发明公开
    METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE CAP 审中-公开

    公开(公告)号：US20240199412A1

    公开(公告)日：2024-06-20

    申请号：US18380131

    申请日：2023-10-13

    Applicant: InvenSense, Inc.

    Inventor： Camillo Pilla

    IPC: B81B7/00 ,  B81C1/00

    CPC classification number: B81B7/008 ,  B81C1/00246 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C2203/035

    Abstract: A device includes a first die and a second die. The first die and the second die are stacked and form a monolithic die. A first side of the first die faces a first side of the second die. The second die comprises an electrical connection within its periphery and on a side other than the first side of the second die. The electrical connection exposes the second die to an environment outside of the monolithic die. The electrical connection is configured to facilitate electrical connection between the second die of the monolithic die and an electronic component that is external to the monolithic die.

    MICROMECHANICAL Z-ACCELERATION SENSOR
    7.
    发明公开
    MICROMECHANICAL Z-ACCELERATION SENSOR 审中-公开

    公开(公告)号：US20240199409A1

    公开(公告)日：2024-06-20

    申请号：US18538538

    申请日：2023-12-13

    Applicant: Robert Bosch GmbH

    Inventor： Cristian Nagel

    IPC: B81B3/00

    CPC classification number: B81B3/0081 ,  B81B2201/0235 ,  B81B2203/0353 ,  B81B2203/053

    Abstract: A micromechanical z-acceleration sensor. The sensor has a substrate with a main extension plane, and a micromechanical rocker which is arranged parallel to the extension plane above the substrate and can be tilted in a first direction z perpendicular to the extension plane, wherein the rocker in a first partial region: has first perforations, which extend through the rocker in the first direction z, with a first cross-section parallel to the main extension plane with a first aspect ratio of at least 1:1; and has second perforations, which extend through the rocker in the first direction z, with a second cross-section with a second aspect ratio of a longer side to a shorter side, wherein the first aspect ratio is smaller than the second aspect ratio. A first perforation and a second perforation are arranged alternately next to one another in a repeating pattern.

    Mechanical shock resistant MEMS accelerometer arrangement, associated method, apparatus and system
    9.
    发明授权
    Mechanical shock resistant MEMS accelerometer arrangement, associated method, apparatus and system 有权

    公开(公告)号：US11971428B2

    公开(公告)日：2024-04-30

    申请号：US18206574

    申请日：2023-06-06

    Applicant: Merlin Technology, Inc.

    Inventor： Albert W. Chau ,  John E. Mercer ,  Scott Phillips

    IPC: G01P15/18 ,  G01P3/00 ,  G01P15/00 ,  G01P15/08

    CPC classification number: G01P15/18 ,  G01P3/00 ,  G01P15/00 ,  G01P15/0888 ,  B81B2201/0235

    Abstract: An accelerometer arrangement and method are described for determining accelerations of an inground tool. First and second triaxial accelerometers are supported such that a normal sensing axis of the first triaxial accelerometer is at least generally orthogonal to the normal sensing axis of the second triaxial accelerometer for determining the accelerations along the three orthogonal axes based on a combination of sensing axis outputs from one or both of the triaxial accelerometers. A weaker sensing axis of one triaxial accelerometer can be supported at least approximately normal to a weaker sensing axis of another triaxial accelerometer such that the weaker axes are not used. The triaxial accelerometers can be supported such that one axis of one accelerometer can be redundant with respect to another axis of another accelerometer. One triaxial accelerometer can be mounted on a tilted plane with respect to another triaxial accelerometer.

    MEMS Device, Electronic Apparatus, And Vehicle
    10.
    发明公开
    MEMS Device, Electronic Apparatus, And Vehicle 审中-公开

    公开(公告)号：US20240094239A1

    公开(公告)日：2024-03-21

    申请号：US18524231

    申请日：2023-11-30

    Applicant: SEIKO EPSON CORPORATION

    Inventor： Fumiya ITO

    IPC: G01P15/135 ,  B81B7/00 ,  G01P15/08 ,  G01P15/125

    CPC classification number: G01P15/135 ,  B81B7/0016 ,  G01P15/0802 ,  G01P15/125 ,  B81B2201/0235 ,  G01P2015/0831 ,  G01P2015/0871

    Abstract: A MEMS device includes: a substrate as a base including a support portion and a detection electrode as a fixed electrode; a movable body supported to the support portion with a major surface of the movable body facing the fixed electrode; and an abutment portion facing at least a portion of an outer edge of the movable body and restricting rotational displacement in an in-plane direction of the major surface. The abutment portion includes an abutment surface including an abutment position at which the movable body abuts against the abutment portion due to the rotational displacement of the movable body, and a hollow portion provided opposing the abutment surface.

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