公开(公告)号：US10027861B2

公开(公告)日：2018-07-17

申请号：US15446759

申请日：2017-03-01

Applicant: DENSO CORPORATION

Inventor： Daisuke Takama ,  Kazuya Kushida ,  Hirokazu Saito ,  Soji Masui ,  Yasuki Furutake ,  Kazuma Yamaguchi ,  Shunsuke Ito

IPC: H04N5/225 ,  H05K1/18 ,  H05K1/02

Abstract: A camera device includes a holder in which an optical member is retained and a circuit board with an image sensor. The circuit board at least includes a stack of a solder resist, a metallic layer, and a resinous layer. A groove or recess is formed in the circuit board to have a depth extending through thicknesses of the solder resist and the metallic layer to expose a portion of an outer surface of the resinous layer. The holder is attached to the exposed portion of the outer surface of the resinous layer using an adhesive agent. An overflow stopper is formed at least round the recess to stop the adhesive agent from flowing outside the recess during a production process, thereby enhancing the degree of joining of the holder and the circuit board, and ensuring the stability in positional relation between the image sensor and the optical member.

公开(公告)号：US20170257532A1

公开(公告)日：2017-09-07

申请号：US15446759

申请日：2017-03-01

Applicant: DENSO CORPORATION

Inventor： Daisuke Takama ,  Kazuya Kushida ,  Hirokazu Saito ,  Soji Masui ,  Yasuki Furutake ,  Kazuma Yamaguchi ,  Shunsuke Ito

IPC: H04N5/225 ,  H05K1/02 ,  H05K1/18

CPC classification number: H04N5/2252 ,  H04N5/2253 ,  H04N5/2254 ,  H05K1/0274 ,  H05K1/181 ,  H05K2201/09036 ,  H05K2201/10121 ,  H05K2201/10151

Abstract: A camera device includes a holder in which an optical member is retained and a circuit board with an image sensor. The circuit board at least includes a stack of a solder resist, a metallic layer, and a resinous layer. A groove or recess is formed in the circuit board to have a depth extending through thicknesses of the solder resist and the metallic layer to expose a portion of an outer surface of the resinous layer. The holder is attached to the exposed portion of the outer surface of the resinous layer using an adhesive agent. An overflow stopper is formed at least round the recess to stop the adhesive agent from flowing outside the recess during a production process, thereby enhancing the degree of joining of the holder and the circuit board, and ensuring the stability in positional relation between the image sensor and the optical member.