公开(公告)号：US11140337B2

公开(公告)日：2021-10-05

申请号：US16200993

申请日：2018-11-27

Applicant: DENSO CORPORATION

Inventor： Yasuki Furutake ,  Yoichi Kajino ,  Kazuma Yamaguchi

IPC: H04N5/247 ,  H04N5/232 ,  H04N5/04 ,  H04N5/225 ,  G06K9/00 ,  B60R11/00 ,  H04N9/04 ,  B60R11/04

Abstract: A camera is module mounted on an inside of a windshield in a vehicle and is configured to photograph an outside of the vehicle. The camera module includes: a first camera for photographing the outside with a first imaging element through a first lens unit; and a second camera having a view angle narrower than the first camera and photographing the outside with a second imaging element through a second lens unit. The first imaging element and the second imaging element have a same pixel specification.

公开(公告)号：US10412282B2

公开(公告)日：2019-09-10

申请号：US15448236

申请日：2017-03-02

Applicant: DENSO CORPORATION

Inventor： Soji Masui ,  Yasuki Furutake ,  Daisuke Takama ,  Kazuma Yamaguchi ,  Takashi Aoki

IPC: H04N5/225 ,  H05K1/02 ,  H05K1/05 ,  H05K1/09 ,  H05K1/18

Abstract: A camera device which includes a holder which retains an optical member therein and a circuit board on which an image sensor is mounted. The holder is joined to the circuit board using an adhesive agent. The circuit board at least partially includes a metallic layer and a resinous layer stacked in a thickness-wise direction of the circuit board. The circuit board has a metallic layer-absent portion in which the metallic layer is partially omitted. The metallic layer-absent portion is located so as to overlap the joint between the holder and the circuit board in the thickness-wise direction of the circuit board, thereby minimizing the transfer of heat of the adhesive agent to the metallic layer. This achieves effective hardening the adhesive agent, which will facilitate the ease with which the camera device is assembled.

公开(公告)号：US20170257537A1

公开(公告)日：2017-09-07

申请号：US15448236

申请日：2017-03-02

Applicant: DENSO CORPORATION

Inventor： Soji Masui ,  Yasuki Furutake ,  Daisuke Takama ,  Kazuma Yamaguchi ,  Takashi Aoki

IPC: H04N5/225 ,  H05K1/09 ,  H05K1/05 ,  H05K1/02 ,  H05K1/18

CPC classification number: H04N5/2254 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2257 ,  H05K1/0274 ,  H05K1/056 ,  H05K1/09 ,  H05K1/181 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/2018 ,  Y02P70/611

Abstract: A camera device which includes a holder which retains an optical member therein and a circuit board on which an image sensor is mounted. The holder is joined to the circuit board using an adhesive agent. The circuit board at least partially includes a metallic layer and a resinous layer stacked in a thickness-wise direction of the circuit board. The circuit board has a metallic layer-absent portion in which the metallic layer is partially omitted. The metallic layer-absent portion is located so as to overlap the joint between the holder and the circuit board in the thickness-wise direction of the circuit board, thereby minimizing the transfer of heat of the adhesive agent to the metallic layer. This achieves effective hardening the adhesive agent, which will facilitate the ease with which the camera device is assembled.

公开(公告)号：US12144111B2

公开(公告)日：2024-11-12

申请号：US17647574

申请日：2022-01-10

Applicant: DENSO CORPORATION

Inventor： Hirokazu Saito ,  Soji Masui ,  Kazuma Yamaguchi

IPC: H05K1/11 ,  H01L23/00 ,  H05K1/18 ,  H05K3/24 ,  H05K3/46

Abstract: A printed circuit board capable of reducing or suppressing connection failure includes a base film made of insulating material, an electric conductor pattern formed on a front surface of the base film, and an insulating cover film covering the electric conductor pattern. The printed circuit board also includes a circuit portion with a circuit formed by the electric conductor pattern, and a pad portion with a bonding pad composed of the electric conductor pattern exposed from the insulating cover film. The pad portion has higher rigidity than the circuit portion.

公开(公告)号：US11716525B2

公开(公告)日：2023-08-01

申请号：US16363124

申请日：2019-03-25

Applicant: DENSO CORPORATION

Inventor： Nobuhisa Shimizu ,  Yasuki Furutake ,  Kensuke Chikata ,  Kazuma Yamaguchi ,  Yoichi Kajino

IPC: H04N5/225 ,  H04N23/54 ,  G02B13/04 ,  G03B17/12 ,  G02B13/18 ,  G03B17/55 ,  B60R11/04 ,  G03B17/02 ,  G02B13/00 ,  H04N23/51 ,  H04N23/698 ,  B60R11/00 ,  G03B17/56 ,  G03B11/04

CPC classification number: H04N23/54 ,  B60R11/04 ,  G02B13/0045 ,  G02B13/04 ,  G02B13/18 ,  G03B17/02 ,  G03B17/12 ,  G03B17/55 ,  H04N23/51 ,  H04N23/698 ,  B60R2011/0026 ,  B60R2011/0063 ,  G03B11/04 ,  G03B11/045 ,  G03B17/561

Abstract: A camera module, which is mounted on an inside of a front windshield of a vehicle and to image an external environment of the vehicle, includes a lens unit and an imager to image the external environment by forming an optical image, which is from the external environment through the lens unit.

公开(公告)号：US10291830B2

公开(公告)日：2019-05-14

申请号：US15956170

申请日：2018-04-18

Applicant: DENSO CORPORATION

Inventor： Nobuhisa Shimizu ,  Yasuki Furutake ,  Kensuke Chikata ,  Kazuma Yamaguchi ,  Yoichi Kajino

IPC: H04N5/225 ,  G02B13/04 ,  G03B17/12 ,  G02B13/18 ,  G03B17/55 ,  B60R11/04 ,  B60R11/00 ,  G03B17/56 ,  G03B11/04

Abstract: A camera module, which is mounted on an inside of a front windshield of a vehicle and to image an external environment of the vehicle, includes a lens unit and an imager to image the external environment by forming an optical image, which is from the external environment through the lens unit.

公开(公告)号：US11150448B2

公开(公告)日：2021-10-19

申请号：US15828125

申请日：2017-11-30

Applicant: DENSO CORPORATION

Inventor： Yasuki Furutake ,  Ken Nishioka ,  Nobuhisa Shimizu ,  Yoichi Kajino ,  Kazuma Yamaguchi ,  Kensuke Chikata ,  Takeshi Kazama ,  Soji Masui

IPC: G02B13/06 ,  G03B11/04 ,  B60R11/04 ,  G05D1/02 ,  H04N7/18 ,  H04N5/232 ,  H04N5/235 ,  H04N5/225 ,  G03B37/00 ,  B60W30/14 ,  G02B13/18 ,  G02B9/62 ,  B60R11/00

Abstract: A camera module, which is mounted on an inside of a front windshield of a vehicle and to image an external environment of the vehicle, includes a lens unit and an imager to image the external environment by forming an optical image, which is from the external environment through the lens unit.

公开(公告)号：US20180284398A1

公开(公告)日：2018-10-04

申请号：US15828125

申请日：2017-11-30

Applicant: DENSO CORPORATION

Inventor： Yasuki Furutake ,  Ken Nishioka ,  Nobuhisa Shimizu ,  Yoichi Kajino ,  Kazuma Yamaguchi ,  Kensuke Chikata ,  Takeshi Kazama ,  Soji Masui

IPC: G02B13/06 ,  G03B11/04 ,  B60R11/04 ,  G05D1/02 ,  H04N5/225 ,  H04N7/18 ,  H04N5/232 ,  H04N5/235

Abstract: A camera module, which is mounted on an inside of a front windshield of a vehicle and to image an external environment of the vehicle, includes a lens unit and an imager to image the external environment by forming an optical image, which is from the external environment through the lens unit.

公开(公告)号：US10027861B2

公开(公告)日：2018-07-17

申请号：US15446759

申请日：2017-03-01

Applicant: DENSO CORPORATION

Inventor： Daisuke Takama ,  Kazuya Kushida ,  Hirokazu Saito ,  Soji Masui ,  Yasuki Furutake ,  Kazuma Yamaguchi ,  Shunsuke Ito

IPC: H04N5/225 ,  H05K1/18 ,  H05K1/02

Abstract: A camera device includes a holder in which an optical member is retained and a circuit board with an image sensor. The circuit board at least includes a stack of a solder resist, a metallic layer, and a resinous layer. A groove or recess is formed in the circuit board to have a depth extending through thicknesses of the solder resist and the metallic layer to expose a portion of an outer surface of the resinous layer. The holder is attached to the exposed portion of the outer surface of the resinous layer using an adhesive agent. An overflow stopper is formed at least round the recess to stop the adhesive agent from flowing outside the recess during a production process, thereby enhancing the degree of joining of the holder and the circuit board, and ensuring the stability in positional relation between the image sensor and the optical member.

公开(公告)号：US20170257532A1

公开(公告)日：2017-09-07

申请号：US15446759

申请日：2017-03-01

Applicant: DENSO CORPORATION

Inventor： Daisuke Takama ,  Kazuya Kushida ,  Hirokazu Saito ,  Soji Masui ,  Yasuki Furutake ,  Kazuma Yamaguchi ,  Shunsuke Ito

IPC: H04N5/225 ,  H05K1/02 ,  H05K1/18

CPC classification number: H04N5/2252 ,  H04N5/2253 ,  H04N5/2254 ,  H05K1/0274 ,  H05K1/181 ,  H05K2201/09036 ,  H05K2201/10121 ,  H05K2201/10151

Abstract: A camera device includes a holder in which an optical member is retained and a circuit board with an image sensor. The circuit board at least includes a stack of a solder resist, a metallic layer, and a resinous layer. A groove or recess is formed in the circuit board to have a depth extending through thicknesses of the solder resist and the metallic layer to expose a portion of an outer surface of the resinous layer. The holder is attached to the exposed portion of the outer surface of the resinous layer using an adhesive agent. An overflow stopper is formed at least round the recess to stop the adhesive agent from flowing outside the recess during a production process, thereby enhancing the degree of joining of the holder and the circuit board, and ensuring the stability in positional relation between the image sensor and the optical member.