公开(公告)号：US20140347838A1

公开(公告)日：2014-11-27

申请号：US14283446

申请日：2014-05-21

Applicant: DENSO CORPORATION

Inventor： Toshihiro NAGAYA ,  Nobuhiko OKADA ,  Hiromasa HAYASHI

IPC: H01L23/495 ,  H01L21/48

CPC classification number: H01L23/49524 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/37 ,  H01L24/40 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/40245 ,  H01L2224/8385 ,  H01L2224/84385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/1305 ,  H01L2924/181 ,  Y10T29/49121 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An electronic device includes first to third terminals and a clip. The clip includes first to third joint portions and a connection portion. The first to third joint portions correspond to and are bonded to the first to third terminals, respectively. The connection portion connects the first to third joint portions. One terminal in the first to third terminals has a depressed portion depressed to one side in a predetermined direction to store a conductive bonding material. A variation in positions of the first to third terminals in the predetermined direction is absorbed by deformation of the conductive bonding material when one joint portion in the first to third joint portions corresponding to the one terminal is bonded to the one terminal through the conductive bonding material.

Abstract translation: 电子设备包括第一至第三终端和剪辑。 夹子包括第一至第三接合部分和连接部分。 第一至第三接合部分别对应于并且分别结合到第一至第三端子。 连接部分连接第一至第三接合部分。 第一至第三端子中的一个端子具有在预定方向上向一侧凹陷的凹陷部分，以存储导电接合材料。 当对应于一个端子的第一至第三接头部分的一个接合部分通过导电接合材料接合到一个端子时，第一至第三端子在预定方向上的位置变化被导电接合材料的变形吸收 。