公开(公告)号：US20190221549A1

公开(公告)日：2019-07-18

申请号：US16360341

申请日：2019-03-21

Applicant: DENSO CORPORATION

Inventor： Hiromasa HAYASHI ,  Shunsuke TOMOTO ,  Yusuke MORI

IPC: H01L25/07 ,  H01L23/00 ,  H01L23/495 ,  H01L23/31 ,  H01L23/40 ,  G01R19/00 ,  G01R15/14

CPC classification number: H01L25/072 ,  G01R15/146 ,  G01R19/0092 ,  H01L23/3121 ,  H01L23/4006 ,  H01L23/48 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/48 ,  H01L25/07 ,  H01L25/18 ,  H01L2023/4031 ,  H01L2023/4087 ,  H01L2224/40137 ,  H01L2224/45111 ,  H01L2224/45147 ,  H01L2224/45149 ,  H01L2224/45155 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/18301

Abstract: A semiconductor device includes: a first chip to restrict current flow in a first direction through a current path; a second chip to restrict the current flow in a second direction opposite to the first direction, through the current path; a wiring having one end connected to the first chip and the other end connected to the second chip, and provided as a part of the current path by relaying the first chip and the second chip; a lead frame having a first lead arranged and fixed with the first chip and a second lead is arranged and fixed with the second chip; and molding resin sealing the first chip, the second chip, the wiring and the lead frame. The wiring is a shunt resistor having a resistive body. The lead frame further has a sense terminal to detect a voltage drop across the resistive body.

公开(公告)号：US20130221532A1

公开(公告)日：2013-08-29

申请号：US13774336

申请日：2013-02-22

Applicant: DENSO CORPORATION

Inventor： Toshihiro FUJITA ,  Hiroyasu KIDOKORO ,  Hiromasa HAYASHI

IPC: H01L23/522

CPC classification number: H01L23/5228 ,  H01L24/34 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L2224/0603 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2224/84801 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00014

Abstract: In a semiconductor module, an upper arm switching element is integrated to a high-potential conductor coupled to a high-potential electrode of a power source, and a lower arm switching element is integrated to a load conductor coupled to a load. A first connecting conductor has a first end connected to the upper arm switching element and a second end connected to the load conductor. A second connecting conductor has a first end connected to the lower arm switching element and a second end connected to a low-potential conductor coupled to a low-potential electrode of the power source. At least one of the first connecting conductor and the second connecting conductor serves as a shunt resistor for detecting an electric current flowing in the at least one.

Abstract translation: 在半导体模块中，上臂开关元件集成到耦合到电源的高电位电极的高电位导体，并且下臂开关元件与耦合到负载的负载导体集成。 第一连接导体具有连接到上臂开关元件的第一端和连接到负载导体的第二端。 第二连接导体具有连接到下臂开关元件的第一端和连接到耦合到电源的低电位电极的低电位导体的第二端。 第一连接导体和第二连接导体中的至少一个用作用于检测在至少一个中流动的电流的分流电阻器。

公开(公告)号：US20140347838A1

公开(公告)日：2014-11-27

申请号：US14283446

申请日：2014-05-21

Applicant: DENSO CORPORATION

Inventor： Toshihiro NAGAYA ,  Nobuhiko OKADA ,  Hiromasa HAYASHI

IPC: H01L23/495 ,  H01L21/48

CPC classification number: H01L23/49524 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/37 ,  H01L24/40 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/40245 ,  H01L2224/8385 ,  H01L2224/84385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/1305 ,  H01L2924/181 ,  Y10T29/49121 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An electronic device includes first to third terminals and a clip. The clip includes first to third joint portions and a connection portion. The first to third joint portions correspond to and are bonded to the first to third terminals, respectively. The connection portion connects the first to third joint portions. One terminal in the first to third terminals has a depressed portion depressed to one side in a predetermined direction to store a conductive bonding material. A variation in positions of the first to third terminals in the predetermined direction is absorbed by deformation of the conductive bonding material when one joint portion in the first to third joint portions corresponding to the one terminal is bonded to the one terminal through the conductive bonding material.

Abstract translation: 电子设备包括第一至第三终端和剪辑。 夹子包括第一至第三接合部分和连接部分。 第一至第三接合部分别对应于并且分别结合到第一至第三端子。 连接部分连接第一至第三接合部分。 第一至第三端子中的一个端子具有在预定方向上向一侧凹陷的凹陷部分，以存储导电接合材料。 当对应于一个端子的第一至第三接头部分的一个接合部分通过导电接合材料接合到一个端子时，第一至第三端子在预定方向上的位置变化被导电接合材料的变形吸收 。

公开(公告)号：US20190146007A1

公开(公告)日：2019-05-16

申请号：US16245611

申请日：2019-01-11

Applicant: DENSO CORPORATION

Inventor： Junpei TAKAISHI ,  Hiromasa HAYASHI

IPC: G01R15/14 ,  H01C1/04 ,  H01C1/142 ,  H01C13/02 ,  G01R1/20 ,  G01R19/10

Abstract: A shunt resistor has a resistance element with a predetermined resistivity at least at a part, and the shunt resistor to which a bonding wire is to be connected. The bonding wire is for detecting a value of current flowing between two electrodes bridged through the shunt resistor by detecting a voltage drop at the resistance element. The shunt resistor includes: a pair of connection parts to be respectively electrically connected to the two electrodes; a bridge part having the resistance element, extending from one of the connection parts to the other of the connection parts, and bridging the pair of connection parts; and a mark configured to define a virtual line segment. The mark is arranged to allow the virtual line segment to be oblique with respect to an extending direction of the bridge part.

公开(公告)号：US20130307129A1

公开(公告)日：2013-11-21

申请号：US13895903

申请日：2013-05-16

Applicant: DENSO CORPORATION

Inventor： Toshihiro FUJITA ,  Hiroyasu KIDOKORO ,  Hiromasa HAYASHI

IPC: H01L23/495

CPC classification number: H01L23/4952 ,  H01L23/49524 ,  H01L23/49537 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/34 ,  H01L24/37 ,  H01L24/40 ,  H01L25/072 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A wiring member includes a first leg portion, a second leg portion, a third leg portion, a first connecting wall and a second connecting wall. The first leg portion is electrically connected to a first conductive portion. The second leg portion is electrically connected to a second conductive portion. The third leg portion is electrically connected to a third conductive portion. The first connecting wall connects the first leg portion and the second leg portion. The second connecting wall connects the second leg portion and the third leg portion. The first leg portion, the second leg portion, and the third leg portion are non-linearly arranged.

Abstract translation: 布线构件包括第一腿部，第二腿部，第三腿部，第一连接壁和第二连接壁。 第一腿部电连接到第一导电部分。 第二腿部电连接到第二导电部分。 第三腿部电连接到第三导电部分。 第一连接壁连接第一腿部和第二腿部。 第二连接壁连接第二腿部和第三腿部。 第一腿部分，第二腿部部分和第三腿部部分是非线性排列的。