公开(公告)号：US20190355656A1

公开(公告)日：2019-11-21

申请号：US16527543

申请日：2019-07-31

Applicant: DENSO CORPORATION

Inventor： Eiji HAYASHI ,  Ryoji UWATAKI ,  Tomomi OKUMURA

IPC: H01L23/498 ,  H01L23/12 ,  H01L23/28 ,  H01L23/40 ,  H01L23/495 ,  H01L21/56 ,  H01L23/00

Abstract: The present disclosure describes a semiconductor device including: a semiconductor chip having an electrode; a conductive member including a metal base and having a mounting portion and a peripheral portion surrounding the mounting portion; a solder that is provided between the electrode and the mounting portion; and a sealing resin body that integrally seals the semiconductor chip, at least the face opposed to the electrode in the conductive member, and the solder.