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公开(公告)号：US20220322515A1
公开(公告)日：2022-10-06
申请号：US17679622
申请日：2022-02-24
Inventor： Shohei NAGAI
Abstract: A semiconductor device includes: a substrate main body having a first surface and a second surface; an electric component arranged in the substrate main body; a surface conductor pattern arranged in a first circuit layer located on the second surface; a first internal conductor pattern and a second internal conductor pattern arranged in a second circuit layer located between the electric component and the second surface, and insulated from each other; at least one first heat conductor via extending from the electric component to the first internal conductor pattern; and at least one second heat conductor via extending from the surface conductor pattern to the second internal conductor pattern.
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公开(公告)号：US20220293485A1
公开(公告)日：2022-09-15
申请号：US17684550
申请日：2022-03-02
Inventor： Shohei NAGAI
IPC: H01L23/367
Abstract: A semiconductor device includes a semiconductor chip, a heat sink, a resin package, heat transfer material and multiple spacers. The heat sink absorbs heat of the semiconductor chip. The resin package accommodates the semiconductor chip, and the resin package has a surface at which the heat sink is disposed. The heat transfer material has fluidity, and the heat transfer material is filled between the heat sink and the cooling plate. The spacers are dispersedly arranged in the heat transfer material, and the spacers are in contact with the heat sink and the cooling plate.
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公开(公告)号：US20250096646A1
公开(公告)日：2025-03-20
申请号：US18971174
申请日：2024-12-06
Applicant: DENSO CORPORATION
Inventor： Shohei NAGAI , Jiro HAYASHI
Abstract: An EPU includes a motor unit, a blower device, and a labyrinth structure portion. The motor unit includes a motor, an inverter, and a unit housing. The unit housing accommodates the motor and the inverter in a unit space. In the unit housing, a unit inlet port and a unit outlet port are in communication with the unit space. In the EPU, as the blower device blows air, cooling air flows into the unit space from the unit inlet port and flows out from the unit outlet port. The cooling air flows into the unit inlet port after passing through the labyrinth structure portion. In the labyrinth structure portion, foreign matter is removed from the cooling air.
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公开(公告)号：US20220319953A1
公开(公告)日：2022-10-06
申请号：US17679314
申请日：2022-02-24
Inventor： Shohei NAGAI , Masaki AOSHIMA
IPC: H01L23/373 , H01L23/498
Abstract: A semiconductor device includes a substrate main body having a first surface and a second surface, an electric component arranged in the substrate main body, a first internal conductor pattern arranged in a first circuit layer located between the first surface and the electric component, and at least one heat absorbing member arranged inside the substrate main body and thermally connected to the first internal conductor pattern.
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Patent Agency Ranking
公开(公告)号：US20220310549A1
公开(公告)日：2022-09-29
申请号：US17688992
申请日：2022-03-08
Inventor： Shohei NAGAI
IPC: H01L23/00
Abstract: A semiconductor device includes a substrate, a semiconductor element and a tin-based solder layer. The semiconductor element faces the substrate in a normal direction of the substrate. The normal direction corresponds to a normal line of the substrate. The tin-based solder layer joins the semiconductor element to the substrate. The tin-based solder layer a central portion and a peripheral portion surrounding the central portion. The tin-based solder layer has a tin crystal with a C-axis at each of the central portion and the peripheral portion. The C-axis at the central portion intersects the normal line at an angle larger than 45 degrees with respect to the normal line. The C-axis at the peripheral portion either intersects the normal line at an angle smaller than or equal to 45 degrees with respect to the normal line, or is parallel to the normal line.
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公开(公告)号：US20220304198A1
公开(公告)日：2022-09-22
申请号：US17684469
申请日：2022-03-02
Inventor： Shohei NAGAI
IPC: H05K7/20 , H01L23/473 , H02M7/537
Abstract: A power converter includes: a semiconductor module that includes a semiconductor element for power conversion, the semiconductor module having a module surface on which an input terminal electrically connected to the semiconductor element is disposed; a capacitor in which a capacitor terminal is disposed, the capacitor having a capacitor surface facing the module surface; a cooler that is disposed between the semiconductor module and the capacitor; and a connecting member that electrically connects the input terminal and the capacitor terminal.
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公开(公告)号：US20250105703A1
公开(公告)日：2025-03-27
申请号：US18971201
申请日：2024-12-06
Applicant: DENSO CORPORATION
Inventor： Shohei NAGAI , Jiro HAYASHI
Abstract: An EPU includes a motor device, an inverter device, a unit housing, and a cooling device. The motor device includes a motor and a motor housing. The inverter device includes an inverter and an inverter housing. The motor and the inverter are accommodated in the unit housing. The cooling device includes a refrigerant passage and a refrigerant pump. The refrigerant pump causes a refrigerant to flow so as to circulate through the refrigerant passage. The refrigerant flowing through the refrigerant passage cools both the motor device and the inverter device.
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公开(公告)号：US20250030334A1
公开(公告)日：2025-01-23
申请号：US18910088
申请日：2024-10-09
Applicant: DENSO CORPORATION
Inventor： Shohei NAGAI , Kazuya Takeuchi , Hiroshi Taki , Takahiro Tera
IPC: H02M1/32 , B60L50/51 , B60L50/60 , H02M7/00 , H02M7/5387
Abstract: An inverter device includes an inverter housing and an arm switch unit. The inverter housing includes an inverter outer peripheral wall and an inverter fin. The inverter outer peripheral wall has an outer peripheral surface and an inner peripheral surface and extends annularly around an inverter axis. The inverter fin is provided on the outer peripheral surface and extends toward a radially outer side from the outer peripheral surface. Multiple arm switch units are arranged in a circumferential direction and are fixed to the inner peripheral surface. The arm switch unit is a heat generation component that generates heat by energization. Heat transferred to the inner peripheral surface from the arm switch unit is dissipated to the outside from the outer peripheral surface of the inverter outer peripheral wall.
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公开(公告)号：US20220285245A1
公开(公告)日：2022-09-08
申请号：US17678240
申请日：2022-02-23
Inventor： Shohei NAGAI
IPC: H01L23/427 , H01L23/367
Abstract: A semiconductor module includes a substrate, a semiconductor element and a heat sink plate. The substrate is included in a circuit board. The semiconductor element is disposed at the heat sink plate inside the substrate. A fluid is sealed inside the heat sink plate.
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