公开(公告)号：US20170144882A1

公开(公告)日：2017-05-25

申请号：US15300363

申请日：2015-04-17

Applicant: DENSO CORPORATION

Inventor： Nobukazu OBA ,  Yasuhiro YAMASHITA ,  Wataru KOBAYASHI ,  Eiji HAYASHI

IPC: B81B7/00 ,  G01L23/24 ,  G01L9/00

CPC classification number: B81B7/0058 ,  B81B2201/0264 ,  G01L9/00 ,  G01L9/0054 ,  G01L23/24 ,  H01L23/24 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device includes: a semiconductor element; a case; a terminal made of a conductive material and embedded in the case, a part of the terminal being exposed to the outside, having an outermost surface that includes a first film, and having a base portion; a bonding wire that is connected to the first film and electrically connects the semiconductor element and the terminal; and a protection member that is more flexible than the case and covers a contact portion of the terminal contacting with the bonding wire. The first film is removed from an area around the contact portion with the bonding wire in the part of the terminal being exposed to the outside, causing the base portion to be exposed. An exposed portion of the base portion and the protection member adhere to each other.