PRESSURE SENSOR
    2.
    发明申请
    PRESSURE SENSOR 审中-公开

    公开(公告)号:US20190204171A1

    公开(公告)日:2019-07-04

    申请号:US16296920

    申请日:2019-03-08

    申请人: DENSO CORPORATION

    IPC分类号: G01L9/00 B81B7/00

    摘要: A pressure sensor may include a sensor chip and a support member. The sensor chip may include a diaphragm and an inner space. The diaphragm may have a thin plate shape. The diaphragm may be bent in a thickness direction by a fluid pressure. The inner space may be provided by a space adjacent to the diaphragm in the thickness direction. The support member may support the sensor chip at a position separated from the diaphragm. An outer shape of the sensor chip may be provided by a polygonal shape or a circular shape. An outer shape of the diaphragm may be provided by a polygonal shape or a circular shape.

    Pressure sensor
    6.
    发明授权

    公开(公告)号:US09983081B2

    公开(公告)日:2018-05-29

    申请号:US15111494

    申请日:2015-02-27

    申请人: DENSO CORPORATION

    发明人: Kazuyuki Oono

    摘要: A pressure sensor includes: a first substrate having first and second diaphragms on one surface provided by first and second recesses on another surface; first and second detecting elements on the first and second diaphragms; a second substrate providing a first reference pressure chamber with the one surface of the first substrate; a third substrate providing a second reference pressure chamber sealing the second recess; and a calculator calculating an offset value by a difference between a reference signal and an inspection signal and detecting a pressure of a measurement medium by a difference between a detection signal and the offset value. The first detecting element outputs the detection signal or the inspection signal according to a pressure difference between a first reference pressure or a reference medium pressure and a measurement medium pressure in the first recess. The second detecting element outputs the reference signal according to a difference between the first reference pressure and and a second reference pressure.

    MICROELECTROMECHANICAL GAS SENSOR BASED ON KNUDSEN THERMAL FORCE
    10.
    发明申请
    MICROELECTROMECHANICAL GAS SENSOR BASED ON KNUDSEN THERMAL FORCE 审中-公开
    基于KENDSEN热力的微电子气体传感器

    公开(公告)号:US20160363553A1

    公开(公告)日:2016-12-15

    申请号:US15183259

    申请日:2016-06-15

    IPC分类号: G01N27/22

    CPC分类号: G01L9/00 G01L21/26 G01N27/226

    摘要: A microelectromechanical (MEMS) gas sensor operating based on Knudsen thermal force is disclosed. The sensor includes a substrate, at least one stationary assembly that is fixedly coupled to the substrate, and at least one moveable assembly that is positioned above the substrate which is biased to move substantially according to a main axis and juxtaposed with the at least one stationary assembly.

    摘要翻译: 公开了基于Knudsen热力操作的微机电(MEMS)气体传感器。 所述传感器包括基底,固定地联接到所述基底的至少一个固定组件和位于所述基底上方的至少一个可移动组件,所述至少一个可移动组件被偏置以基本上沿着主轴线移动并且与所述至少一个固定 部件。