公开(公告)号：US20210138763A1

公开(公告)日：2021-05-13

申请号：US17150057

申请日：2021-01-15

Applicant: DENSO CORPORATION

Inventor： Masami SAITO ,  Koji KONDO ,  Masashi TOTOKAWA ,  Hirotaka MIYANO ,  Yoshitake SUGANUMA ,  Kenichi YAGI ,  Yuichi KATO ,  Kunio MORI ,  Katsuhito MORI ,  Taiga HANDA

IPC: B32B7/12 ,  F28F1/32 ,  F28F21/08 ,  H01L23/36 ,  H05K7/20 ,  B32B37/14 ,  B32B15/08

Abstract: A bonded structure has a first bonded member with a first bonding surface, a second bonded member with a second bonding surface, and a bonding resin layer containing a polymer, disposed between the first bonding surface and the second bonding surface. The polymer in the bonding resin layer has polymer main chains oriented in an intersecting direction that intersects with the first bonding surface and the second bonding surface. The intersecting direction preferably extends along the thickness direction of the bonding resin layer. A heat exchanger has the bonded structure, and the first bonded member serves as a tubular member, and the second bonded member serves as a heat dissipation fin.