公开(公告)号：US20200219639A1

公开(公告)日：2020-07-09

申请号：US16825917

申请日：2020-03-20

Applicant: DENSO CORPORATION

Inventor： Yuya KIUCHI

IPC: H01C1/028 ,  H01C1/14

Abstract: A resistor unit has a case with an opening face, a resistor housed in the case, cement that is filled inside the case to bury the resistor, and a lead-out terminal that is connected to the resistor in the cement and is led out of the cement through the opening face of the case. A lead-out terminal has a protrusion portion that protrudes in an opening direction that is across the opening face, and an extension portion that extends parallel to the opening face from the protrusion portion.

公开(公告)号：US20200312572A1

公开(公告)日：2020-10-01

申请号：US16802690

申请日：2020-02-27

Applicant: DENSO CORPORATION

Inventor： Yuya KIUCHI ,  Kenshiro HIDA

IPC: H01G4/38 ,  H01G4/40 ,  H02G5/02

Abstract: A capacitor unit includes a capacitor having a positive electrode and a negative electrode, a positive bus bar, a negative bus bar, a sealing resin, an insulator. The positive bus bar and the negative bus bar are respectively connected to the positive electrode and the negative electrode. The sealing resin seals the capacitor, a part of the positive bus bar, and a part of the negative bus bar. The insulator is located between the positive bus bar and the negative bus bar. The insulator includes a recess recessed from either surface of the insulator facing the positive bus bar or the negative bus bar. At least a part of the recess is exposed from the sealing resin.

公开(公告)号：US20180358903A1

公开(公告)日：2018-12-13

申请号：US16002339

申请日：2018-06-07

Applicant: DENSO CORPORATION

Inventor： Nobuaki TAKAHASHI ,  Yuya KIUCHI ,  Kenshiro HIDA

IPC: H02M7/00 ,  H01L23/46 ,  H05K5/04 ,  H05K7/20

CPC classification number: H02M7/003 ,  H01L23/46 ,  H02M7/5387 ,  H02P5/74 ,  H05K5/04 ,  H05K7/2089

Abstract: In a power converter, a semiconductor module incorporates therein a semiconductor element constituting a power converter circuit. A smoothing capacitor is configured to smooth a direct-current voltage applied to the semiconductor module. A pair of positive and negative busbars is configured to electrically connect the semiconductor module and the smoothing capacitor. The positive and negative busbars are arranged to face each other with a predetermined space therebetween. A discharge resistor is connected in parallel with the smoothing capacitor via the positive and negative busbars, and is configured such that an electrical charge stored in the smoothing capacitor flows through the discharge resistor as a discharge current. The positive and negative busbars are interposed between the discharge resistor and the smoothing capacitor.