公开(公告)号：US20230015183A1

公开(公告)日：2023-01-19

申请号：US17905265

申请日：2021-02-26

Applicant: DEXERIALS CORPORATION

Inventor： Hidetsugu NAMIKI ,  Takeshi NISHIO ,  Yasumasa SHIN ,  Daiki NODA

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/62

Abstract: A repairing component including a micro-LED chip including an electrode and having an electrode plane on which the electrode is disposed, and an anisotropic conductive layer disposed to be in contact with the electrode disposed on the electrode plane of the micro-LED chip, where the anisotropic conductive layer has an area matching with an area of the electrode plane.

公开(公告)号：US20240162405A1

公开(公告)日：2024-05-16

申请号：US18282583

申请日：2022-03-23

Applicant: DEXERIALS CORPORATION

Inventor： Daiki NODA ,  Reiji TSUKAO ,  Toshiki SHIRAIWA

IPC: H01L33/62 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L2933/0066

Abstract: A display device includes a plurality of light emitting elements, a substrate, and a cured resin film. The substrate has the plurality of light emitting elements thereon. The plurality of light emitting elements form an array, each corresponding to a subpixel constituting one picture element. The cured resin film connects the plurality of light emitting elements and the substrate. The cured resin film is composed of a plurality of individual pieces and has an exposed portion in which the substrate is exposed between the plurality of individual pieces.

公开(公告)号：US20230369531A1

公开(公告)日：2023-11-16

申请号：US18030003

申请日：2022-03-23

Applicant: DEXERIALS CORPORATION ,  SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Daiki NODA ,  Reiji TSUKAO ,  Toshiki SHIRAIWA ,  Kazumu WATANABE ,  Naoki HAYASHI ,  Hiroshi YAMAOKA ,  Satoki NAKADA ,  Takeshi SAITO ,  Nobutaka UEMORI

IPC: H01L33/00 ,  H01L25/075

CPC classification number: H01L33/005 ,  H01L25/0753 ,  H01L2933/0025 ,  H01L2933/0066

Abstract: A method of manufacturing a display device capable of reducing tact time includes: a transfer step of arranging an anisotropic conductive adhesive layer provided on a base material that is transparent to laser light and a wiring board to face each other, and irradiating laser light from the base material side so that individual pieces of the anisotropic conductive adhesive layer are transferred to and arranged at predetermined positions on the wiring board; and a mounting step of mounting light-emitting elements on the individual pieces arranged at the predetermined positions on the wiring board. The individual pieces of the anisotropic conductive adhesive layer are able to be transferred and arranged with high precision and high efficiency by irradiation of laser light.