公开(公告)号：US20160202801A1

公开(公告)日：2016-07-14

申请号：US14915960

申请日：2014-09-04

Applicant: DEXERIALS CORPORATION

Inventor： Hirokazu ODAGIRI ,  Yukio MURAKAMI ,  Yoshiaki IMAMURA ,  Yukihiro ONODERA ,  Masato ISHIGAKI ,  Makoto INOUE

IPC: G06F3/044

CPC classification number: G06F3/044 ,  G06F2203/04102 ,  G06F2203/04103

Abstract: Thickness and weight are lowered while reducing warping and guaranteeing visibility of the screen. Included are a transparent panel substrate including a transparent resin base and a transparent resin layer formed on one surface of the transparent resin base; a decorative printing layer formed at an outer edge of a back surface of the transparent panel substrate; a warping prevention layer, formed to be flat and to cover the back surface of the transparent panel substrate inside the decorative printing layer and a back surface of the decorative printing layer; a transparent electrode layer formed on a back surface of the warping prevention layer; a jumper wiring layer formed on the transparent electrode layer and provided with an insulating layer; and a transparent protective layer formed on and entirely covering the jumper wiring layer except for a thermocompression bonding region of a substrate for external connection.

Abstract translation: 降低厚度和重量，同时减少翘曲并保证屏幕的可视性。 包括透明面板基板，其包括透明树脂基底和形成在透明树脂基底的一个表面上的透明树脂层; 形成在所述透明面板基板的背面的外缘的装饰性印刷层; 翘曲防止层，其形成为平坦的并覆盖在装饰性印刷层内部的透明面板基板的背面和装饰印刷层的背面; 形成在所述翘曲防止层的背面的透明电极层; 跨接布线层，形成在透明电极层上并具有绝缘层; 以及除了用于外部连接的基板的热压接区域之外形成并完全覆盖跨接布线层的透明保护层。

公开(公告)号：US20240384147A1

公开(公告)日：2024-11-21

申请号：US18690044

申请日：2022-08-22

Applicant: DEXERIALS CORPORATION

Inventor： Yijing ZHAO ,  Hiroki SHIBUYA ,  Yuki IWATA ,  Takeshi NISHIO ,  Makoto INOUE ,  Ryoko KAWAKAMI

IPC: C09K5/14 ,  C08G65/26 ,  C08J5/18 ,  C08K3/08 ,  C08K9/02

Abstract: A thermally conductive composition including a curable component, a curing agent configured to cure the curable component, and a metallic filler is provided. The metallic filler contains thermally conductive particles and low-melting-point metallic particles. A volume average particle diameter of the thermally conductive particles is greater than a volume average particle diameter of the low-melting-point metallic particles. A melting point of the low-melting-point metallic particles is lower than a thermal curing treatment temperature of the thermally conductive composition.