公开(公告)号：US20240384147A1

公开(公告)日：2024-11-21

申请号：US18690044

申请日：2022-08-22

Applicant: DEXERIALS CORPORATION

Inventor： Yijing ZHAO ,  Hiroki SHIBUYA ,  Yuki IWATA ,  Takeshi NISHIO ,  Makoto INOUE ,  Ryoko KAWAKAMI

IPC: C09K5/14 ,  C08G65/26 ,  C08J5/18 ,  C08K3/08 ,  C08K9/02

Abstract: A thermally conductive composition including a curable component, a curing agent configured to cure the curable component, and a metallic filler is provided. The metallic filler contains thermally conductive particles and low-melting-point metallic particles. A volume average particle diameter of the thermally conductive particles is greater than a volume average particle diameter of the low-melting-point metallic particles. A melting point of the low-melting-point metallic particles is lower than a thermal curing treatment temperature of the thermally conductive composition.