公开(公告)号：US20240165766A1

公开(公告)日：2024-05-23

申请号：US18509631

申请日：2023-11-15

Applicant: DISCO CORPORATION

Inventor： Mato HATTORI ,  Hironobu OZAWA

IPC: B24B37/013

CPC classification number: B24B37/013

Abstract: A grinding method of a workpiece includes a holding step of holding the workpiece on a holding surface of a chuck table, a grinding step of, after the holding step, measuring a thickness of the workpiece in a non-contact region other than a contact region between the workpiece and grinding stones while grinding the workpiece with a grinding wheel including the grinding stones, and a measurement step of, after the grinding step, relatively moving and separating the workpiece and the grinding stones from each other, and measuring the thickness of the workpiece in the contact region during or after the relative movement of the workpiece and the grinding stones.

公开(公告)号：US20240194501A1

公开(公告)日：2024-06-13

申请号：US18529690

申请日：2023-12-05

Applicant: DISCO CORPORATION

Inventor： Kentaro IIZUKA ,  Kazuya HIRATA ,  Hayato IGA ,  Hironobu OZAWA ,  Mato HATTORI ,  Hideo IWATA

IPC: H01L21/67 ,  B23K26/364

CPC classification number: H01L21/67092 ,  B23K26/364 ,  H01L21/67155 ,  H01L21/67242

Abstract: A processing apparatus includes a chuck table for holding a bonded wafer thereon, a grinding unit for grinding the bonded wafer, a cleaning unit for cleaning the bonded wafer, and a processing unit for removing a beveled portion of an outer circumferential end portion of the bonded wafer before the grinding unit grinds the bonded wafer. The processing unit includes a support for supporting the bonded wafer with a surface thereof being exposed and a laser beam applying unit for emitting a laser beam having a wavelength transmittable through the wafer. The laser beam applying unit applies the laser beam to the wafer supported on the support, from the exposed surface, while positioning a focused spot thereof within the outer circumferential excessive region of the wafer, to form a modified layer in the wafer along which to remove the beveled portion from the wafer.

公开(公告)号：US20220262641A1

公开(公告)日：2022-08-18

申请号：US17649625

申请日：2022-02-01

Applicant: DISCO CORPORATION

Inventor： Mato HATTORI ,  Ichiro YAMAHATA

IPC: H01L21/304 ,  B24B37/04 ,  B24B27/00

Abstract: A grinding apparatus includes a first grinding mechanism, a second grinding mechanism, and a third grinding mechanism for grinding wafers held on respective chuck tables. The first grinding mechanism and the second grinding mechanism are positioned with respect to the chuck tables such that a second ground mark produced on a wafer by second grindstones of the second grinding mechanism as it grinds the wafer extends across a first ground mark produced on the wafer by first grindstones of the first grinding mechanism as it grinds the wafer. The second grinding mechanism and the third grinding mechanism are positioned with respect to the chuck tables such that a third ground mark produced on the wafer by third grindstones of the third grinding mechanism as it grinds the wafer extends across the second ground mark produced on the wafer by the second grindstones.