公开(公告)号：US20220250192A1

公开(公告)日：2022-08-11

申请号：US17649414

申请日：2022-01-31

Applicant: DISCO CORPORATION

Inventor： Kentaro IIZUKA

IPC: B23K26/70 ,  B23K26/06 ,  B23K26/08

Abstract: A laser processing apparatus includes a chuck table configured to hold a workpiece, a laser beam irradiating unit having a condenser configured to condense and apply a laser beam to the workpiece held on the chuck table, a moving unit configured to move the chuck table and a condensing point of the laser beam relative to each other, a measuring unit configured to measure a beam profile of the laser beam; and a control unit configured to control each constituent element. The measuring unit is disposed adjacent to the chuck table so as to have a light receiving surface parallel with a holding surface of the chuck table.

公开(公告)号：US20210327733A1

公开(公告)日：2021-10-21

申请号：US17211176

申请日：2021-03-24

Applicant: DISCO CORPORATION

Inventor： Kentaro IIZUKA ,  Ryohei YAMAMOTO

IPC: H01L21/67 ,  H01L21/677

Abstract: A wafer forming apparatus includes a conveying tray having an ingot accommodating section that accommodates a semiconductor ingot and a wafer accommodating section that accommodates a wafer formed from the semiconductor ingot, a belt conveyor unit that conveys the conveying tray to each processing apparatus, a cassette rack on which cassettes accommodating the wafers are placed correspondingly to the conveying trays, and a transferring unit that transfers the wafer from the wafer accommodating section of the conveying tray to the cassette placed on the cassette rack. The conveying tray is provided with an identification mark. The cassette rack or the cassette corresponding to the conveying tray is provided with the same identification mark as the identification mark provided on the conveying tray.

公开(公告)号：US20230201977A1

公开(公告)日：2023-06-29

申请号：US18068669

申请日：2022-12-20

Applicant: DISCO CORPORATION

Inventor： Kentaro IIZUKA

IPC: B23K37/04 ,  B23K26/402 ,  B23K26/38

CPC classification number: B23K37/04 ,  B23K26/402 ,  B23K26/38

Abstract: A holding table assembly has a base that includes three or more cylinder sections spaced apart at regular intervals in a circumferential direction, a circular recess formed at an upper part thereof, and a flow channel communicating with the cylinder sections and the circular recess. A holding table includes a holding surface inserted into the circular recess of the base that holds an ingot under suction. A circular plate has a plurality of minute holes and insertion holes formed at positions corresponding to each of the cylinder sections and spaced apart at regular intervals in the circumferential direction. Pistons are inserted in the cylinder sections, the number of pistons being equal to the number of cylinder sections, and support pins of which base ends abut against the pistons and tip ends are inserted in the insertion holes.

公开(公告)号：US20190181024A1

公开(公告)日：2019-06-13

申请号：US16209285

申请日：2018-12-04

Applicant: DISCO CORPORATION

Inventor： Kentaro IIZUKA ,  Naoki OMIYA

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/673

Abstract: A wafer producing apparatus includes: an ingot grinding unit configured to grind and planarize an upper surface of an ingot held by a first holding table; a laser applying unit configured to apply a laser beam of such a wavelength as to be transmitted through the ingot to the ingot, with a focal point of the laser beam positioned at a depth corresponding to the thickness of a wafer to be produced from an upper surface of the ingot held by a second holding table, to form a peel-off layer; a wafer peeling unit configured to hold the upper surface of the ingot held by a third holding table and peel off the wafer from the peel-off layer; and a carrying tray having an ingot support section configured to support the ingot and a wafer support section configured to support the wafer.

公开(公告)号：US20240194501A1

公开(公告)日：2024-06-13

申请号：US18529690

申请日：2023-12-05

Applicant: DISCO CORPORATION

Inventor： Kentaro IIZUKA ,  Kazuya HIRATA ,  Hayato IGA ,  Hironobu OZAWA ,  Mato HATTORI ,  Hideo IWATA

IPC: H01L21/67 ,  B23K26/364

CPC classification number: H01L21/67092 ,  B23K26/364 ,  H01L21/67155 ,  H01L21/67242

Abstract: A processing apparatus includes a chuck table for holding a bonded wafer thereon, a grinding unit for grinding the bonded wafer, a cleaning unit for cleaning the bonded wafer, and a processing unit for removing a beveled portion of an outer circumferential end portion of the bonded wafer before the grinding unit grinds the bonded wafer. The processing unit includes a support for supporting the bonded wafer with a surface thereof being exposed and a laser beam applying unit for emitting a laser beam having a wavelength transmittable through the wafer. The laser beam applying unit applies the laser beam to the wafer supported on the support, from the exposed surface, while positioning a focused spot thereof within the outer circumferential excessive region of the wafer, to form a modified layer in the wafer along which to remove the beveled portion from the wafer.

公开(公告)号：US20220410320A1

公开(公告)日：2022-12-29

申请号：US17806828

申请日：2022-06-14

Applicant: DISCO CORPORATION

Inventor： Kentaro IIZUKA

IPC: B23K26/53 ,  B23K26/00 ,  B28D5/00

Abstract: Provided that is a marking machine for applying markings to an ingot having separating layers formed at a depth corresponding to a thickness of a wafer to be produced. The marking machine includes a reading unit configured to read the ingot information formed on the ingot, a control unit having a storage section configured to store the ingot information read by the reading unit, and a marking unit configured to mark, based on the ingot information stored in the storage section, information that includes the ingot information, to the wafer to be produced.

公开(公告)号：US20210265186A1

公开(公告)日：2021-08-26

申请号：US17168349

申请日：2021-02-05

Applicant: DISCO CORPORATION

Inventor： Kentaro IIZUKA

IPC: H01L21/673

Abstract: A carrier tray includes a housing, an ingot accommodating recess that accommodates a semiconductor ingot, and a wafer accommodating recess that accommodates a wafer. The housing has an upper wall, a lower wall, a pair of side walls connecting the upper wall and the lower wall to each other, and a tunnel defined by the upper wall, the lower wall, and the pair of side walls. A plurality of levers each of which has a point of application projecting from a bottom surface of the ingot accommodating recess, a point of action projecting from a side surface of the ingot accommodating recess, and a fulcrum formed between the point of application and the point of action are each attached to the housing so as to be rotatable around the fulcrum.

公开(公告)号：US20210193482A1

公开(公告)日：2021-06-24

申请号：US17118755

申请日：2020-12-11

Applicant: DISCO CORPORATION

Inventor： Kentaro IIZUKA

IPC: H01L21/56 ,  H01L21/78 ,  H01L21/67 ,  H01L23/00

Abstract: A workpiece processing method includes a holding step of holding a workpiece with a front surface of the workpiece directed downward so as to face an upper surface side of a base supplied with a fluid curable resin, a coating step of moving the workpiece downward to press the workpiece against the curable resin, thereby coating the whole of the front surface of the workpiece with the curable resin such that the curable resin enters gaps between bumps and the front surface and the bumps are embedded in the curable resin, a curing step of curing the curable resin to form a resin film, a laser beam applying step of removing the resin film on each street, and a dividing step of supplying a gas plasma to the workpiece to divide the workpiece along each street into individual device chips with the resin film as a mask.