公开(公告)号：US20220262641A1

公开(公告)日：2022-08-18

申请号：US17649625

申请日：2022-02-01

Applicant: DISCO CORPORATION

Inventor： Mato HATTORI ,  Ichiro YAMAHATA

IPC: H01L21/304 ,  B24B37/04 ,  B24B27/00

Abstract: A grinding apparatus includes a first grinding mechanism, a second grinding mechanism, and a third grinding mechanism for grinding wafers held on respective chuck tables. The first grinding mechanism and the second grinding mechanism are positioned with respect to the chuck tables such that a second ground mark produced on a wafer by second grindstones of the second grinding mechanism as it grinds the wafer extends across a first ground mark produced on the wafer by first grindstones of the first grinding mechanism as it grinds the wafer. The second grinding mechanism and the third grinding mechanism are positioned with respect to the chuck tables such that a third ground mark produced on the wafer by third grindstones of the third grinding mechanism as it grinds the wafer extends across the second ground mark produced on the wafer by the second grindstones.

公开(公告)号：US20210057225A1

公开(公告)日：2021-02-25

申请号：US16999513

申请日：2020-08-21

Applicant: DISCO CORPORATION

Inventor： Hideyuki SANDOH ,  Ichiro YAMAHATA ,  Tomotaka TABUCHI

IPC: H01L21/304 ,  H01L21/3065

Abstract: There is provided a wafer processing method for reducing a thickness of a wafer. The wafer has a front side and a back side opposite to the front side. The wafer has a device area where a plurality of devices are formed on the front side and a peripheral marginal area including a curved peripheral edge. A protective layer for covering the plural devices are formed on the front side in the device area. The wafer processing method includes a plasma etching step of supplying an etching gas in a plasma condition to the front side of the wafer by using the protective layer as a mask, thereby removing the peripheral marginal area including the curved peripheral edge, a protective member attaching step of attaching a protective member to the front side of the wafer, and a grinding step of grinding the back side of the wafer.

公开(公告)号：US20210229228A1

公开(公告)日：2021-07-29

申请号：US17141642

申请日：2021-01-05

Applicant: DISCO CORPORATION

Inventor： Ichiro YAMAHATA

IPC: B23Q3/04

Abstract: There is provided an inclination adjusting mechanism including an annular upper plate that has an upper surface for connecting a table and a lower surface inclined relative to the upper surface, an annular lower plate that has an upper surface parallel to the lower surface of the upper plate and a lower surface parallel to the upper surface of the upper plate and facing an upper surface of a base, an upper rotating mechanism that rotates the upper plate, a lower rotating mechanism that rotates the lower plate, a first bearing provided between the lower surface of the upper plate and the upper surface of the lower plate, a second bearing provided between the lower surface of the lower plate and the upper surface of the base, and a connecting mechanism that connects the upper plate, the lower plate, and the base.

公开(公告)号：US20190206673A1

公开(公告)日：2019-07-04

申请号：US16216394

申请日：2018-12-11

Applicant: DISCO CORPORATION

Inventor： Shinya WATANABE ,  Ichiro YAMAHATA ,  Katsuhiko SUZUKI

IPC: H01L21/02 ,  H01L21/67 ,  H01L21/78 ,  H01L21/687 ,  B24B53/017

CPC classification number: H01L21/02013 ,  B24B53/017 ,  H01L21/67092 ,  H01L21/6715 ,  H01L21/68764 ,  H01L21/78

Abstract: A workpiece processing method includes a resin coating step of coating a resin on a front surface of a workpiece, a resin curing step of applying an ultraviolet ray to the coated resin to be cured, a resin grinding step of grinding the cured resin with grinding stones to be flattened, and a workpiece grinding step of holding the flattened resin side of the workpiece on a chuck table and grinding the back surface of the workpiece with grinding stones. In the resin grinding step, grinding is performed while cleaning the resin stuck to the grinding stones. Accordingly, it is possible to grind the resin coated on the front surface of the workpiece and the back surface of the workpiece in the same apparatus.

公开(公告)号：US20190198357A1

公开(公告)日：2019-06-27

申请号：US16216291

申请日：2018-12-11

Applicant: DISCO CORPORATION

Inventor： Shinya WATANABE ,  Ichiro YAMAHATA ,  Katsuhiko SUZUKI

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/78 ,  H01L21/66

CPC classification number: H01L21/6715 ,  H01L21/67092 ,  H01L21/67253 ,  H01L21/6773 ,  H01L21/78 ,  H01L22/12

Abstract: A workpiece processing apparatus which coats a front surface of a workpiece with a resin, the workpiece having devices formed in regions demarcated by a plurality of planned dividing lines formed in a lattice manner. The workpiece processing apparatus includes a cassette mounting base mounted with a cassette housing a plurality of workpieces, a resin coating unit that coats the front surface of the workpiece with the resin, a resin curing unit that cures the resin by applying an external stimulus to the coated resin, a resin grinding unit that flattens the cured resin by grinding the cured resin by a rotating grinding stone, and a conveying mechanism that conveys the workpiece between the units.