公开(公告)号：US20240227100A1

公开(公告)日：2024-07-11

申请号：US18405135

申请日：2024-01-05

Applicant: DISCO CORPORATION

Inventor： Naoki OMIYA ,  Kazuki MORI

IPC: B23Q3/08

CPC classification number: B23Q3/084

Abstract: A jig for use in manufacturing a wafer from an ingot and for being delivered while being integrated with the ingot includes a base having a holding mechanism for holding the ingot such that the ingot protrudes therefrom and an information recording member fixed to the base for recording individual information of the ingot identifiably therein. Preferably, the base has a disk-shaped recess defined therein that has a predetermined depth for accommodating a bottom portion of the ingot therein.

公开(公告)号：US20190181024A1

公开(公告)日：2019-06-13

申请号：US16209285

申请日：2018-12-04

Applicant: DISCO CORPORATION

Inventor： Kentaro IIZUKA ,  Naoki OMIYA

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/673

Abstract: A wafer producing apparatus includes: an ingot grinding unit configured to grind and planarize an upper surface of an ingot held by a first holding table; a laser applying unit configured to apply a laser beam of such a wavelength as to be transmitted through the ingot to the ingot, with a focal point of the laser beam positioned at a depth corresponding to the thickness of a wafer to be produced from an upper surface of the ingot held by a second holding table, to form a peel-off layer; a wafer peeling unit configured to hold the upper surface of the ingot held by a third holding table and peel off the wafer from the peel-off layer; and a carrying tray having an ingot support section configured to support the ingot and a wafer support section configured to support the wafer.