公开(公告)号：US20190308399A1

公开(公告)日：2019-10-10

申请号：US16375041

申请日：2019-04-04

Applicant: DISCO CORPORATION

Inventor： Takashi MORI ,  Yoshikuni MIGIYAMA ,  Yuta TANIYAMA ,  Mitsuru IKUSHIMA ,  Shinichi NAMIOKA ,  Makoto SAITO ,  Emiko KAWAMURA ,  Yoshinori KAKINUMA ,  Kazuki SUGIURA

IPC: B32B37/02 ,  H01L23/00 ,  B32B37/12 ,  B32B38/00 ,  C09J5/00

Abstract: A protective sheet disposing method of disposing a protective sheet on a top surface of a wafer in which a device region having a plurality of devices formed thereon and a peripheral surplus region surrounding the device region are formed, the protective sheet disposing method including: a first protective sheet preparing step of preparing a first protective sheet having a non-adhesive portion corresponding to the device region and an adhesive portion having an adhesive layer laid on a periphery of the non-adhesive portion; a protective sheet affixing step of affixing the first protective sheet to the peripheral surplus region; a liquid resin dropping step of dropping a liquid resin onto a region of a second protective sheet; an integrating step of integrating the first protective sheet and the second protective sheet with each other; and a cutting step of cutting the first protective sheet and the second protective sheet.

公开(公告)号：US20200043754A1

公开(公告)日：2020-02-06

申请号：US16527692

申请日：2019-07-31

Applicant: DISCO CORPORATION

Inventor： Shinichi NAMIOKA

IPC: H01L21/67 ,  B05C1/02 ,  H01L21/304 ,  H01L21/683 ,  H01L21/02

Abstract: A holding table for holding a wafer includes plural pins, and a wafer holding surface includes the tips of the plural pins. Therefore, small dust enters between the pins and thus is less readily left between the wafer holding surface and the wafer. Therefore, when the wafer is sucked and held, a gap is less readily made between the wafer holding surface and the wafer. Thus, the occurrence of the situation in which the wafer is held in a waving state is suppressed. For this reason, when a liquid resin is pushed to spread over the lower surface of the wafer, an air bubble enters less readily between the liquid resin and the wafer. This can suppress entry of the air bubble in a protective member obtained by curing the liquid resin.

公开(公告)号：US20200223713A1

公开(公告)日：2020-07-16

申请号：US16740695

申请日：2020-01-13

Applicant: DISCO CORPORATION

Inventor： Shinichi NAMIOKA

IPC: C02F1/00

Abstract: A waste fluid treatment apparatus removing processing debris from a processing waste fluid discharged from a processing apparatus. The waste fluid treatment apparatus includes a fluid bath storing the processing waste fluid, an inflow port through which the processing waste fluid is introduced to the fluid bath, a collecting area having an inclined surface for depositing the processing debris at a predetermined portion of a bottom of the fluid bath in a concentrated manner, a vacuum pump discharging the processing debris deposited in the collecting area to an outside of the fluid bath, and an outflow port through which a processing waste fluid obtained by removing the processing debris is discharged.