公开(公告)号：US20240181746A1

公开(公告)日：2024-06-06

申请号：US18513939

申请日：2023-11-20

Applicant: DISCO CORPORATION

Inventor： Yoshinori KAKINUMA

IPC: B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/32 ,  B32B27/36

CPC classification number: B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/32 ,  B32B27/36 ,  B32B2250/02 ,  B32B2250/24 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2307/536 ,  B32B2307/54 ,  B32B2405/00

Abstract: A resin sheet has a thermocompression bonding film that is to be thermocompression bonded to a workpiece. The resin sheet includes the thermocompression bonding film that is made of resin and has one surface which is to be thermocompression bonded to the workpiece, and a resin-made protective film that has an inner surface facing the one surface, is stuck to the thermocompression bonding film in a peelable manner, and protects the one surface. At least one of the one surface or the inner surface is provided with a sticking section for sticking the thermocompression bonding film and the protective film to each other. The sticking section is disposed in a region not overlapping, in a plan view, with a predetermined region of the one surface, the predetermined region being scheduled to be thermocompression bonded to the workpiece.

公开(公告)号：US20230102150A1

公开(公告)日：2023-03-30

申请号：US17932711

申请日：2022-09-16

Applicant: DISCO CORPORATION

Inventor： Yohei MASUDA ,  Yoshinori KAKINUMA ,  Makoto SAITO ,  Kazuki SUGIURA

IPC: H01L21/683 ,  H01L21/78 ,  B28D5/00

Abstract: A tape is stuck to the front surface of a workpiece in such a manner that the direction in which the stretch rate becomes the lowest when a predetermined force is applied to the tape is non-parallel to each of multiple planned dividing lines extending in a lattice manner. In this case, each of the multiple planned dividing lines does not extend along the direction perpendicular to this direction. This can reduce the ratio of the region to which the tape does not stick in the front surface of the workpiece in the vicinity of the boundary between each of the multiple planned dividing lines and a region in which a device is formed and suppress deterioration of the processing quality when the workpiece is divided from the back surface side by a cutting blade.

公开(公告)号：US20230073080A1

公开(公告)日：2023-03-09

申请号：US17822011

申请日：2022-08-24

Applicant: DISCO CORPORATION

Inventor： Yoshinori KAKINUMA

IPC: H01L21/683

Abstract: Disclosed herein is a method of transferring a wafer from a first tape that has been pressure-bonded to one surface of the wafer and also to a first frame having an opening with the wafer positioned therein, to a second tape that has been pressure-bonded to a second frame. The method includes a first-frame removing step of detaching the first tape from the first frame by pressing a portion of the first tape that lies between the first frame and the wafer, a second-frame pressure-bonding step of pressure-bonding the second tape pressure-bonded to the second frame to another surface of the wafer, a pressure-bonding force reducing step of reducing a pressure-bonding force of the first tape by imparting an external stimulus to the first tape, and a peeling step of peeling off the first tape from the one surface of the wafer pressure-bonded to the second tape.

公开(公告)号：US20220270910A1

公开(公告)日：2022-08-25

申请号：US17651104

申请日：2022-02-15

Applicant: DISCO CORPORATION

Inventor： Yoshinori KAKINUMA ,  Yoshinobu SAITO ,  Yukiyasu MASUDA ,  Toshiyuki YOSHIKAWA ,  Toshio TSUCHIYA ,  Masanobu TAKENAKA ,  Tomoyuki HONGO

IPC: H01L21/683 ,  H01L21/677 ,  B23K26/364 ,  B23K26/402

Abstract: A processing apparatus includes a wafer carrying-out unit, a wafer table that supports a wafer carried out, a frame carrying-out unit, a frame table that supports an annular frame carried out, a tape sticking unit that sticks a tape to the annular frame, a tape-attached frame conveying unit, a tape pressure bonding unit that executes pressure bonding of the tape of a tape-attached frame to the back surface of the wafer, a frame unit carrying-out unit, and a reinforcing part removing unit that cuts and removes a ring-shaped reinforcing part from the wafer of a frame unit.

公开(公告)号：US20220254664A1

公开(公告)日：2022-08-11

申请号：US17649004

申请日：2022-01-26

Applicant: DISCO CORPORATION

Inventor： Yoshinori KAKINUMA

IPC: H01L21/67 ,  B29C63/02 ,  B29C63/00

Abstract: A sheet attaching apparatus includes a sheet attaching section that attaches a sheet to a workpiece, and a sheet cutting section that cuts off the sheet from the workpiece along an outer edge. The sheet cutting section includes a chuck table that holds the workpiece, a sheet holding section that detachably holds a peripheral portion of the sheet, a cutting section that cuts the sheet along the outer edge of the workpiece, and a sheet accommodating section that accommodates an unnecessary part of the sheet cut and dropped due to release of holding by the sheet holding section.

公开(公告)号：US20210043469A1

公开(公告)日：2021-02-11

申请号：US16983062

申请日：2020-08-03

Applicant: DISCO CORPORATION

Inventor： Yoshinori KAKINUMA

IPC: H01L21/67 ,  H01L21/56 ,  H01L21/683

Abstract: A protective member forming method for forming a protective member on the top surface of a substrate having projections and depressions on the top surface covers the top surface of the substrate with a resin film, adheres the resin film to the substrate so as to conform to the projections and depressions, supplies a curable liquid resin to a region superimposed on the substrate on the upper surface of the resin film, presses the liquid resin by a flat pressing surface via a cover film, thus spreads the liquid resin and cures the liquid resin, and thereby forms the protective member including the resin film, the cured liquid resin, and the cover film on the top surface of the substrate.

公开(公告)号：US20230031772A1

公开(公告)日：2023-02-02

申请号：US17811971

申请日：2022-07-12

Applicant: DISCO CORPORATION

Inventor： Yoshinori KAKINUMA

IPC: B23K20/02

Abstract: A processing method of a workpiece includes an integration step of heating and compression bonding a thermocompression bonding sheet to an annular frame that has an opening to receive the workpiece therein and to the workpiece received in the opening, whereby the annular frame and the workpiece are integrated via the thermocompression bonding sheet, and a processing step of processing the workpiece integrated with the annular frame via the thermocompression bonding sheet. In the integration step, the thermocompression bonding sheet is pressed against the annular frame that has been heated by a heat table with a heat source included therein, by a heat roller with a heat source included therein while being heated by the heat roller, whereby the thermocompression bonding sheet is fixed to the annular frame.

公开(公告)号：US20220270911A1

公开(公告)日：2022-08-25

申请号：US17651114

申请日：2022-02-15

Applicant: DISCO CORPORATION

Inventor： Yoshinori KAKINUMA ,  Takashi MORI ,  Yoshinobu SAITO

IPC: H01L21/683 ,  H01L21/677 ,  B25J11/00 ,  B23K26/364 ,  B23K26/402

Abstract: A processing apparatus includes a wafer carrying-out unit, a wafer table that supports a wafer carried out, a frame carrying-out unit, a frame table that supports an annular frame carried out, a tape sticking unit that sticks a tape to the frame, a tape-attached frame conveying unit, a tape pressure bonding unit that executes pressure bonding of the tape of a tape-attached frame to a back surface of the wafer, a frame unit carrying-out unit, and a beveled part removing unit that cuts and removes, in a ring manner, a beveled part formed in an outer circumferential surplus region from the wafer of a frame unit.

公开(公告)号：US20220254663A1

公开(公告)日：2022-08-11

申请号：US17648830

申请日：2022-01-25

Applicant: DISCO CORPORATION

Inventor： Yoshinori KAKINUMA

IPC: H01L21/67 ,  B29C63/00 ,  B29C63/02

Abstract: A protective member attaching apparatus includes a pressure reduction chamber having an upper housing and a lower housing, a support table that is provided inside the lower housing and on which a substrate is mounted, a sheet fixing section for fixing the sheet in such a manner as to partition the inside space of the pressure reduction chamber into a first space and a second space, a heating unit that heats the sheet to soften the sheet, and a control unit. The sheet fixing section has an outer periphery fixing section that fixes an outer periphery of the sheet, and a temporary fixing section that temporarily fixes a central portion of the sheet to the substrate mounted on a support table through a gap between the sheet and the substrate.

公开(公告)号：US20210358796A1

公开(公告)日：2021-11-18

申请号：US17240290

申请日：2021-04-26

Applicant: DISCO CORPORATION

Inventor： Yoshinori KAKINUMA ,  Yoshikuni Migiyama ,  Yoshinobu SAITO ,  Jonghyun RYU

IPC: H01L21/683 ,  H01L21/67 ,  B25J15/06

Abstract: A holding mechanism includes a Bernoulli pad that holds a plate-shaped body, a hand on which the Bernoulli pad is disposed, a sensor that is disposed on the hand and detects that the plate-shaped body is held under suction by the Bernoulli pad, a lateral movement restriction section disposed on the hand, a tube that connects an air source supplying air to the Bernoulli pad and the Bernoulli pad, an adjustment valve that is disposed in the tube and adjusts a flow rate of air supplied to the Bernoulli pad, and a control section that controls operation of the adjustment valve. The control section gradually increases the flow rate of the air supplied from the adjustment valve to the Bernoulli pad and, when it is detected by the sensor that the plate-shaped body has been held under suction by the Bernoulli pad, fixes the flow rate of the air.