公开(公告)号：US20250069953A1

公开(公告)日：2025-02-27

申请号：US18809484

申请日：2024-08-20

Applicant: DISCO CORPORATION

Inventor： Shinya ARUGA ,  Norihisa ARIFUKU

IPC: H01L21/78

Abstract: A breaking method for dividing, along a division line, a wafer having division starting points formed along the division line. The breaking method includes a protective sheet arrangement step of arranging, on a side of a front surface of the wafer, a protective sheet that has a front surface and back surface formed flat and is free of any glue layer, an alignment step of, after performing the protective sheet arrangement step, capturing an image of the front surface of the wafer from a side of the protective sheet and conducting position matching between the division line and a pressing member, and a dividing step of, after performing the alignment step, dividing the wafer along the division line by pressing the pressing member against the wafer along the division line.

公开(公告)号：US20230278260A1

公开(公告)日：2023-09-07

申请号：US18175710

申请日：2023-02-28

Applicant: DISCO CORPORATION

Inventor： Shinya ARUGA ,  Hiroaki KOBAYASHI

IPC: B28D5/00

CPC classification number: B28D5/0064 ,  B28D5/0052 ,  B28D5/0023

Abstract: A dividing apparatus is provided with a second camera that forms a second image to be used for determining whether or not a wafer is divided at a first projected dicing line. That is, in the dividing apparatus, whether or not the wafer is divided at the first projected dicing line can be checked in reference to the second image. Hence, in the dividing apparatus, even in a case where part of the wafer remains at the first projected dicing line and the wafer is not divided, a dividing unit can be operated again to divide the wafer at the first projected dicing line. Consequently, in the dividing apparatus, the wafer can reliably be divided at the first projected dicing line.