公开(公告)号：US09718215B2

公开(公告)日：2017-08-01

申请号：US14687819

申请日：2015-04-15

申请人： Halo Industries, Inc.

发明人： Andrew Bollman ,  Andrei Iancu ,  Philip Van Stockum

IPC分类号： B28D5/00 ,  H01L21/78 ,  B26F3/00

CPC分类号： B28D5/0011 ,  B26F3/002 ,  B28D5/0023 ,  H01L21/78

摘要： Controllable cleavage of a work piece is achieved through the use of capacitive clamps and application of a large tensile force. Capacitive clamps are used to secure the ends of a work piece with strong electrostatic forces. The capacitive clamps secure the ends of the work piece by creating electrostatic forces like those experienced by the plates in a parallel plate capacitor. After introduction of a crack along a side surface of the work piece, the application of a tensile force along the central axis of the work piece causes the crack to rapidly propagate and cleave the work piece into two or more pieces.

公开(公告)号：US20160303764A1

公开(公告)日：2016-10-20

申请号：US14687819

申请日：2015-04-15

申请人： Halo Industries, Inc.

发明人： Andrew Bollman ,  Andrei Iancu ,  Philip Van Stockum

IPC分类号： B28D5/00 ,  H01L21/78 ,  B26F3/00

CPC分类号： B28D5/0011 ,  B26F3/002 ,  B28D5/0023 ,  H01L21/78

摘要： Controllable cleavage of a work piece is achieved through the use of capacitive clamps and application of a large tensile force. Capacitive clamps are used to secure the ends of a work piece with strong electrostatic forces. The capacitive clamps secure the ends of the work piece by creating electrostatic forces like those experienced by the plates in a parallel plate capacitor. After introduction of a crack along a side surface of the work piece, the application of a tensile force along the central axis of the work piece causes the crack to rapidly propagate and cleave the work piece into two or more pieces.

摘要翻译： 通过使用电容夹具和施加大的拉力来实现工件的可控切​​割。 电容式夹具用于固定具有强静电力的工件端部。 电容式夹具通过产生静电力来固定工件的端部，如平行板电容器中的板所经受的那样。 在沿着工件的侧面引入裂纹之后，沿着工件的中心轴施加张力使得裂纹快速传播并将工件劈开成两片以上。

公开(公告)号：US08083115B2

公开(公告)日：2011-12-27

申请号：US11622053

申请日：2007-01-11

申请人： Olivier Rayssac ,  Fabrice Letertre

发明人： Olivier Rayssac ,  Fabrice Letertre

IPC分类号： B26F3/00

CPC分类号： H01L21/76254 ,  B28D5/0011 ,  B28D5/0023 ,  B28D5/0052 ,  B28D5/0064 ,  H01L21/2007 ,  Y10T29/53274 ,  Y10T83/0267 ,  Y10T83/04 ,  Y10T83/364 ,  Y10T156/1059 ,  Y10T156/1184 ,  Y10T156/1189 ,  Y10T156/1961 ,  Y10T156/1967 ,  Y10T156/1972 ,  Y10T225/10 ,  Y10T225/12 ,  Y10T225/30 ,  Y10T225/307 ,  Y10T225/35 ,  Y10T225/386

摘要： An automatic cutting device is described for cutting an assembly. The assembly includes a material having a weakened zone therein that defines a useful layer and being attached to a source substrate. The cutting device includes a cutting mechanism and a holding and positioning mechanism operatively associated with the cutting mechanism. The holding and positioning mechanism positions the material so that the cutting mechanism detaches the layer from the source substrate along the weakened zone. The cutting device also includes a control mechanism for adjusting at least two different portions of the assembly during detachment of the layer to facilitate a more precise detachment.

摘要翻译： 描述了用于切割组件的自动切割装置。 组件包括其中具有弱化区的材料，其限定有用层并且附接到源基底。 切割装置包括切割机构和与切割机构可操作地相关联的保持和定位机构。 保持定位机构定位材料，使得切割机构沿着弱化区域从源基板分离出层。 切割装置还包括一个控制机构，用于在分离该层期间调节该组件的至少两个不同部分，以便于更精确的拆卸。

公开(公告)号：US07189304B2

公开(公告)日：2007-03-13

申请号：US10681566

申请日：2003-10-07

申请人： Muriel Martinez ,  Thierry Barge ,  Alain Soubie ,  Chrystelle Lagahe-Blanchard ,  Cécile Berne ,  Olivier Rayssac

发明人： Muriel Martinez ,  Thierry Barge ,  Alain Soubie ,  Chrystelle Lagahe-Blanchard ,  Cécile Berne ,  Olivier Rayssac

IPC分类号： B32B38/10

CPC分类号： H01L21/67092 ,  B28D5/0011 ,  B28D5/0023 ,  B28D5/0064 ,  B28D5/0082 ,  Y10S156/921 ,  Y10T83/7607 ,  Y10T83/7667 ,  Y10T156/1142 ,  Y10T156/1179 ,  Y10T156/1967 ,  Y10T156/1983

摘要： An automatic high-precision layer cutting device for separating a layer from a semiconductor substrate. The cutting device includes a fixed positioning member for receiving at least a portion of a semiconductor substrate that has a weakened area therein and a peripheral annular notch that is located below the weakened area. The positioning member maintains a predetermined position of the substrate on a support. The device also includes cutting means having at least one blade for contacting the substrate and for inducing a cleaving wave into the substrate. The cutting means is operatively associated with the positioning member so that the at least one blade contacts the annular notch and the positioning member prevents movement of the substrate. The at least one blade induces a cleaving wave of sufficient intensity to both divide the substrate at the notch into first and second parts and detach the layer from the substrate along the weakened area.

摘要翻译： 一种用于从半导体衬底分离层的自动高精度层切割装置。 切割装置包括用于接收其中具有弱化区域的半导体衬底的至少一部分和位于弱化区域下方的周边环形凹口的固定定位构件。 定位构件将基板的预定位置保持在支撑件上。 该装置还包括切割装置，该切割装置具有至少一个叶片，用于接触基底并用于将基本的分裂波引入基片。 切割装置与定位构件可操作地相关联，使得至少一个叶片接触环形凹口，并且定位构件防止基底移动。 所述至少一个叶片产生足够强度的分裂波，以将所述切口处的所述基底分成第一和第二部分，并且沿着所述弱化区域从所述基底分离所述层。

公开(公告)号：US20040245913A1

公开(公告)日：2004-12-09

申请号：US10483125

申请日：2004-06-16

发明人： Haruo Wakayama

IPC分类号： H01J063/04

CPC分类号： C03B33/076 ,  B28D5/0011 ,  B28D5/0023 ,  B28D5/0029 ,  B28D5/0052 ,  C03B33/033 ,  G02F1/133351 ,  Y02P40/57

摘要： In a flat display panel wherein two plates made of a brittle material are adhered to each other, at least one of the two plates has a plane on which a scribing line is formed, and the plane of the at least one of the plates on which a scribing line is formed is opposed to a plane of the other of the at least one of the two plates on which no scribing line is formed. In a case, the two plates have planes on which scribing is performed, while in another case, only one of the two plates has a plane on which scribing is performed. In the latter case, scribing may be performed on the other of the two plates after the two plates are adhered.

摘要翻译： 在由脆性材料制成的两个板彼此粘合的平板显示面板中，两个板中的至少一个板具有其上形成划线的平面，并且其上至少一个板的平面 形成划线，与没有划线的两个板中的至少一个的另一个的平面相对。 在这种情况下，两个板具有在其上进行划线的平面，而在另一种情况下，两个板中只有一个具有进行划线的平面。 在后一种情况下，可以在两个板粘附之后在两个板中的另一个上进行划线。

公开(公告)号：US06554046B1

公开(公告)日：2003-04-29

申请号：US09723467

申请日：2000-11-27

申请人： Michael A. Bryan ,  James K. Kai

发明人： Michael A. Bryan ,  James K. Kai

IPC分类号： B32B3500

CPC分类号： B32B43/006 ,  B28D5/0011 ,  B28D5/0023 ,  B28D5/0064 ,  B28D5/0082 ,  H01L21/67092 ,  Y10T29/53683 ,  Y10T156/1939 ,  Y10T225/12 ,  Y10T225/18 ,  Y10T225/30 ,  Y10T225/386

摘要： A cleaving tool provides pressurized gas to the edge of a substrate to cleave the substrate at a selected interface. A substrate, such as a bonded substrate, is loaded into the cleaving tool, and two halves of the tool are brought together to apply a selected pressure to the substrate. A compliant pad of selected elastic resistance provides support to the substrate while allowing the substrate to expand during the cleaving process. Bringing the two halves of the tool together also compresses an edge seal against the perimeter of the substrate. A thin tube connected to a high-pressure gas source extends through the edge seal and provides a burst of gas to separate the substrate into at least two sheets. In a further embodiment, the perimeter of the substrate is struck with an edge prior to applying the gas pressure.

摘要翻译： 切割工具将加压气体提供到衬底的边缘以在所选择的界面处切割衬底。 衬底（例如键合衬底）被装载到劈开工具中，并且工具的两半被聚集在一起以将选择的压力施加到衬底上。 所选择的弹性阻力的柔性衬垫提供对衬底的支撑，同时允许衬底在裂开过程期间膨胀。 将工具的两个一半带到一起也可压缩衬底周边的边缘密封。 连接到高压气体源的细管延伸穿过边缘密封件并且提供气泡，以将基底分离成至少两个片。 在另一个实施例中，在施加气体压力之前，衬底的周边被边缘撞击。

公开(公告)号：US5740953A

公开(公告)日：1998-04-21

申请号：US193188

申请日：1994-05-17

申请人： Colin Smith ,  Kalman Kaufman ,  Isaac Mazor ,  Elik Chen ,  Dan Vilenski

发明人： Colin Smith ,  Kalman Kaufman ,  Isaac Mazor ,  Elik Chen ,  Dan Vilenski

IPC分类号： H01L21/66 ,  B28D5/00 ,  H01L21/301 ,  B26F3/00

CPC分类号： B28D5/0094 ,  B28D5/0005 ,  B28D5/0023 ,  B28D5/0064 ,  Y10T225/10 ,  Y10T225/12

摘要： A method and apparatus are described for cleaving a relatively thin semiconductor wafer for inspecting a target feature on a workface thereof by: producing, on a first lateral face of the semiconductor wafer, laterally of the workface on one side of the target feature, an indentation in alignment with the target feature; and inducing by impact, in a second lateral face of the semiconductor wafer, laterally of the workface on the opposite side of the target feature, a shock wave substantially in alignment with the target feature and the indentation on the first lateral face, to split the semiconductor wafer along a cleavage plane essentially coinciding with the target feature and the indentation.

摘要翻译： PCT No.PCT / EP92 / 01867 Sec。 371日期：1994年5月17日 102（e）日期1994年5月17日PCT提交1992年8月14日PCT公布。 公开号WO93 / 04497 日期1993年3月4日描述了一种方法和装置，用于通过以下步骤来切割用于检查其工作面上的目标特征的相对薄的半导体晶片：在半导体晶片的第一侧面上，在 目标特征，与目标特征对齐的缩进; 并且通过冲击在所述半导体晶片的第二侧面中在所述目标特征的相对侧上的所述工作面的横向上引入基本上与所述目标特征和所述第一侧面上的所述凹陷对准的冲击波， 半导体晶片沿着解理平面基本上与目标特征和凹陷重合。

公开(公告)号：US5238876A

公开(公告)日：1993-08-24

申请号：US554436

申请日：1990-07-19

申请人： Toshio Takeuchi ,  Ichiro Hayashi ,  Shuichi Osaka

发明人： Toshio Takeuchi ,  Ichiro Hayashi ,  Shuichi Osaka

IPC分类号： H01L21/67 ,  B28D5/00 ,  H01L21/301 ,  H01L21/304 ,  H01L21/68

CPC分类号： H01L21/6835 ,  B28D5/0011 ,  B28D5/0023 ,  B28D5/0052 ,  H01L21/3043 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68336 ,  Y10T225/12 ,  Y10T225/222 ,  Y10T29/41 ,  Y10T29/413 ,  Y10T29/417

摘要： A method and an apparatus for producing semiconductor devices in which a semiconductor wafer is adhered to an ultraviolet sensitive tape, the adhesion force of which decreases upon irradiation with ultraviolet rays, the ultraviolet sensitive tape being adhered to a ring frame so that the semiconductor wafer is fixed to the ring frame with the ultraviolet sensitive tape. Successive semiconductor wafers thus fixed to respective ring frames are subjected to a series of steps including dicing, breaking, and ultraviolet irradiation for reducing the adhesiveness of the ultraviolet tape. The semiconductor wafer, broken and divided in dice and held by the ultraviolet sensitive tape with reduced adhesiveness, is sent to a next step, such as a die-bonding step.

摘要翻译： 一种用于制造半导体器件的方法和装置，其中半导体晶片粘附到紫外线敏感带上，其粘附力在用紫外线照射时降低，紫外线敏感带粘附到环形框架上，使得半导体晶片是 用紫外线敏感胶带固定在环架上。 对相应的环形框架固定的连续半导体晶片进行一系列步骤，包括切割，断裂和紫外线照射，以降低紫外线带的粘合性。 半导体晶片被破碎并分成多个并且被具有降低的粘附性的紫外线敏感带保持的半导体晶片被送到下一步骤，例如芯片接合步骤。

公开(公告)号：US5104023A

公开(公告)日：1992-04-14

申请号：US681670

申请日：1991-04-08

申请人： Masanori Nishiguchi ,  Takeshi Sekiguchi ,  Nobuyoshi Tato

发明人： Masanori Nishiguchi ,  Takeshi Sekiguchi ,  Nobuyoshi Tato

IPC分类号： B28D5/00

CPC分类号： B28D5/0023 ,  B28D5/0052 ,  Y10T225/304 ,  Y10T225/325 ,  Y10T225/371 ,  Y10T225/386

摘要： An apparatus for making a semiconductor device comprises a flexible mat, support shafts for supporting the flexible mat in a substantially horizontal position, a pressing plate having a generally convex body and supported for movement up and down, and a drive mechanism for driving one of the pressing plate and the wafer relative to the other of the pressing plate and the wafer so as to move up and down. The wafer having the first and second surfaces opposite to each other with the chips formed on the first surface thereof is placed on the mat with the chips confronting the flexible mat. The convex body of the pressing plate is pressed against the second surface of the wafer to separate the chips on the wafer individually.

公开(公告)号：US20170087744A1

公开(公告)日：2017-03-30

申请号：US15339923

申请日：2016-10-31

申请人： LatticeGear, LLC

发明人： Gal Moyal

IPC分类号： B28D5/00 ,  B26D5/00 ,  B26F3/00

CPC分类号： B28D5/0011 ,  B26D3/06 ,  B26D5/007 ,  B26F3/002 ,  B28D1/225 ,  B28D5/0023 ,  B28D5/0041 ,  B28D5/0076 ,  B28D7/02 ,  Y10T83/0333 ,  Y10T225/12 ,  Y10T225/325 ,  Y10T225/371

摘要： A device and method for cleaving a sample includes: creating an indentation on a top surface of the sample by applying a downward force along a vertical axis, the axis arranging perpendicularly to the top surface of the sample; providing a breaking pin and arranging the breaking pin under the sample to touch the bottom surface of the sample at a position that is directly opposite from the indentation; and, applying a downward force on the sample by providing a left side and right side breaker pin wherein the downward force comprises a left-side downward force extended through the left-side breaker pin and right-side downward force through the right side breaker pin, further the pins that provide the left-side and right-side downward force are disposed on a breaker bar and arranged to be on opposite sides of a vertical axis that extends through the indentation on the top surface.