公开(公告)号：US20210175113A1

公开(公告)日：2021-06-10

申请号：US17109907

申请日：2020-12-02

Applicant: DISCO CORPORATION

Inventor： Shungo YOSHII

IPC: H01L21/683 ,  B25J15/06

Abstract: A plate-shaped workpiece holding tool includes a holding base having a joint port coupled to a suction source and a holding surface for holding the plate-shaped workpiece thereon, a first O-ring disposed on the holding surface, a second O-ring disposed on the holding surface radially inwardly of the first O-ring, a suction port that is open in the holding surface between the first O-ring and the second O-ring and held in fluid communication with the joint port, and a liquid supply mechanism for forming a liquid seal between the holding surface and the plate-shaped workpiece radially outwardly of the first O-ring.

公开(公告)号：US20220023972A1

公开(公告)日：2022-01-27

申请号：US17380635

申请日：2021-07-20

Applicant: DISCO CORPORATION

Inventor： Shungo YOSHII ,  Junichi KUKI ,  Kana AIDA

IPC: B23K26/36 ,  B23K26/06 ,  B23K26/142

Abstract: A laser processing apparatus includes a processing nozzle. The processing nozzle includes an upper wall having a laser beam passage port defined therein, a lower wall that is connected to a lower portion of a part of the upper wall and that includes a debris capturing chamber defined therein, a suction port defined between another part of the upper wall and the lower wall, a first air ejection port defined in the lower wall, for ejecting air across the debris capturing chamber toward the suction port in a predetermined direction perpendicular to an optical path of a laser beam, and a second air ejection port defined in the lower wall below the first air ejection port, for ejecting air in the predetermined direction. A flow rate of air ejected from the second air ejection port is smaller than a flow rate of air ejected from the first air ejection port.

公开(公告)号：US20200262029A1

公开(公告)日：2020-08-20

申请号：US16791366

申请日：2020-02-14

Applicant: DISCO CORPORATION

Inventor： Shungo YOSHII ,  Souichi MATSUBARA ,  Nobuyuki FUKUSHI ,  Hidekazu NAKAYAMA

IPC: B24B55/06 ,  B24B7/04 ,  H01L21/304 ,  H01L21/683 ,  B24B7/22 ,  B24B41/00 ,  B24B41/06

Abstract: A grinding apparatus includes a loading unit for loading a wafer to a chuck table having a holding surface for holding the wafer, an unloading unit for unloading the wafer from the chuck table, and a cleaning unit for cleaning the holding surface of the chuck table or the upper surface of the wafer held on the holding surface of the chuck table. The cleaning unit includes a cleaning portion and a horizontal moving portion for horizontally moving the cleaning portion in a lateral direction of the grinding apparatus. The loading unit has a first holding portion for holding the wafer, and the unloading unit has a second holding portion for holding the wafer.