公开(公告)号：US20220023972A1

公开(公告)日：2022-01-27

申请号：US17380635

申请日：2021-07-20

Applicant: DISCO CORPORATION

Inventor： Shungo YOSHII ,  Junichi KUKI ,  Kana AIDA

IPC: B23K26/36 ,  B23K26/06 ,  B23K26/142

Abstract: A laser processing apparatus includes a processing nozzle. The processing nozzle includes an upper wall having a laser beam passage port defined therein, a lower wall that is connected to a lower portion of a part of the upper wall and that includes a debris capturing chamber defined therein, a suction port defined between another part of the upper wall and the lower wall, a first air ejection port defined in the lower wall, for ejecting air across the debris capturing chamber toward the suction port in a predetermined direction perpendicular to an optical path of a laser beam, and a second air ejection port defined in the lower wall below the first air ejection port, for ejecting air in the predetermined direction. A flow rate of air ejected from the second air ejection port is smaller than a flow rate of air ejected from the first air ejection port.

公开(公告)号：US20240363414A1

公开(公告)日：2024-10-31

申请号：US18633811

申请日：2024-04-12

Applicant: DISCO CORPORATION

Inventor： Akifumi SUZUKI ,  Junichi KUKI

IPC: H01L21/78

CPC classification number: H01L21/78

Abstract: A method of processing an SiC wafer includes a laser processing step of applying a laser beam to the SiC wafer along projected dicing lines established thereon to sever a metal film on the SiC wafer along the projected dicing lines and form grooves in the SiC wafer along the projected dicing lines, a tape mounting step of mounting a tape on the metal film before or after the laser processing step, and a dividing step of gripping, vertically between gripping members, an area of the SiC wafer adjacent to one at a time of the projected dicing lines along which the SiC wafer is to be divided and pressing, with a pressing member, an area of the SiC wafer adjacent to and across the one of the projected dicing lines from the gripping members, thereby dividing the SiC wafer along the one of the projected dicing lines.

公开(公告)号：US20210191071A1

公开(公告)日：2021-06-24

申请号：US17120711

申请日：2020-12-14

Applicant: DISCO CORPORATION

Inventor： Osamu OMACHI ,  Takeshi DEJIMA ,  Junichi KUKI

IPC: G02B7/182

Abstract: An optical element unit includes a reflective optical element and a support that, when the optical element is disposed at a predetermined position in an optical system, is fixed by a fixing device to support the optical element. The support is configured so that, owing to the fixing of the support by the fixing device, a strain to be produced in the optical element upon fixing the optical element is reduced compared with a case in which the optical element is fixed directly by the fixing device.