Plate-shaped workpiece holding tool

    公开(公告)号:US12100612B2

    公开(公告)日:2024-09-24

    申请号:US17109907

    申请日:2020-12-02

    Inventor: Shungo Yoshii

    CPC classification number: H01L21/6838 B25J15/0683

    Abstract: A plate-shaped workpiece holding tool includes a holding base having a joint port coupled to a suction source and a holding surface for holding the plate-shaped workpiece thereon, a first O-ring disposed on the holding surface, a second O-ring disposed on the holding surface radially inwardly of the first O-ring, a suction port that is open in the holding surface between the first O-ring and the second O-ring and held in fluid communication with the joint port, and a liquid supply mechanism for forming a liquid seal between the holding surface and the plate-shaped workpiece radially outwardly of the first O-ring.

    Laser processing apparatus
    2.
    发明授权

    公开(公告)号:US10315273B2

    公开(公告)日:2019-06-11

    申请号:US15222290

    申请日:2016-07-28

    Inventor: Shungo Yoshii

    Abstract: A laser processing apparatus has a suction unit for suctioning debris. The suction unit includes a debris trapping chamber and a cleaning unit for cleaning the inside of the debris trapping chamber. The cleaning unit includes a shutter for closing an opening of the debris trapping chamber and a cleaning water supply port for supplying cleaning water to the debris trapping chamber when the opening thereof is closed. The shutter closes the opening of the debris trapping chamber, the suction unit exerts a suction through the suction port, and cleaning water is supplied from the cleaning water supply port to the debris trapping chamber and suctioned through the suction port to clean the inside of the debris trapping chamber.

    LASER PROCESSING APPARATUS
    3.
    发明申请

    公开(公告)号:US20170106471A1

    公开(公告)日:2017-04-20

    申请号:US15293587

    申请日:2016-10-14

    Abstract: A laser processing apparatus ablates the upper surface of a plate-shaped workpiece by using a laser beam passed through a water-soluble protective film formed on the upper surface of the plate-shaped workpiece. A nozzle applies the laser beam to the upper surface of the plate-shaped workpiece. The processing nozzle includes a debris capturing chamber for capturing debris scattering due to the application of the laser beam. A capturing space is defined in the debris capturing chamber, and an air discharge port and a suction port are opposed to each other in the capturing space. Air is discharged from the air discharge port toward the suction port so as to produce an air flow perpendicular to the optical path of the laser beam, so that the debris is sucked into the suction port by this air flow.

    LASER PROCESSING APPARATUS
    4.
    发明申请
    LASER PROCESSING APPARATUS 审中-公开
    激光加工设备

    公开(公告)号:US20170043432A1

    公开(公告)日:2017-02-16

    申请号:US15222290

    申请日:2016-07-28

    Inventor: Shungo Yoshii

    CPC classification number: B23K26/142 B23K26/361

    Abstract: A laser processing apparatus has a suction unit for suctioning debris. The suction unit includes a debris trapping chamber and a cleaning unit for cleaning the inside of the debris trapping chamber. The cleaning unit includes a shutter for closing an opening of the debris trapping chamber and a cleaning water supply port for supplying cleaning water to the debris trapping chamber when the opening thereof is closed. The shutter closes the opening of the debris trapping chamber, the suction unit exerts a suction through the suction port, and cleaning water is supplied from the cleaning water supply port to the debris trapping chamber and suctioned through the suction port to clean the inside of the debris trapping chamber.

    Abstract translation: 激光加工装置具有用于抽吸碎片的抽吸单元。 抽吸单元包括碎屑捕获室和用于清洁碎屑捕集室内部的清洁单元。 清洁单元包括用于关闭碎片捕集室的开口的快门和用于在其开口关闭时向清洁水池供应清洁水的清洁水供给口。 快门关闭碎片捕集室的开口,抽吸单元通过吸入口进行抽吸,清洗水从清洗水供应口供应到碎屑捕集室,并通过吸入口抽吸以清洁 碎片捕集室。

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