公开(公告)号：US20220143772A1

公开(公告)日：2022-05-12

申请号：US17452616

申请日：2021-10-28

申请人： DISCO CORPORATION

发明人： Toshiyuki MORIYA ,  Tomohiro SHIRAHAMA

IPC分类号： B24B7/04 ,  H01L21/304 ,  B24B55/12 ,  B24B37/34 ,  B24B55/04

摘要： A processing machine includes a chuck table, a chuck table cover having an opening through which a holding surface of the chuck table can protrude, a processing unit having a spindle, a spindle housing, and a mount portion arranged on a lower end portion of the spindle, the processing unit being configured to process a workpiece by a processing tool mounted on a lower part of the mount portion, a processing chamber construction cover that covers the chuck table and the mount portion. The processing machine further includes a processing tool cover that is secured to a lower end portion of the spindle housing and that has an upper wall and a side wall that extends downwardly from the upper wall. The processing tool cover is disposed inside the processing chamber construction cover and covers the processing tool from above and sides by the upper and side walls.

公开(公告)号：US20220305612A1

公开(公告)日：2022-09-29

申请号：US17655811

申请日：2022-03-22

申请人： DISCO CORPORATION

发明人： Toshiyuki MORIYA ,  Takamasa SUZUKI ,  Yuki INOUE ,  Jai Kwang HAN

IPC分类号： B24B37/10 ,  B24B37/30 ,  B24B57/02 ,  B24B53/017

摘要： A polishing apparatus includes a chuck table, a rotation mechanism that rotates the chuck table around a predetermined rotation axis, a polishing unit that has a spindle and in which a polishing pad for polishing the wafer sucked and held by the holding surface is mounted on a lower end part of the spindle, a slurry supply unit, and a cleaning unit that cleans the holding surface. The cleaning unit has a cleaning abrasive stone for removing the slurry that adheres to the holding surface through getting contact with the holding surface and a positioning unit that positions the cleaning abrasive stone to a cleaning position at which the cleaning abrasive stone gets contact with the holding surface and an evacuation position at which the cleaning abrasive stone is separate from the holding surface. Hardness of the cleaning abrasive stone is lower than the hardness of the holding surface.

公开(公告)号：US20220152787A1

公开(公告)日：2022-05-19

申请号：US17452667

申请日：2021-10-28

申请人： DISCO CORPORATION

发明人： Toshiyuki MORIYA

IPC分类号： B25B11/00 ,  B24B37/30

摘要： A processing apparatus includes a chuck table, a processing unit that has a spindle, a spindle housing, and a mount section fixed to a lower end portion of the spindle, a processing feeding mechanism that puts the processing unit into processing feeding, a processing chamber cover that has an opening penetrable by the mount section and that is able to cover the chuck table and the mount section, an extendable cover section having an annular lower connection section detachably connected to a peripheral portion of the opening, an annular upper connection section fixed to the spindle housing, and a tubular bellows section that connects the upper and lower connection sections and that is able to shrink and extend following movement of the processing unit, and a gas flow forming unit that forms a flow of gas from the upper connection section toward the lower connection section inside the bellows section.

公开(公告)号：US20220016740A1

公开(公告)日：2022-01-20

申请号：US17347755

申请日：2021-06-15

申请人： DISCO CORPORATION

发明人： Toshiyuki MORIYA ,  Takamasa SUZUKI

IPC分类号： B24B37/20 ,  B24B53/017 ,  B24B37/30

摘要： A polishing apparatus for polishing a workpiece includes a chuck table having a holding surface for holding the workpiece placed on the holding surface under suction thereon, a polishing unit for polishing the workpiece held on the chuck table with a polishing pad while supplying a slurry to the workpiece, and a high-pressure steam ejecting unit having a nozzle for ejecting high-pressure steam to the holding surface of the chuck table. The high-pressure steam ejecting unit ejects high-pressure steam to swarf produced from polishing the workpiece and deposited on an outer circumferential portion of the holding surface for thereby removing the swarf from the holding surface.