公开(公告)号：US20230246623A1

公开(公告)日：2023-08-03

申请号：US18100665

申请日：2023-01-24

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Sung Hoe KIM ,  Na Yeon KIM ,  Dae Kyu KIM ,  Byung Eun JEON

IPC: H03H7/38 ,  H01Q1/24

CPC classification number: H03H7/38 ,  H01Q1/243

Abstract: An impedance converter for an antenna includes a first port receiving a power from an antenna driving integrated circuit, an impedance modulator connected to the first port to convert an impedance, and a second port connected to the modulator and configured to perform a feeding to an antenna unit. The second port has an impedance higher than that of the first port. Impedance mismatching is prevented by the impedance modulator to improve antenna properties.

公开(公告)号：US20230422409A1

公开(公告)日：2023-12-28

申请号：US18209551

申请日：2023-06-14

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Dae Kyu KIM ,  Byung Soo BANG ,  Gi Taek OH

IPC: H05K3/46 ,  H05K1/02 ,  H01Q1/22

CPC classification number: H05K3/4605 ,  H05K1/0242 ,  H05K2201/10098 ,  H05K2201/093 ,  H05K2201/10128 ,  H01Q1/2291

Abstract: A circuit board for an antenna may include a core layer, a signal wiring disposed on a surface of the core layer, and a co-planar ground disposed around the signal wiring on the surface of the core layer. The co-planar ground may include line patterns adjacent to a front end portion of the signal wiring.

公开(公告)号：US20230327322A1

公开(公告)日：2023-10-12

申请号：US18131922

申请日：2023-04-07

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Dae Kyu KIM ,  In Kak SONG ,  Han Sub RYU

IPC: H01Q1/24 ,  H01Q1/38

CPC classification number: H01Q1/243 ,  H01Q1/38

Abstract: An antenna structure according to an embodiment includes an antenna device including an antenna unit, a circuit board electrically connected to the antenna unit, an insulating layer covering the antenna device and a portion of the circuit board, and an air layer formed between the antenna device and the insulating layer to partially cover the antenna unit.

公开(公告)号：US20230246330A1

公开(公告)日：2023-08-03

申请号：US18100704

申请日：2023-01-24

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Na Yeon KIM ,  Sung Hoe KIM ,  Dae Kyu KIM ,  Byung Eun JEON

IPC: H01Q1/38 ,  H01Q1/24 ,  H01Q1/46 ,  H01Q1/50

CPC classification number: H01Q1/38 ,  H01Q1/243 ,  H01Q1/46 ,  H01Q1/50 ,  H01Q21/0006

Abstract: An antenna package includes an antenna device including an antenna dielectric layer and an antenna unit formed on the antenna dielectric layer, and an intermediate circuit board electrically connected to the antenna unit. The intermediate circuit board includes a core layer and a signal line formed on a surface of the core layer and electrically connected to the antenna unit. A width of one end portion of the signal line connected to the antenna unit is smaller than a width of the other end portion opposite to the one end portion of the signal line. Impedance mismatching is prevented by the construction of the signal line to improve antenna properties.

公开(公告)号：US20230369745A1

公开(公告)日：2023-11-16

申请号：US18196063

申请日：2023-05-11

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Won Hee LEE ,  Na Yeon KIM ,  Dae Kyu KIM

IPC: H01Q1/24 ,  H01Q21/08 ,  H01Q9/04 ,  H01Q1/48

CPC classification number: H01Q1/243 ,  H01Q1/48 ,  H01Q9/045 ,  H01Q21/08

Abstract: A circuit board for an antenna according to an embodiment includes a core layer having a first surface and second surface that face each other, a second conductive layer disposed on the second surface of the core layer, and a first conductive layer disposed on the first surface of the core layer. The first conductive layer includes signal wirings, and a co-planar ground spaced apart from the signal wirings in a horizontal direction. The co-planar ground includes a first recess formed between end portions of neighboring signal wirings of the signal wirings.

公开(公告)号：US20230328887A1

公开(公告)日：2023-10-12

申请号：US18131984

申请日：2023-04-07

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Na Yeon KIM ,  Dae Kyu KIM ,  Han Sub RYU

IPC: H05K1/11 ,  H01Q1/38

CPC classification number: H05K1/119 ,  H01Q1/38 ,  H01Q1/243

Abstract: An antenna structure according to an embodiment includes an antenna device, a circuit board connected to the antenna device and including an inner insulation layer, and an outer insulation layer formed on the antenna device to cover the antenna unit and a portion of the circuit board. A portion of the inner insulation layer covered by the outer insulation layer may have a smaller thickness than a thickness of a portion of the inner insulation layer not covered by the outer insulation layer.

公开(公告)号：US20230387568A1

公开(公告)日：2023-11-30

申请号：US18201231

申请日：2023-05-24

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Sung Hoe KIM ,  Na Yeon KIM ,  Dae Kyu KIM

IPC: H01Q1/22 ,  H01Q1/38 ,  H01Q1/14 ,  H01Q1/40

CPC classification number: H01Q1/22 ,  H01Q1/38 ,  H01Q1/14 ,  H01Q1/40

Abstract: A circuit board for an antenna includes a core layer having a first surface and a second surface facing each other, a signal wiring disposed on the first surface of the core layer, and a conductive layer disposed on the second surface of the core layer to cover the signal wiring in a plan view. The conductive layer has a slit portion formed around the signal wiring in the plan view.