公开(公告)号：US20210089166A1

公开(公告)日：2021-03-25

申请号：US17113226

申请日：2020-12-07

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Hye Rim KWON ,  Sung Woo YU ,  Dong Jin SON ,  Jin Woo LEE

IPC: G06F3/044 ,  G06F3/041

Abstract: A touch sensor module according to an embodiment of the present invention includes a touch sensor layer including sensing electrodes and traces branching from the sensing electrodes, a flexible circuit board electrically connected to the traces at one end portion of the touch sensor layer, and a supporting structure commonly and partially covering the flexible circuit board and the touch sensor layer. Damages and delamination of electrodes and wirings included in the flexible circuit board and the touch sensor layer is prevented by the supporting structure.

公开(公告)号：US20210326004A1

公开(公告)日：2021-10-21

申请号：US17365159

申请日：2021-07-01

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Yong Soo PARK ,  Sung Woo YU ,  Jae Hyun LEE ,  Keon KIM ,  Ju In YOON

IPC: G06F3/044 ,  G06F3/045 ,  G06F3/041

Abstract: A touch sensor according to an embodiment of the present invention includes a base layer, a first electrode layer disposed on the base layer, and a second electrode layer disposed at an upper level of the first electrode layer. The first electrode layer includes a plurality of first sensing electrode rows extending in a first direction parallel to a top surface of the base layer, and first traces branched from each of the first sensing electrode rows and alternately distributed on both lateral portions of the base layer. The second electrode layer includes a plurality of second sensing electrode columns extending in a second direction that is parallel to the top surface of the base layer and intersects the first direction, and second traces branching from the second sensing electrode columns.

公开(公告)号：US20210096668A1

公开(公告)日：2021-04-01

申请号：US17117874

申请日：2020-12-10

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Hye Rim KWON ,  Tae Bong KIM ,  Dong Jin SON ,  Sung Woo YU ,  Min Ho LIM

IPC: G06F3/041 ,  B32B27/36 ,  B32B7/12 ,  B32B23/08 ,  B32B27/30

Abstract: A touch sensor module according to an embodiment of the present invention includes a touch sensor layer including sensing electrodes and traces branching from the sensing electrodes, a flexible circuit board electrically connected to the traces at one end portion of a top surface of the touch sensor layer, a supporting structure commonly and partially covering the flexible circuit board and the touch sensor layer, and an adhesive layer formed on at least one surface of the touch sensor layer. The adhesive layer has a flexural rigidity in a range from 0.01 to 5 N·nm. Damages and delamination of electrodes and wirings included in the flexible circuit board and the touch sensor layer are prevented by the supporting structure.

公开(公告)号：US20190337273A1

公开(公告)日：2019-11-07

申请号：US16515732

申请日：2019-07-18

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Myung Young AN ,  Sung Woo YU ,  Geo San LIM

IPC: B32B27/08 ,  G02B5/30 ,  H05K1/11 ,  B32B27/32

Abstract: A transparent stack structure includes a substrate and a hard coating layer stacked on the substrate. Compressive modulus and elastic restoration of the hard coating layer and the substrate satisfy Formula 1. Mechanical strength may be obtained from the substrate, and flexible and elastic properties may be enhanced by the hard coating layer so that cracks may be prevented when being folded or bent.