公开(公告)号：US10164137B2

公开(公告)日：2018-12-25

申请号：US14777693

申请日：2014-04-16

Applicant: Dow Global Technologies LLC

Inventor： Kumar Nanjundiah ,  John A. Naumovitz ,  Michael D. White

IPC: H01L31/00 ,  H01L31/048 ,  H01L31/049 ,  H01L31/18

Abstract: An electronic device comprises a first encapsulating film in direct contact with a light-receiving and transmitting film and a second encapsulating film in direct contact with a back sheet. The first encapsulating film has a zero shear viscosity greater than that of the second encapsulating film. The back sheet of the electronic device contains fewer bumps than the back sheet of a comparable electronic device having a first encapsulating film with a zero shear viscosity less than or equal to that of the second encapsulating film.

公开(公告)号：US20160276512A1

公开(公告)日：2016-09-22

申请号：US14777693

申请日：2014-04-16

Applicant: DOW GLOBAL TECHNOLOGIES LLC

Inventor： Kumar Nanjundiah ,  John A. Naumovitz ,  Michael D. White

IPC: H01L31/048 ,  H01L31/18 ,  H01L31/049

CPC classification number: H01L31/0488 ,  H01L31/0481 ,  H01L31/049 ,  H01L31/18 ,  Y02E10/50

Abstract: An electronic device comprises a first encapsulating film in direct contact with a light-receiving and transmitting film and a second encapsulating film in direct contact with a back sheet. The first encapsulating film has a zero shear viscosity greater than that of the second encapsulating film. The back sheet of the electronic device contains fewer bumps than the back sheet of a comparable electronic device having a first encapsulating film with a zero shear viscosity less than or equal to that of the second encapsulating film.

Abstract translation: 一种电子器件包括与光接收和透射膜直接接触的第一封装膜和与底片直接接触的第二封装膜。 第一包封膜的零剪切粘度大于第二包封膜的零剪切粘度。 电子设备的背板比具有零剪切粘度小于或等于第二封装膜的第一封装膜的类似电子设备的背板具有更少的凸起。

公开(公告)号：US20190140122A1

公开(公告)日：2019-05-09

申请号：US16222112

申请日：2018-12-17

Applicant: Dow Global Technologies LLC

Inventor： Kumar Nanjundiah ,  John A. Naumovitz ,  Michael D. White

IPC: H01L31/048 ,  H01L31/18

Abstract: An electronic device comprises a first encapsulating film in direct contact with a light-receiving and transmitting film and a second encapsulating film in direct contact with a back sheet. The first encapsulating film has a zero shear viscosity greater than that of the second encapsulating film. The back sheet of the electronic device contains fewer bumps than the back sheet of a comparable electronic device having a first encapsulating film with a zero shear viscosity less than or equal to that of the second encapsulating film.