公开(公告)号：US20150013753A1

公开(公告)日：2015-01-15

申请号：US14371136

申请日：2013-02-01

Applicant: Dow Global Technologies LLC

Inventor： Kumar Nanjundiah ,  John A. Naumovitz ,  Rajen M. Patel ,  Morgan M. Hughes ,  Frank J. Cerk

IPC: H01L31/048 ,  C08J5/18

CPC classification number: H01L31/0481 ,  B32B17/10018 ,  B32B17/1055 ,  B32B17/10697 ,  C08F4/65908 ,  C08F4/65912 ,  C08F255/02 ,  C08J5/18 ,  C08J2351/06 ,  H01L31/048 ,  H02S40/34 ,  Y02E10/50 ,  C08F230/08 ,  C08F2500/08 ,  C08F2500/26 ,  C08F210/16 ,  C08F210/14 ,  C08F4/64093 ,  C08F4/6592

Abstract: Disclosed in more detail in this application are ethylene interpolymer films having one or more layers, comprising surface layer comprising: (A) a silane-containing ethylene interpolymer comprising (1) an ethylene interpolymer having a density of less than 0.905 g/cm3, and (2) at least 0.1 percent by weight alkoxysilane; characterized by: (3) having a volume resistivity of greater than 5×1015 ohm-cm as measured at 60 C. In one embodiment, such ethylene interpolymer has a residual boron content of less than 10 ppm and residual aluminum content of less than 100 ppm. Also disclosed are laminated electronic device modules comprising: A. at least one electronic device, and B. one of the ethylene interpolymer films as described above in intimate contact with at least one surface of the electronic device. Such laminated electronic device modules according to the invention have been shown to suffer reduced potential induced degradation (“PID”).

Abstract translation: 在本申请中更详细地公开的是具有一层或多层的乙烯互聚物膜，其包含表面层，其包含：（A）含硅烷的乙烯互聚物，其包含（1）密度小于0.905g / cm 3的乙烯互聚物，以及 （2）至少0.1重量％的烷氧基硅烷; 其特征在于：（3）在60℃下测量的体积电阻率大于5×1015欧姆 - 厘米。在一个实施方案中，这种乙烯互聚物的残余硼含量小于10ppm，残余铝含量小于100 ppm。 还公开了层压电子器件模块，其包括：A.至少一个电子器件，以及B.如上所述的乙烯互聚物膜之一，与电子器件的至少一个表面紧密接触。 已经示出了根据本发明的这种层压电子器件模块遭受降低的电位诱导退化（“PID”）。

公开(公告)号：US20160276512A1

公开(公告)日：2016-09-22

申请号：US14777693

申请日：2014-04-16

Applicant: DOW GLOBAL TECHNOLOGIES LLC

Inventor： Kumar Nanjundiah ,  John A. Naumovitz ,  Michael D. White

IPC: H01L31/048 ,  H01L31/18 ,  H01L31/049

CPC classification number: H01L31/0488 ,  H01L31/0481 ,  H01L31/049 ,  H01L31/18 ,  Y02E10/50

Abstract: An electronic device comprises a first encapsulating film in direct contact with a light-receiving and transmitting film and a second encapsulating film in direct contact with a back sheet. The first encapsulating film has a zero shear viscosity greater than that of the second encapsulating film. The back sheet of the electronic device contains fewer bumps than the back sheet of a comparable electronic device having a first encapsulating film with a zero shear viscosity less than or equal to that of the second encapsulating film.

Abstract translation: 一种电子器件包括与光接收和透射膜直接接触的第一封装膜和与底片直接接触的第二封装膜。 第一包封膜的零剪切粘度大于第二包封膜的零剪切粘度。 电子设备的背板比具有零剪切粘度小于或等于第二封装膜的第一封装膜的类似电子设备的背板具有更少的凸起。

公开(公告)号：US20190140122A1

公开(公告)日：2019-05-09

申请号：US16222112

申请日：2018-12-17

Applicant: Dow Global Technologies LLC

Inventor： Kumar Nanjundiah ,  John A. Naumovitz ,  Michael D. White

IPC: H01L31/048 ,  H01L31/18

Abstract: An electronic device comprises a first encapsulating film in direct contact with a light-receiving and transmitting film and a second encapsulating film in direct contact with a back sheet. The first encapsulating film has a zero shear viscosity greater than that of the second encapsulating film. The back sheet of the electronic device contains fewer bumps than the back sheet of a comparable electronic device having a first encapsulating film with a zero shear viscosity less than or equal to that of the second encapsulating film.

公开(公告)号：US20170338360A1

公开(公告)日：2017-11-23

申请号：US15522477

申请日：2015-10-30

Applicant: Dow Global Technologies LLC

Inventor： Fanny Deplace ,  Kumar Nanjundiah ,  Jeffrey E. Bonekamp ,  John A. Naumovitz

IPC: H01L31/049 ,  C09D7/12 ,  H01L31/048 ,  C09D123/08 ,  C08K3/36 ,  C08K9/04

CPC classification number: H01L31/049 ,  C08K3/36 ,  C08K9/04 ,  C08L2203/204 ,  C08L2312/08 ,  C09D7/62 ,  C09D123/0815 ,  C09D123/10 ,  C09D151/06 ,  C09D153/00 ,  H01L31/0481 ,  H01L31/0488 ,  H02S40/44 ,  Y02E10/50 ,  C08L51/06

Abstract: The present disclosure provides a photovoltaic module. In an embodiment, the photovoltaic module includes a photovoltaic cell, and a layer composed of a film. The film includes a silane-grafted polyolefin (Si-g-PO) resin composition comprising (i) one or more silane grafted polyolefins and (ii) from greater than 0 wt % to less than 5.0 wt % of a micronized silica gel, based on the total weight of the Si-g-PO resin composition. The film has a glass adhesion greater than or equal to 15 N/mm after aging the film at 40° C. and 0% relative humidity for 60 days as measured in accordance with ASTM F88/88M-09.

公开(公告)号：US20170200842A1

公开(公告)日：2017-07-13

申请号：US15320363

申请日：2015-06-22

Applicant: Dow Global Technologies LLC

Inventor： Jeffrey E. Bonekamp ,  Kumar Nanjundiah ,  Huiqing Zhang ,  Yushan Hu

IPC: H01L31/048 ,  H01L31/049

CPC classification number: H01L31/0481 ,  H01L31/049 ,  Y02E10/50

Abstract: PV modules with improved volume resistivity comprise an encapsulant film and a polyolefin backsheet at least one of which comprises organoclay.

公开(公告)号：US10164137B2

公开(公告)日：2018-12-25

申请号：US14777693

申请日：2014-04-16

Applicant: Dow Global Technologies LLC

Inventor： Kumar Nanjundiah ,  John A. Naumovitz ,  Michael D. White

IPC: H01L31/00 ,  H01L31/048 ,  H01L31/049 ,  H01L31/18

Abstract: An electronic device comprises a first encapsulating film in direct contact with a light-receiving and transmitting film and a second encapsulating film in direct contact with a back sheet. The first encapsulating film has a zero shear viscosity greater than that of the second encapsulating film. The back sheet of the electronic device contains fewer bumps than the back sheet of a comparable electronic device having a first encapsulating film with a zero shear viscosity less than or equal to that of the second encapsulating film.

公开(公告)号：US20170260375A1

公开(公告)日：2017-09-14

申请号：US15529139

申请日：2015-10-21

Applicant: Dow Global Technologies LLC

Inventor： Mauricio E. Leano ,  Paul R. Elowe ,  Mary Anne Leugers ,  Kumar Nanjundiah ,  Bruce Peterson

IPC: C08L23/06 ,  B32B27/08 ,  B65D65/40 ,  B29C47/06 ,  B29C47/00 ,  B65D71/08 ,  C08J5/18 ,  B32B27/32

CPC classification number: C08L23/06 ,  B29C48/0018 ,  B29C48/022 ,  B29C48/21 ,  B29K2023/0633 ,  B29K2995/0049 ,  B29L2007/00 ,  B29L2031/712 ,  B32B7/12 ,  B32B27/08 ,  B32B27/20 ,  B32B27/32 ,  B32B27/327 ,  B32B2250/242 ,  B32B2264/108 ,  B32B2270/00 ,  B32B2307/40 ,  B32B2307/418 ,  B32B2307/42 ,  B32B2307/54 ,  B32B2307/558 ,  B32B2307/72 ,  B32B2307/732 ,  B32B2307/736 ,  B32B2307/738 ,  B32B2307/75 ,  B32B2439/70 ,  B32B2439/80 ,  B65D65/40 ,  B65D71/08 ,  C08J5/18 ,  C08J2323/06 ,  C08J2423/08 ,  C08K3/04 ,  C08K3/041 ,  C08K3/042 ,  C08K3/045 ,  C08K5/0041 ,  C08K2201/011 ,  C08L2203/162 ,  C08L2205/02 ,  C08L2205/025 ,  C08L2205/03 ,  C08L2205/06 ,  C08L2207/066

Abstract: A polyethylene-based polymer composition suitable for use in a shrink film, the polyethylene-based polymer composition comprising a low density polyethylene having a density of from 0.917 g/cc to 0.935 g/cc and melt index, I2, of from 0.1 g/10 min to 5 g/10 min, a linear low density polyethylene having a density of from 0.900 g/cc to 0.965 g/cc and melt index, I2, of from 0.05 g/10 min to 15 g/10 min, or combinations thereof, a material that absorbs radiation in the near-infrared, visible, and ultraviolet spectral wavelength ranges, and optionally, a medium density polyethylene, a high density polyethylene, or combinations thereof.

公开(公告)号：US09362436B2

公开(公告)日：2016-06-07

申请号：US14371136

申请日：2013-02-01

Applicant: Dow Global Technologies LLC

Inventor： Kumar Nanjundiah ,  John A. Naumovitz ,  Rajen M. Patel ,  Morgan M. Hughes ,  Frank J. Cerk

IPC: B32B17/10 ,  C08F210/16 ,  C08F230/08 ,  C08F255/02 ,  H01L31/048 ,  C08F4/659 ,  C08J5/18 ,  H02S40/34

CPC classification number: H01L31/0481 ,  B32B17/10018 ,  B32B17/1055 ,  B32B17/10697 ,  C08F4/65908 ,  C08F4/65912 ,  C08F255/02 ,  C08J5/18 ,  C08J2351/06 ,  H01L31/048 ,  H02S40/34 ,  Y02E10/50 ,  C08F230/08 ,  C08F2500/08 ,  C08F2500/26 ,  C08F210/16 ,  C08F210/14 ,  C08F4/64093 ,  C08F4/6592

Abstract: Disclosed in more detail in this application are ethylene interpolymer films having one or more layers, comprising surface layer comprising: (A) a silane-containing ethylene interpolymer comprising (1) an ethylene interpolymer having a density of less than 0.905 g/cm3, and (2) at least 0.1 percent by weight alkoxysilane; characterized by: (3) having a volume resistivity of greater than 5×1015 ohm-cm as measured at 60 C. In one embodiment, such ethylene interpolymer has a residual boron content of less than 10 ppm and residual aluminum content of less than 100 ppm. Also disclosed are laminated electronic device modules comprising: A. at least one electronic device, and B. one of the ethylene interpolymer films as described above in intimate contact with at least one surface of the electronic device. Such laminated electronic device modules according to the invention have been shown to suffer reduced potential induced degradation (“PID”).

Abstract translation: 在本申请中更详细地公开的是具有一层或多层的乙烯互聚物膜，其包含表面层，其包含：（A）含硅烷的乙烯互聚物，其包含（1）密度小于0.905g / cm 3的乙烯互聚物，以及 （2）至少0.1重量％的烷氧基硅烷; 其特征在于：（3）在60℃下测量的体积电阻率大于5×1015欧姆 - 厘米。在一个实施方案中，这种乙烯互聚物的残余硼含量小于10ppm，残余铝含量小于100 ppm。 还公开了层压电子器件模块，其包括：A.至少一个电子器件，以及B.如上所述的乙烯互聚物膜之一，与电子器件的至少一个表面紧密接触。 已经示出了根据本发明的这种层压电子器件模块遭受降低的电位诱导退化（“PID”）。