公开(公告)号：US09462209B2

公开(公告)日：2016-10-04

申请号：US12078759

申请日：2008-04-04

申请人： Daiji Imai ,  Masayoshi Tanimura ,  Akira Ozawa ,  Masanobu Sakata ,  Tomokazu Tsuruoka

发明人： Daiji Imai ,  Masayoshi Tanimura ,  Akira Ozawa ,  Masanobu Sakata ,  Tomokazu Tsuruoka

IPC分类号： H04N5/44 ,  H04N5/445 ,  H04N21/422 ,  H04N21/485

CPC分类号： H04N5/4403 ,  H04N5/44513 ,  H04N21/42206 ,  H04N21/485 ,  H04N2005/4405

摘要： A display control apparatus connected to a display apparatus, which is remotely controllable through wireless communication, generates a first video/audio signal for displaying a first image on the display apparatus, and outputs the first video/audio signal to the display apparatus. Either of a first signal pattern indicative of a command to cause the first image based on the first video/audio signal to be displayed on the display apparatus or a second signal pattern indicative of a command to cause a second image based on a second video/audio signal, which is obtained from a device different from the display control apparatus, to be displayed on the display apparatus is selected, and a wireless signal of the selected signal pattern is outputted to the display apparatus through the wireless communication. Information determined based on the signal pattern of the outputted wireless signal is informed from an apparatus different from the display apparatus.

公开(公告)号：US20080291468A1

公开(公告)日：2008-11-27

申请号：US12068890

申请日：2008-02-13

申请人： Masanobu Sakata ,  Hideo Ishimori ,  Tetsuyuki Ogawa

发明人： Masanobu Sakata ,  Hideo Ishimori ,  Tetsuyuki Ogawa

IPC分类号： G01B11/02 ,  G01B11/24

CPC分类号： G01B11/0608 ,  H01L2224/117 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/3025 ,  H01L2224/0401

摘要： The height of protuberances present on the surface of a product, typically a bump wafer, can be measured with a high accuracy irrespective of the state of the upper surfaces of the protuberances. In the signal processor of a bump height measuring apparatus, a bump height measurement area setting section set a bump height measurement area by the bump layout information, a statistical application section averages the height data in an statistical calculation within the measurement area, a contour line calculating section calculates a contour line of a section of the bump, and a bump height determining section determines a peak value in the contour line as the height of the bump.

摘要翻译： 无论凸起的上表面的状态如何，都可以高精度地测量产品表面上的凸起的高度，通常是凸起晶片。 在凸块高度测量装置的信号处理器中，凸块高度测量区域设置部分通过凸块布局信息设置凸起高度测量区域，统计应用部分在测量区域内的统计计算中平均高度数据，等高线 计算部分计算凸块的一部分的轮廓线，并且凸块高度确定部分确定轮廓线中的峰值作为凸块的高度。