公开(公告)号：US06673304B2

公开(公告)日：2004-01-06

申请号：US10041484

申请日：2002-01-10

申请人： Daiji Ito ,  Shin Okumura ,  Akihiko Hosono ,  Kazuki Horita

发明人： Daiji Ito ,  Shin Okumura ,  Akihiko Hosono ,  Kazuki Horita

IPC分类号： C21D1100

CPC分类号： C21D9/14 ,  C21D1/10 ,  Y02P10/253

摘要： In a heat-treatment apparatus for heat-treating a V-type cylinder block (W) by induction heating, the block (W) is fixedly mounted on a work table (11) and set at a reference position thereon. A plurality of induction heating coils (23) are disposed in each of opposite sides of a base frame (10) of the work table (11) through Z tables (21), Y tables (18) and X tables (13). These tables (13, 18, 21) enable the heating coils (23) to enter and exit from the corresponding cylinder bores (Wn) of the block (W) in a direction in parallel with a longitudinal direction of the cylinder bores (Wn). The Z table (21) moves back and forth in parallel with the longitudinal direction of the cylinder bores (wn). The Y table moves back and forth in a direction perpendicular to the rows of the cylinder bores (Wn). The X table (13) moves back and forth in parallel with the rows of cylinder bores (Wn).

摘要翻译： 在通过感应加热对V型气缸体（W）进行热处理的热处理装置中，将块（W）固定地安装在工作台（11）上并设定在其上的基准位置。 多个感应加热线圈（23）通过Z台（21），Y台（18）和X台（13）设置在工作台（11）的基架（10）的每个相对侧中。 这些台（13,18,21）使得加热线圈（23）能够沿与气缸孔（Wn）的纵向方向平行的方向进入和离开块体（W）的相应气缸孔（Wn） 。 Z台（21）与缸孔（wn）的纵向方向平行移动。 Y台沿与缸孔（Wn）的行垂直的方向前后移动。 X台（13）与缸孔（Wn）的行平行移动。

公开(公告)号：US20130168141A1

公开(公告)日：2013-07-04

申请号：US13820758

申请日：2012-01-24

申请人： Junichi Hozumi ,  Takumi Taura ,  Shin Okumura ,  Tomohiro Nakatani ,  Ryo Tomoida

发明人： Junichi Hozumi ,  Takumi Taura ,  Shin Okumura ,  Tomohiro Nakatani ,  Ryo Tomoida

IPC分类号： H01L21/762 ,  H05K1/03

CPC分类号： H01L21/76251 ,  B81C1/00095 ,  B81C1/00301 ,  C03C15/00 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0834 ,  H01L21/486 ,  H01L23/057 ,  H01L23/10 ,  H01L23/15 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/1461 ,  H05K1/0306 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for producing a substrate with through-electrode includes the steps of: forming recesses or through-holes in either one of a silicon substrate and a glass substrate; forming protrusions in the other substrate; laying the silicon substrate and glass substrate on each other so that the protrusions are inserted in the respective recesses or through-holes; and bonding the silicon substrate and the glass substrate to each other.

摘要翻译： 用于制造具有贯通电极的基板的方法包括以下步骤：在硅基板和玻璃基板中的任一个中形成凹部或通孔; 在另一基板上形成突起; 将硅基板和玻璃基板彼此铺设，使得突起插入相应的凹部或通孔中; 并将硅衬底和玻璃衬底彼此接合。