摘要:
A test system including a package with switchable paths. The package may have conductive paths that are selected by switches. The electrically switchable conductive paths may yield increased data without significantly increasing the required testing hardware.
摘要:
A test system including a package with interconnect paths. The package may have electrical paths that are electrically connected by the interconnect paths. The electrically connected electrical paths may yield increased data without significantly increasing the required testing hardware.
摘要:
Apparatus, systems, and methods are provided for testing the integrity of electrical interconnections in electronic systems. Apparatus may be constructed by modifying a substrate designed for deployment in an end-use product by shorting together multiple contacts on one side of it. Such vehicles may be used to test the characteristics of interconnections between the vehicle and its support, the shorted contacts enabling testing of individual interconnects under both DC and AC conditions. A system for testing the interconnects may include the modified substrate, an input signal generator, and an output signal monitor.
摘要:
A test system including a package with switchable paths. The package may have conductive paths that are selected by switches. The electrically switchable conductive paths may yield increased data without significantly increasing the required testing hardware.
摘要:
A test system including a package with interconnect paths. The package may have electrical paths that are electrically connected by the interconnect paths. The electrically connected electrical paths may yield increased data without significantly increasing the required testing hardware.
摘要:
A system that detects multiple anomalies in a cluster of components is presented. During operation, the system monitors derivatives obtained from one or more inferential variables which are received from sensors in the cluster of components. The system then determines whether one or more components within the cluster have experienced an anomalous event based on the monitored derivatives. If so, the system performs one or more remedial actions.
摘要:
One embodiment provides a system that analyzes an electrical connection in a computer system. During operation, the system monitors a reflection coefficient associated with the electrical connection and applies a sequential-analysis technique to the reflection coefficient to determine a statistical deviation of the reflection coefficient. Next, the system assesses the integrity of the electrical connection based on the statistical deviation of the reflection coefficient. Finally, the system uses the assessed integrity to maintain the electrical connection.
摘要:
One embodiment of the present invention provides a system that determines the reliability of a component in a system. During operation, the system monitors inferential variables associated with a number of specimens of the component. The system then collects degradation data by first computing a likelihood value that indicates whether an inferential variable associated with a specimen of the component is behaving normally or abnormally. Next, the system determines whether the specimen of the component has degraded based on the likelihood value. If the specimen of the component is determined to have degraded, the system records the time when the specimen of the component was determined to have degraded. The system also uses the degradation data to determine the reliability of the component in the system.
摘要:
Some embodiments of the present invention provide a system for in-situ characterization of a solid-state light. First, a voltage and a current of the solid-state light source are monitored. Then, the health of the solid-state light source is characterized based on an analysis of the monitored voltage and current.
摘要:
One embodiment of the present invention provides a system that performs a real-time root-cause-analysis for a degradation event associated with a component under test. During operation, the system monitors a telemetry signal collected from the component, and while doing so, attempts to detect an anomaly in the telemetry signal. If an anomaly is detected in the telemetry signal, the system performs a failure analysis on the telemetry signal in real-time while the telemetry signal is degrading. Next, the system identifies a failure mechanism for the component based on the failure analysis.