公开(公告)号：US08500968B2

公开(公告)日：2013-08-06

申请号：US12856357

申请日：2010-08-13

申请人： Daniel J. Woodruff ,  Nolan L. Zimmerman ,  John L. Klocke ,  Klaus H. Pfeifer ,  Kyle M. Hanson ,  Matthew Herset

发明人： Daniel J. Woodruff ,  Nolan L. Zimmerman ,  John L. Klocke ,  Klaus H. Pfeifer ,  Kyle M. Hanson ,  Matthew Herset

IPC分类号： C25D17/00

CPC分类号： C25D17/001

摘要： An electroplating apparatus having improved contact deplating features includes a bowl assembly having a bowl for holding an electroplating solution. A head having a rotor including a contact ring and a head motor for rotating the rotor cooperates with the bowl assembly during plating operations. A lift/rotate actuator may be used to move the head to position a sector of the contact ring in a ring slot or opening of a deplating module. Since the deplating is performed within the deplating module, and not within the bowl assembly, the electroplating solution in the bowl assembly is not affected by the deplating process.

摘要翻译： 具有改进的接触脱落特征的电镀设备包括具有用于保持电镀溶液的碗的碗组件。 具有转子的头部包括接触环和用于使转子旋转的头马达在电镀操作期间与碗组件配合。 可以使用提升/旋转致动器来移动头部以将接触环的扇形部分定位在凹槽或凹槽模块的开口中。 由于脱模在脱模模块内进行，而不是在碗组件内进行，因此，碗组件中的电镀溶液不受脱铝过程的影响。

公开(公告)号：US20120037495A1

公开(公告)日：2012-02-16

申请号：US12856357

申请日：2010-08-13

申请人： Daniel J. Woodruff ,  Nolan L. Zimmerman ,  John L. Klocke ,  Klaus H. Pfeifer ,  Kyle M. Hanson

发明人： Daniel J. Woodruff ,  Nolan L. Zimmerman ,  John L. Klocke ,  Klaus H. Pfeifer ,  Kyle M. Hanson

IPC分类号： C25D17/10

CPC分类号： C25D17/001

摘要： An electroplating apparatus having improved contact deplating features includes a bowl assembly having a bowl for holding an electroplating solution. A head having a rotor including a contact ring and a head motor for rotating the rotor cooperates with the bowl assembly during plating operations. A lift/rotate actuator may be used to move the head to position a sector of the contact ring in a ring slot or opening of a deplating module. Since the deplating is performed within the deplating module, and not within the bowl assembly, the electroplating solution in the bowl assembly is not affected by the deplating process.

摘要翻译： 具有改进的接触脱落特征的电镀设备包括具有用于保持电镀溶液的碗的碗组件。 具有转子的头部包括接触环和用于使转子旋转的头马达在电镀操作期间与碗组件配合。 可以使用提升/旋转致动器来移动头部以将接触环的扇形部分定位在凹槽或凹槽模块的开口中。 由于脱模在脱模模块内进行，而不是在碗组件内进行，因此，碗组件中的电镀溶液不受脱铝过程的影响。