公开(公告)号：US08500968B2

公开(公告)日：2013-08-06

申请号：US12856357

申请日：2010-08-13

申请人： Daniel J. Woodruff ,  Nolan L. Zimmerman ,  John L. Klocke ,  Klaus H. Pfeifer ,  Kyle M. Hanson ,  Matthew Herset

发明人： Daniel J. Woodruff ,  Nolan L. Zimmerman ,  John L. Klocke ,  Klaus H. Pfeifer ,  Kyle M. Hanson ,  Matthew Herset

IPC分类号： C25D17/00

CPC分类号： C25D17/001

摘要： An electroplating apparatus having improved contact deplating features includes a bowl assembly having a bowl for holding an electroplating solution. A head having a rotor including a contact ring and a head motor for rotating the rotor cooperates with the bowl assembly during plating operations. A lift/rotate actuator may be used to move the head to position a sector of the contact ring in a ring slot or opening of a deplating module. Since the deplating is performed within the deplating module, and not within the bowl assembly, the electroplating solution in the bowl assembly is not affected by the deplating process.

摘要翻译： 具有改进的接触脱落特征的电镀设备包括具有用于保持电镀溶液的碗的碗组件。 具有转子的头部包括接触环和用于使转子旋转的头马达在电镀操作期间与碗组件配合。 可以使用提升/旋转致动器来移动头部以将接触环的扇形部分定位在凹槽或凹槽模块的开口中。 由于脱模在脱模模块内进行，而不是在碗组件内进行，因此，碗组件中的电镀溶液不受脱铝过程的影响。

公开(公告)号：US20080029123A1

公开(公告)日：2008-02-07

申请号：US11461938

申请日：2006-08-02

申请人： Brian Aegerter ,  Nolan L. Zimmerman ,  Chris Lee Gentry ,  Kyle M. Hanson

发明人： Brian Aegerter ,  Nolan L. Zimmerman ,  Chris Lee Gentry ,  Kyle M. Hanson

IPC分类号： B08B3/12 ,  B08B7/00 ,  B08B3/00

CPC分类号： H01L21/67051

摘要： A workpiece processor has a process chamber for holding a liquid. A sonic element, such as a megasonic transducer, is positioned to provide sonic energy into the liquid. A workpiece holder is moveable from a first position, wherein a workpiece is held immersed in the liquid, for sonic processing, to a second position where the workpiece is generally aligned with spray nozzles. Process liquids and gases may be sprayed or otherwise provided onto the workpiece, optionally while the workpiece is rotating within the process chamber. A process chamber gas or vapor exhaust assembly prevents escape of process gases or vapors from the processor. The processor can provide both sonic processing, as well as liquid and/or gas chemical processing.

摘要翻译： 工件处理器具有用于保持液体的处理室。 定位声音元件，例如兆声换能器，以向液体提供声能。 工件保持器可从第一位置移动，其中将工件浸入液体中进行声波处理，其中工件通常与喷嘴对准。 处理液体和气体可以喷涂或以其他方式提供到工件上，任选地，当工件在处理室内旋转时。 处理室气体或蒸汽排气组件防止处理气体或蒸汽从处理器逸出。 处理器可以提供声音处理以及液体和/或气体化学处理。

公开(公告)号：US20120037495A1

公开(公告)日：2012-02-16

申请号：US12856357

申请日：2010-08-13

申请人： Daniel J. Woodruff ,  Nolan L. Zimmerman ,  John L. Klocke ,  Klaus H. Pfeifer ,  Kyle M. Hanson

发明人： Daniel J. Woodruff ,  Nolan L. Zimmerman ,  John L. Klocke ,  Klaus H. Pfeifer ,  Kyle M. Hanson

IPC分类号： C25D17/10

CPC分类号： C25D17/001

摘要： An electroplating apparatus having improved contact deplating features includes a bowl assembly having a bowl for holding an electroplating solution. A head having a rotor including a contact ring and a head motor for rotating the rotor cooperates with the bowl assembly during plating operations. A lift/rotate actuator may be used to move the head to position a sector of the contact ring in a ring slot or opening of a deplating module. Since the deplating is performed within the deplating module, and not within the bowl assembly, the electroplating solution in the bowl assembly is not affected by the deplating process.

摘要翻译： 具有改进的接触脱落特征的电镀设备包括具有用于保持电镀溶液的碗的碗组件。 具有转子的头部包括接触环和用于使转子旋转的头马达在电镀操作期间与碗组件配合。 可以使用提升/旋转致动器来移动头部以将接触环的扇形部分定位在凹槽或凹槽模块的开口中。 由于脱模在脱模模块内进行，而不是在碗组件内进行，因此，碗组件中的电镀溶液不受脱铝过程的影响。

公开(公告)号：US20130306465A1

公开(公告)日：2013-11-21

申请号：US13474533

申请日：2012-05-17

申请人： Nolan L. Zimmerman ,  George Mattinger ,  Gregory J. Wilson ,  Eric A. Englhardt ,  Balamurugan Ramasamy

发明人： Nolan L. Zimmerman ,  George Mattinger ,  Gregory J. Wilson ,  Eric A. Englhardt ,  Balamurugan Ramasamy

IPC分类号： C25D17/00

CPC分类号： C25D17/004 ,  C25D17/001 ,  C25D17/002 ,  F16J15/00 ,  F16J15/025 ,  F16J15/16 ,  F16J15/3204 ,  F16J15/3236

摘要： A seal ring for an electrochemical processor does not slip or deflect laterally when pressed against a wafer surface. The seal ring may be on a rotor of the processor, with the seal ring having an outer wall joined to a tip arc through an end. The outer wall may be a straight wall. A relatively rigid support ring may be attached to the seal ring, to provide a more precise sealing dimension. Knife edge seal rings that slip or deflect laterally on the wafer surface may also be used. In these designs, the slipping is substantially uniform and consistent, resulting in improved performance.

摘要翻译： 用于电化学处理器的密封环在压在晶片表面上时不会横向滑动或偏转。 密封环可以在处理器的转子上，密封环具有通过端部连接到尖端弧的外壁。 外壁可以是直壁。 相对刚性的支撑环可以附接到密封环，以提供更精确的密封尺寸。 也可以使用在晶片表面上横向滑动或偏转的刀边缘密封环。 在这些设计中，滑动基本均匀且一致，从而提高了性能。

公开(公告)号：US07811422B2

公开(公告)日：2010-10-12

申请号：US11674912

申请日：2007-02-14

申请人： Nolan L. Zimmerman

发明人： Nolan L. Zimmerman

IPC分类号： C25D17/00

CPC分类号： C25D17/001 ,  C25D17/004 ,  C25D17/005 ,  C25D17/06

摘要： A wafer plating apparatus has a rotor in a head including wafer retainers which properly hold a wafer on the rotor in position. A seal on the head seals plating bath liquid away from the edges of the wafer. After plating is completed and the wafer is moved away from the seal, the wafer retainers prevent the wafer from sticking to the seal. The rotor may include a backing plate adapted to support a wafer during processing, with the wafer retainers pivotally attached to the backing plate. Movement of the backing plate relative to a seal may move the wafer retainers between open and closed or engaged positions.

摘要翻译： 晶片电镀装置具有在包括晶片保持器的头部中的转子，其适当地将转子上的晶片保持就位。 头上的密封件将电镀液体的液体密封离开晶片的边缘。 在电镀完成并且晶片从密封件移开之后，晶片固定器防止晶片粘到密封件上。 转子可以包括适于在加工期间支撑晶片的背板，其中晶片保持器可枢转地附接到背板。 背板相对于密封件的移动可以使晶片保持器在打开和关闭或接合位置之间移动。

公开(公告)号：US20080190757A1

公开(公告)日：2008-08-14

申请号：US11674912

申请日：2007-02-14

申请人： Nolan L. Zimmerman

发明人： Nolan L. Zimmerman

IPC分类号： C25D3/00

CPC分类号： C25D17/001 ,  C25D17/004 ,  C25D17/005 ,  C25D17/06

摘要： A wafer plating apparatus has a rotor in a head including wafer retainers which properly hold a wafer on the rotor in position. A seal on the head seals plating bath liquid away from the edges of the wafer. After plating is completed and the wafer is moved away from the seal, the wafer retainers prevent the wafer from sticking to the seal. The rotor may include a backing plate adapted to support a wafer during processing, with the wafer retainers pivotally attached to the backing plate. Movement of the backing plate relative to a seal may move the wafer retainers between open and closed or engaged positions.

摘要翻译： 晶片电镀装置具有在包括晶片保持器的头部中的转子，其适当地将转子上的晶片保持就位。 头上的密封件将电镀液体的液体密封离开晶片的边缘。 在电镀完成并且晶片从密封件移开之后，晶片固定器防止晶片粘到密封件上。 转子可以包括适于在加工期间支撑晶片的背板，其中晶片保持器可枢转地附接到背板。 背板相对于密封件的移动可以使晶片保持器在打开和关闭或接合位置之间移动。