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公开(公告)号：US20120037495A1
公开(公告)日：2012-02-16
申请号：US12856357
申请日：2010-08-13
IPC分类号： C25D17/10
CPC分类号： C25D17/001
摘要： An electroplating apparatus having improved contact deplating features includes a bowl assembly having a bowl for holding an electroplating solution. A head having a rotor including a contact ring and a head motor for rotating the rotor cooperates with the bowl assembly during plating operations. A lift/rotate actuator may be used to move the head to position a sector of the contact ring in a ring slot or opening of a deplating module. Since the deplating is performed within the deplating module, and not within the bowl assembly, the electroplating solution in the bowl assembly is not affected by the deplating process.
摘要翻译： 具有改进的接触脱落特征的电镀设备包括具有用于保持电镀溶液的碗的碗组件。 具有转子的头部包括接触环和用于使转子旋转的头马达在电镀操作期间与碗组件配合。 可以使用提升/旋转致动器来移动头部以将接触环的扇形部分定位在凹槽或凹槽模块的开口中。 由于脱模在脱模模块内进行，而不是在碗组件内进行，因此，碗组件中的电镀溶液不受脱铝过程的影响。
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公开(公告)号：US08500968B2
公开(公告)日：2013-08-06
申请号：US12856357
申请日：2010-08-13
申请人： Daniel J. Woodruff , Nolan L. Zimmerman , John L. Klocke , Klaus H. Pfeifer , Kyle M. Hanson , Matthew Herset
发明人： Daniel J. Woodruff , Nolan L. Zimmerman , John L. Klocke , Klaus H. Pfeifer , Kyle M. Hanson , Matthew Herset
IPC分类号： C25D17/00
CPC分类号： C25D17/001
摘要： An electroplating apparatus having improved contact deplating features includes a bowl assembly having a bowl for holding an electroplating solution. A head having a rotor including a contact ring and a head motor for rotating the rotor cooperates with the bowl assembly during plating operations. A lift/rotate actuator may be used to move the head to position a sector of the contact ring in a ring slot or opening of a deplating module. Since the deplating is performed within the deplating module, and not within the bowl assembly, the electroplating solution in the bowl assembly is not affected by the deplating process.
摘要翻译： 具有改进的接触脱落特征的电镀设备包括具有用于保持电镀溶液的碗的碗组件。 具有转子的头部包括接触环和用于使转子旋转的头马达在电镀操作期间与碗组件配合。 可以使用提升/旋转致动器来移动头部以将接触环的扇形部分定位在凹槽或凹槽模块的开口中。 由于脱模在脱模模块内进行，而不是在碗组件内进行，因此，碗组件中的电镀溶液不受脱铝过程的影响。
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公开(公告)号：US07357850B2
公开(公告)日：2008-04-15
申请号：US10234638
申请日：2002-09-03
申请人： Daniel J. Woodruff , Kyle M. Hanson
发明人： Daniel J. Woodruff , Kyle M. Hanson
CPC分类号： C25D17/12 , C25D7/123 , C25D17/001
摘要： An electroplating apparatus includes a reactor vessel having a segmented anode array positioned therein for effecting electroplating of an associated workpiece such as a semiconductor wafer. The anode array includes a plurality of ring-like anode segments which are preferably positioned in concentric, coplanar relationship with each other. The anode segments can be independently operated to create varying electrical potentials with the associated workpiece to promote uniform deposition of electroplated metal on the surface of the workpiece.
摘要翻译： 电镀设备包括反应器容器，其具有定位在其中的分段阳极阵列，用于实现诸如半导体晶片的相关工件的电镀。 阳极阵列包括多个环形阳极段，其优选地彼此以同心的，共面的关系定位。 阳极段可以独立地操作以产生与相关联的工件的变化的电势，以促进电镀金属在工件表面上的均匀沉积。
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公开(公告)号：US06645356B1
公开(公告)日：2003-11-11
申请号：US09386558
申请日：1999-08-31
申请人： Daniel J. Woodruff , Kyle M. Hanson , Thomas H. Oberlitner , LinLin Chen , John M. Pedersen , Vladimir Zila
发明人： Daniel J. Woodruff , Kyle M. Hanson , Thomas H. Oberlitner , LinLin Chen , John M. Pedersen , Vladimir Zila
IPC分类号： C25D1700
CPC分类号： C25D17/001 , C25D7/123
摘要： A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution. In one embodiment, the plurality of contacts are in the form of discrete flexures while in another embodiment the plurality of contacts are in the form of a Belleville ring contact. A flow path may be provided in the contact assembly for providing a purging gas to the plurality of contacts and the peripheral edge of the workpiece. The purging gas may be used to assist in the formation of the barrier of the contact assembly. A combined electroplating/electroless plating tool and method are also set forth.
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公开(公告)号：US07909967B2
公开(公告)日：2011-03-22
申请号：US11457192
申请日：2006-07-13
申请人： Daniel J. Woodruff , Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , Erik Lund , Steven L. Peace
发明人： Daniel J. Woodruff , Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , Erik Lund , Steven L. Peace
IPC分类号： C25F7/00
CPC分类号： C25F7/00
摘要： An electro-chemical processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The first seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The first electrode may move along with the first seal. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.
摘要翻译： 用于制造多孔硅或处理其它衬底的电化学处理器具有第一和第二室组件。 第一和第二室组件包括分别用于密封晶片的第一和第二密封件以及第一和第二电极。 第一密封件可朝向和远离处理器中的晶片移动，以在晶片装载/卸载位置与晶片工艺位置之间移动。 第一电极可以与第一密封件一起移动。 处理器可以从用于加载和卸载晶片的基本上水平的方向枢转到基本垂直的取向，用于处理晶片。
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公开(公告)号：US20080048306A1
公开(公告)日：2008-02-28
申请号：US11467232
申请日：2006-08-25
申请人： Nigel Stewart , Daniel J. Woodruff , Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , Erik Lund , Steven L. Peace
发明人： Nigel Stewart , Daniel J. Woodruff , Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , Erik Lund , Steven L. Peace
IPC分类号： H01L23/06
CPC分类号： H01L21/6719 , H01L21/67115 , H01L21/67126
摘要： A processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The second seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The second electrode may move with the second seal. A light source shines light onto the first side of the wafer. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.
摘要翻译： 用于制造多孔硅或处理其它衬底的处理器具有第一和第二室组件。 第一和第二室组件包括分别用于密封晶片的第一和第二密封件以及第一和第二电极。 第二密封件可朝向和远离处理器中的晶片移动，以在晶片装载/卸载位置与晶片工艺位置之间移动。 第二电极可以与第二密封件一起移动。 光源将光照射到晶片的第一面上。 处理器可以从用于加载和卸载晶片的基本上水平的方向枢转到基本垂直的取向，用于处理晶片。
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公开(公告)号：US06428660B2
公开(公告)日：2002-08-06
申请号：US09811379
申请日：2001-03-15
申请人： Daniel J. Woodruff , Kyle M. Hanson
发明人： Daniel J. Woodruff , Kyle M. Hanson
IPC分类号： C28D1700
CPC分类号： C25D17/001 , C25D5/08 , C25D7/123 , C25D17/06
摘要： An improved anode, cup and conductor assembly for a reactor vessel includes an anode assembly supported within a cup which holds a supply of process fluid. The cup is supported around its perimeter within the reactor vessel. The anode assembly has an anode shield carrying an anode, the anode shield having upwardly extending brackets with radially extending members. A diffusion plate is supported above the anode by the anode brackets using first bayonet connections. The anode shield and the anode are supported from below by a delivery tube which also serves to deliver process fluid to the cup. A second bayonet connection is provided between a top portion of the delivery tube and the anode assembly. The fluid delivery tube has a fixed height within the vessel. The anode elevation is adjusted by the interposing of a spacer of desired thickness between the anode and the tube. An electrical conductor is connected to the anode, and passes through the tube to be electrically accessible outside the vessel. The conductor is connected to the anode with a plug-in connection which is completed when the tube is coupled to the anode by the second bayonet connection. A spring loaded bellows seal and a corrugated sleeve seal the electrical conductor from the anode, through the delivery tube, and to the outside electrical accessibility. The diffusion plate and the anode assembly are installable and removable from a top side of the reactor vessel using a tool which is lockable to the diffusion plate or to the anode. The tool provides a handle for manual engagement or disengagement of the first and second bayonet connections.
摘要翻译： 用于反应器容器的改进的阳极，杯和导体组件包括支撑在保持供给工艺流体的杯内的阳极组件。 杯子围绕反应堆容器内的周边支撑。 阳极组件具有承载阳极的阳极屏蔽件，阳极屏蔽件具有向上延伸的具有径向延伸构件的托架。 扩散板通过第一个卡口连接由阳极支架支撑在阳极的上方。 阳极护罩和阳极从下方被输送管支撑，输送管也用于将工艺流体输送到杯子。 在输送管的顶部和阳极组件之间设置第二卡口连接。 流体输送管在容器内具有固定的高度。 通过在阳极和管之间插入所需厚度的间隔物来调节阳极高度。 电导体连接到阳极，并且通过管以在电容器外部电可通达。 导体通过插入式连接方式连接到阳极，该插入式连接在管通过第二卡口连接与阳极连接时完成。 弹簧加载的波纹管密封件和波纹套筒将电导体从阳极密封，通过输送管和外部电气可接近性。 扩散板和阳极组件可以使用可被锁定到扩散板或阳极的工具从反应器容器的顶侧安装和移除。 该工具提供用于手动接合或解除第一和第二卡口连接的手柄。
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公开(公告)号：US07147760B2
公开(公告)日：2006-12-12
申请号：US10974083
申请日：2004-10-27
申请人： Daniel J. Woodruff , Kyle M. Hanson
发明人： Daniel J. Woodruff , Kyle M. Hanson
CPC分类号： C25D17/12 , C25D7/123 , C25D17/001
摘要： An electroplating apparatus includes a reactor vessel having a segmented anode array positioned therein for effecting electroplating of an associated workpiece such as a semiconductor wafer. The anode array includes a plurality of ring-like anode segments which are preferably positioned in concentric, coplanar relationship with each other. The anode segments can be independently operated to create varying electrical potentials with the associated workpiece to promote uniform deposition of electroplated metal on the surface of the workpiece.
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公开(公告)号：US07118658B2
公开(公告)日：2006-10-10
申请号：US10154426
申请日：2002-05-21
申请人： Daniel J. Woodruff , Kyle M. Hanson
发明人： Daniel J. Woodruff , Kyle M. Hanson
CPC分类号： C25D17/001 , C25D7/123 , C25D17/06
摘要： A reactor for electroplating a workpiece includes a vessel having a ring contact arranged to support a workpiece in a horizontal orientation. In an embodiment of the invention, an electrode is arranged below the ring contact, and a pressing member is arranged above the ring contact to press a workpiece into electrical engagement with the ring contact. The vessel may be adapted to contain an electroplating fluid between a top of the ring contact and the electrode. In one embodiment, a movable intermediate workpiece support assembly is carried by the vessel, the support assembly being actuatable to lower a workpiece carried thereby to deliver the workpiece to be supported accurately and precisely on the ring contact.
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公开(公告)号：US06916412B2
公开(公告)日：2005-07-12
申请号：US09875365
申请日：2001-06-05
CPC分类号： H01L21/6723 , C25D7/123 , C25D17/001 , C25D17/10 , H01L21/6719 , H01L21/67751
摘要： An electrochemical processing chamber which can be modified for treating different workpieces and methods for so modifying electrochemical processing chambers. In one particular embodiment, an electrochemical processing chamber 200 includes a plurality of walls 510 defining a plurality of electrode compartments 520, each electrode compartment having at least one electrode 600 therein, and a virtual electrode unit 530 defining a plurality of flow conduits, with at least one of the flow conduits being in fluid communication with each of the electrode compartments. This first virtual electrode unit 530 may be exchanged for a second virtual electrode unit 540, without modification of any of the electrodes 600, to adapt the processing chamber 200 for treating a different workpiece.
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