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公开(公告)号：US08500968B2
公开(公告)日：2013-08-06
申请号：US12856357
申请日：2010-08-13
申请人： Daniel J. Woodruff , Nolan L. Zimmerman , John L. Klocke , Klaus H. Pfeifer , Kyle M. Hanson , Matthew Herset
发明人： Daniel J. Woodruff , Nolan L. Zimmerman , John L. Klocke , Klaus H. Pfeifer , Kyle M. Hanson , Matthew Herset
IPC分类号： C25D17/00
CPC分类号： C25D17/001
摘要： An electroplating apparatus having improved contact deplating features includes a bowl assembly having a bowl for holding an electroplating solution. A head having a rotor including a contact ring and a head motor for rotating the rotor cooperates with the bowl assembly during plating operations. A lift/rotate actuator may be used to move the head to position a sector of the contact ring in a ring slot or opening of a deplating module. Since the deplating is performed within the deplating module, and not within the bowl assembly, the electroplating solution in the bowl assembly is not affected by the deplating process.
摘要翻译： 具有改进的接触脱落特征的电镀设备包括具有用于保持电镀溶液的碗的碗组件。 具有转子的头部包括接触环和用于使转子旋转的头马达在电镀操作期间与碗组件配合。 可以使用提升/旋转致动器来移动头部以将接触环的扇形部分定位在凹槽或凹槽模块的开口中。 由于脱模在脱模模块内进行，而不是在碗组件内进行，因此，碗组件中的电镀溶液不受脱铝过程的影响。
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公开(公告)号：US20120037495A1
公开(公告)日：2012-02-16
申请号：US12856357
申请日：2010-08-13
IPC分类号： C25D17/10
CPC分类号： C25D17/001
摘要： An electroplating apparatus having improved contact deplating features includes a bowl assembly having a bowl for holding an electroplating solution. A head having a rotor including a contact ring and a head motor for rotating the rotor cooperates with the bowl assembly during plating operations. A lift/rotate actuator may be used to move the head to position a sector of the contact ring in a ring slot or opening of a deplating module. Since the deplating is performed within the deplating module, and not within the bowl assembly, the electroplating solution in the bowl assembly is not affected by the deplating process.
摘要翻译： 具有改进的接触脱落特征的电镀设备包括具有用于保持电镀溶液的碗的碗组件。 具有转子的头部包括接触环和用于使转子旋转的头马达在电镀操作期间与碗组件配合。 可以使用提升/旋转致动器来移动头部以将接触环的扇形部分定位在凹槽或凹槽模块的开口中。 由于脱模在脱模模块内进行，而不是在碗组件内进行，因此，碗组件中的电镀溶液不受脱铝过程的影响。
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公开(公告)号：US20080029123A1
公开(公告)日：2008-02-07
申请号：US11461938
申请日：2006-08-02
CPC分类号： H01L21/67051
摘要： A workpiece processor has a process chamber for holding a liquid. A sonic element, such as a megasonic transducer, is positioned to provide sonic energy into the liquid. A workpiece holder is moveable from a first position, wherein a workpiece is held immersed in the liquid, for sonic processing, to a second position where the workpiece is generally aligned with spray nozzles. Process liquids and gases may be sprayed or otherwise provided onto the workpiece, optionally while the workpiece is rotating within the process chamber. A process chamber gas or vapor exhaust assembly prevents escape of process gases or vapors from the processor. The processor can provide both sonic processing, as well as liquid and/or gas chemical processing.
摘要翻译： 工件处理器具有用于保持液体的处理室。 定位声音元件，例如兆声换能器，以向液体提供声能。 工件保持器可从第一位置移动，其中将工件浸入液体中进行声波处理，其中工件通常与喷嘴对准。 处理液体和气体可以喷涂或以其他方式提供到工件上，任选地，当工件在处理室内旋转时。 处理室气体或蒸汽排气组件防止处理气体或蒸汽从处理器逸出。 处理器可以提供声音处理以及液体和/或气体化学处理。
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公开(公告)号：US07585398B2
公开(公告)日：2009-09-08
申请号：US10861899
申请日：2004-06-03
申请人： Kyle M. Hanson , John L. Klocke
发明人： Kyle M. Hanson , John L. Klocke
CPC分类号： C25D17/002 , C25D3/02 , C25D3/38 , C25D7/123 , C25D17/001 , C25D17/008 , C25F7/00
摘要： Chambers, systems, and methods for electrochemically processing microfeature workpieces are disclosed herein. In one embodiment, an electrochemical deposition chamber includes a processing unit having a first flow system configured to convey a flow of a first processing fluid to a microfeature workpiece. The chamber further includes an electrode unit having an electrode and a second flow system configured to convey a flow of a second processing fluid at least proximate to the electrode. The chamber further includes a nonporous barrier between the processing unit and the electrode unit to separate the first and second processing fluids. The nonporous barrier is configured to allow cations or anions to flow through the barrier between the first and second processing fluids.
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公开(公告)号：US07169280B2
公开(公告)日：2007-01-30
申请号：US10234637
申请日：2002-09-03
申请人： John L. Klocke , Kyle M. Hanson
发明人： John L. Klocke , Kyle M. Hanson
摘要： The present invention provides a system that enables the use of electrophoretic resists in the microfabrication industry for the production of microelectronic devices and is of sufficiently high quality to be used as a replacement for, or supplement to, current photoresist deposition technology. This system enables the application of electrophoretic resists in automated equipment that meets the standards for cleanliness and production throughput desired by the microelectronic fabrication industry. The system, apparatus and method, for providing electrophoretic resist (“EPR”) layers on microelectronic workpieces for the microfabrication of microelectronic devices comprises a deposition station for receiving a microelectronic workpiece and depositing a layer of electrophoretic photoresist (EPR) thereon, a workpiece handling apparatus, and a control unit coupled to the workpiece handling apparatus and the deposition station for coordinating the processing of the workpiece in accordance with a predetermined sequence and set of processing parameters.
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公开(公告)号：US07150816B2
公开(公告)日：2006-12-19
申请号：US10234982
申请日：2002-09-03
申请人： John L. Klocke , Kyle M. Hanson
发明人： John L. Klocke , Kyle M. Hanson
摘要： The present invention provides a system that enables the use of electrophoretic resists in the microfabrication industry for the production of microelectronic devices and is of sufficiently high quality to be used as a replacement for, or supplement to, current photoresist deposition technology. This system enables the application of electrophoretic resists in automated equipment that meets the standards for cleanliness and production throughput desired by the microelectronic fabrication industry. The system, apparatus and method, for providing electrophoretic resist (“EPR”) layers on microelectronic workpieces for the microfabrication of microelectronic devices comprises a deposition station for receiving a microelectronic workpiece and depositing a layer of electrophoretic photoresist (EPR) thereon, a workpiece handling apparatus, and a control unit coupled to the workpiece handling apparatus and the deposition station for coordinating the processing of the workpiece in accordance with a predetermined sequence and set of processing parameters.
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公开(公告)号：US08961771B2
公开(公告)日：2015-02-24
申请号：US13559494
申请日：2012-07-26
申请人： Rajesh Baskaran , Robert W. Batz, Jr. , Bioh Kim , Tom L. Ritzdorf , John L. Klocke , Kyle M. Hanson
发明人： Rajesh Baskaran , Robert W. Batz, Jr. , Bioh Kim , Tom L. Ritzdorf , John L. Klocke , Kyle M. Hanson
CPC分类号： C25D7/12 , C25D5/00 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/02 , C25D21/12
摘要： Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.
摘要翻译： 描述了利用第一处理流体和阳极电解处理微特征工件的工艺和系统。 使用第一处理流体，阳极，第二处理流体和阳离子可渗透阻挡层对微特征工件进行电解处理。 阳离子可渗透阻隔层将第一处理流体与第二处理流体分离，同时允许某些阳离子物质在两种流体之间转移。 所描述的方法在反复电镀循环中产生沉积物，其在所需范围内具有沉积性质（例如电阻率）。
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公开(公告)号：US20120292194A1
公开(公告)日：2012-11-22
申请号：US13559494
申请日：2012-07-26
申请人： Rajesh Baskaran , Robert W. Batz, JR. , Bioh Kim , Tom L. Ritzdorf , John L. Klocke , Kyle M. Hanson
发明人： Rajesh Baskaran , Robert W. Batz, JR. , Bioh Kim , Tom L. Ritzdorf , John L. Klocke , Kyle M. Hanson
IPC分类号： C25D5/02
CPC分类号： C25D7/12 , C25D5/00 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/02 , C25D21/12
摘要： Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.
摘要翻译： 描述了利用第一处理流体和阳极电解处理微特征工件的工艺和系统。 使用第一处理流体，阳极，第二处理流体和阳离子可渗透阻挡层对微特征工件进行电解处理。 阳离子可渗透阻隔层将第一处理流体与第二处理流体分离，同时允许某些阳离子物质在两种流体之间转移。 所描述的方法在反复电镀循环中产生沉积物，其在所需范围内具有沉积性质（例如电阻率）。
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公开(公告)号：US08236159B2
公开(公告)日：2012-08-07
申请号：US11414145
申请日：2006-04-28
申请人： Rajesh Baskaran , Robert W. Batz, Jr. , Bioh Kim , Tom L. Ritzdorf , John L. Klocke , Kyle M. Hanson
发明人： Rajesh Baskaran , Robert W. Batz, Jr. , Bioh Kim , Tom L. Ritzdorf , John L. Klocke , Kyle M. Hanson
CPC分类号： C25D7/12 , C25D5/00 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/02 , C25D21/12
摘要： Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.
摘要翻译： 描述了利用第一处理流体和阳极电解处理微特征工件的工艺和系统。 使用第一处理流体，阳极，第二处理流体和阳离子可渗透阻挡层对微特征工件进行电解处理。 阳离子可渗透阻隔层将第一处理流体与第二处理流体分离，同时允许某些阳离子物质在两种流体之间转移。 所描述的方法在反复电镀循环中产生沉积物，其在所需范围内具有沉积性质（例如电阻率）。
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公开(公告)号：US07909967B2
公开(公告)日：2011-03-22
申请号：US11457192
申请日：2006-07-13
申请人： Daniel J. Woodruff , Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , Erik Lund , Steven L. Peace
发明人： Daniel J. Woodruff , Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , Erik Lund , Steven L. Peace
IPC分类号： C25F7/00
CPC分类号： C25F7/00
摘要： An electro-chemical processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The first seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The first electrode may move along with the first seal. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.
摘要翻译： 用于制造多孔硅或处理其它衬底的电化学处理器具有第一和第二室组件。 第一和第二室组件包括分别用于密封晶片的第一和第二密封件以及第一和第二电极。 第一密封件可朝向和远离处理器中的晶片移动，以在晶片装载/卸载位置与晶片工艺位置之间移动。 第一电极可以与第一密封件一起移动。 处理器可以从用于加载和卸载晶片的基本上水平的方向枢转到基本垂直的取向，用于处理晶片。
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