公开(公告)号：US20050127502A1

公开(公告)日：2005-06-16

申请号：US10737496

申请日：2003-12-16

申请人： Daniel Lee ,  Chender Huang ,  C. H. Lee

发明人： Daniel Lee ,  Chender Huang ,  C. H. Lee

IPC分类号： H01L23/34 ,  H01L23/36 ,  H01L23/373

CPC分类号： H01L23/36 ,  H01L23/3735 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/16195

摘要： A microelectronic package comprising a device substrate having first and second opposing surfaces and comprising a plurality of microelectronic devices. The microelectronic package also includes a plurality of electrically conductive members coupled to corresponding ones of the plurality of microelectronics device and extending away from the first surface. A thermally conductive layer is located on the second surface of the device substrate, and a package substrate is coupled to the device substrate, the package substrate having a plurality of electrically conductive traces coupled to corresponding ones of the plurality of electrically conductive members.

摘要翻译： 一种微电子封装，其包括具有第一和第二相对表面并且包括多个微电子器件的器件衬底。 微电子封装还包括耦合到多个微电子器件中的相应微电子器件并且远离第一表面延伸的多个导电构件。 导热层位于器件衬底的第二表面上，并且封装衬底耦合到器件衬底，封装衬底具有耦合到多个导电构件中的相应导电构件的多个导电迹线。

公开(公告)号：US5746462A

公开(公告)日：1998-05-05

申请号：US764327

申请日：1996-12-12

申请人： C. H. Lee ,  Y. H. Chen

发明人： C. H. Lee ,  Y. H. Chen

IPC分类号： B25J1/02 ,  B25J15/06 ,  H01L21/683

CPC分类号： B25J1/02 ,  B25J15/0616 ,  H01L21/6838 ,  Y10T29/53191

摘要： The present invention discloses a flexible vacuum pick-up device for use in wafer processing that includes a handle portion adapted for holding by a human hand, the handle portion has a passage therein for fluid communication, a flexible conduit for providing a connection between the handle portion and a pick-up head and for providing a vacuum passage therethrough, and a vacuum pick-up head that has an extended planar surface adapted for making intimate contact with a substantially flat wafer.

摘要翻译： 本发明公开了一种用于晶片加工的柔性真空吸盘装置，其包括适于由人手保持的把手部分，手柄部分具有用于流体连通的通道，用于提供手柄之间的连接的柔性导管 部分和拾取头并用于提供通过其的真空通道，以及真空拾取头，其具有适于与基本上平坦的晶片紧密接触的延伸平面。